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Design, Test, Integration, and Packaging of MEMS/MOEMS最新文献

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Design and realization of a penny-shaped micromotor 一种硬币型微电机的设计与实现
Design, Test, Integration, and Packaging of MEMS/MOEMS Pub Date : 1999-03-10 DOI: 10.1117/12.341250
M. Nienhaus, W. Ehrfeld, H. Stoelting, F. Michel, S. Kleen, S. Hardt, F. Schmitz, T. Stange
{"title":"Design and realization of a penny-shaped micromotor","authors":"M. Nienhaus, W. Ehrfeld, H. Stoelting, F. Michel, S. Kleen, S. Hardt, F. Schmitz, T. Stange","doi":"10.1117/12.341250","DOIUrl":"https://doi.org/10.1117/12.341250","url":null,"abstract":"For many applications in rapid growing markets of microproducts, e.g. miniaturized hard disk drives in personal computers, mobile optical scanners, or for the market of consumer electronics, a novel, penny-shaped micromotor was developed at IMM. Designed to provide an output torque of more than 100 (mu) Nm, the permanent magnet motor shows a diameter of 12.8 mm and a height of 1.4mm. Besides the maximum torque and the ultra-flat shape, one further essential design parameter was a construction that allows an easy assembly and is suitable for mass-production. An important contribution to mass production philosophy is the intensive use of microfabrication technologies especially for both, the production of the permanent magnet rings by micro molding and micro compressing techniques and the micro coils by the way of photolithographic batch processes.","PeriodicalId":318748,"journal":{"name":"Design, Test, Integration, and Packaging of MEMS/MOEMS","volume":"155 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1999-03-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122159039","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 17
New method to design halftone mask for the fabrication of continuous microrelief structure 为制造连续微浮雕结构设计半色调掩模的新方法
Design, Test, Integration, and Packaging of MEMS/MOEMS Pub Date : 1999-03-10 DOI: 10.1117/12.341286
Jing-qin Su, Jinglei Du, Jun Yao, Fuhua Gao, Yongkang Guo, Z. Cui
{"title":"New method to design halftone mask for the fabrication of continuous microrelief structure","authors":"Jing-qin Su, Jinglei Du, Jun Yao, Fuhua Gao, Yongkang Guo, Z. Cui","doi":"10.1117/12.341286","DOIUrl":"https://doi.org/10.1117/12.341286","url":null,"abstract":"A new method is proposed to design gray-tone masks for fabrication of surface relief microstructures. Unlike previous methods which modulate the light intensity by changing the cell size or cell pitch only, the method relays on adjusting both the shape and position of a cell which gives an extra freedom to control the design accuracy. Using the new method a gray-tone mask has been designed to produce a hemispherical shape relief structure. Based on the theory of partial coherent light and the resist development model, the intensity distribution through the gray-tone mask and exposure of photoresist have been simulated. Nonlinear effects in aerial image and resist development have been taken into account to correct the mask design. The accuracy of the gray-tone mask design has been confirmed by simulation of 3D resist profiles.","PeriodicalId":318748,"journal":{"name":"Design, Test, Integration, and Packaging of MEMS/MOEMS","volume":"5 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1999-03-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128368581","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 9
Silicon UV flame detector utilizing photonic crystals 利用光子晶体的硅紫外火焰探测器
Design, Test, Integration, and Packaging of MEMS/MOEMS Pub Date : 1999-03-10 DOI: 10.1117/12.341251
Z. Djuric, T. Dankovic, Z. Jakšić, D. Randjelović, R. Petrovic, W. Ehrfeld, A. Schmidt, K. Hecker
{"title":"Silicon UV flame detector utilizing photonic crystals","authors":"Z. Djuric, T. Dankovic, Z. Jakšić, D. Randjelović, R. Petrovic, W. Ehrfeld, A. Schmidt, K. Hecker","doi":"10.1117/12.341251","DOIUrl":"https://doi.org/10.1117/12.341251","url":null,"abstract":"In this paper we propose a silicon UV flame detector for combustion systems. In gas burners the relative intensity of flame radiation is dominant in the UV region. In the visible and IR regions the relative intensity of radiation of the incandescent surfaces is several orders of magnitude greater than the gas flame radiation intensity. Therefore it is required that the flame detector has a much greater sensitivity in the UV region. The propose detector is formed on n-type silicon on isolator wafer. In order to suppress sensitivity in the visible and the IR regions, the absorption region of the detector is greatly reduced, and a UV filter utilizing photonic crystal is designed. The p-n junctions are formed by very shallow diffusion of impurities. The contacts are made after the deposition of a thin oxide layer. The UV filter is then sputtered on the detector surface. The filter consists of a thin silver film, and a 1D photonic crystal made of twelve pairs of NaF/Y2O3 layers. The photonic band gaps of the crystal should suppress the propagation of the light with wavelengths greater than 0.35 micrometers . For the detector active area of 5 mm2, the thickness of the silver layer of 0.13 micrometers and a dark current of 1 nA, the noise equivalent power at 0.32 micrometers is 4.23 10-13 W/Hz1/2. The calculated flame signal to total signal ratio is 0.52.","PeriodicalId":318748,"journal":{"name":"Design, Test, Integration, and Packaging of MEMS/MOEMS","volume":"3680 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1999-03-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129124215","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 12
Optical microsystems with microchip lasers and micro-optics 带有微芯片激光器和微光学的光学微系统
Design, Test, Integration, and Packaging of MEMS/MOEMS Pub Date : 1999-03-10 DOI: 10.1117/12.341257
L. Fulbert, E. Molva, J. Marty, P. Thony, M. Rabarot, B. Ferrand
{"title":"Optical microsystems with microchip lasers and micro-optics","authors":"L. Fulbert, E. Molva, J. Marty, P. Thony, M. Rabarot, B. Ferrand","doi":"10.1117/12.341257","DOIUrl":"https://doi.org/10.1117/12.341257","url":null,"abstract":"The microchip laser is the most compact and the simplest diode pumped solid state laser, with a typical dimension of 0.5 mm3. In spite of the extreme simplicity of this concept which was described in sixties, the first devices have been realized much later in eighties, in different laboratories in the world. The main advantage of the microchip laser is its ability to be fabricated with collective fabrication processes, using techniques such as currently used in microelectronics, allowing a low cost mass production with a good reproducibility and reliability. The microchip lasers are very simple to use without any optical alignment and any maintenance. They foretell a true technical revolution in the domain of solid state lasers which should be opened to high volume and low cost markets. They have many different industrial applications in large markets such as: automotive, laser marking and material processing, environmental and medical applications, public works, telecommunications, etc.","PeriodicalId":318748,"journal":{"name":"Design, Test, Integration, and Packaging of MEMS/MOEMS","volume":"81 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1999-03-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129125345","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Fatigue test of thin film materials on a silicon chip using resonating loading system 用谐振加载系统对硅片上薄膜材料进行疲劳试验
Design, Test, Integration, and Packaging of MEMS/MOEMS Pub Date : 1999-03-10 DOI: 10.1117/12.341166
T. Ando, T. Yoshioka, M. Shikida, Kazuo Sato
{"title":"Fatigue test of thin film materials on a silicon chip using resonating loading system","authors":"T. Ando, T. Yoshioka, M. Shikida, Kazuo Sato","doi":"10.1117/12.341166","DOIUrl":"https://doi.org/10.1117/12.341166","url":null,"abstract":"We investigated a new method of measuring fatigue characteristics of thin films under uniaxial loading conditions. A specimen and loading system are integrated on a same silicon ship. The size of the chip is 12 by 12 by 0.4 mm, and of the specimen 400 by 80 by 7 micrometers . Accuracy of the stress and strain measurement using the proposed loading system was proved by our previous work under static conditions. In this paper, high frequency of tensile stress was applied to the specimen by resonant mode of vibration of the loading mechanism. The loading system vibrated at the first mode resonant frequency. To vibrate the loading system, the chip was mounted on a PZT actuator, and driven by a pulse generator. The amplitude of the applied strain was measured by observing a laser reflection on the vibrating lever of the loading system, while the wave from and the vibration cycle were monitoring by an oscilloscope. The resonant frequency of the chip was 4-5 kHz.","PeriodicalId":318748,"journal":{"name":"Design, Test, Integration, and Packaging of MEMS/MOEMS","volume":"38 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1999-03-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114727976","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Optical fiber switching device with active alignment 主动对准的光纤开关装置
Design, Test, Integration, and Packaging of MEMS/MOEMS Pub Date : 1999-03-10 DOI: 10.1117/12.341275
Y. Peter, H. Herzig, S. Bottinelli
{"title":"Optical fiber switching device with active alignment","authors":"Y. Peter, H. Herzig, S. Bottinelli","doi":"10.1117/12.341275","DOIUrl":"https://doi.org/10.1117/12.341275","url":null,"abstract":"The alignment of optical elements in a MOEMS, is of prime importance in order to realize a reliable and low loss system. Fabrication errors or temperature changes deteriorate the alignment accuracy. These errors can be compensated with the aid of an active alignment system. The aim of the paper is to investigate an active system in order to align microlenses and fibers within a system. A high lateral precision is required for single mode fiber injection, typically better than 1 micrometers . With the active alignment system we can correct a misalignment of +/- 6 micrometers .","PeriodicalId":318748,"journal":{"name":"Design, Test, Integration, and Packaging of MEMS/MOEMS","volume":"51 5 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1999-03-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130249327","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
MEMS resonator synthesis for testability MEMS谐振器的可测试性合成
Design, Test, Integration, and Packaging of MEMS/MOEMS Pub Date : 1999-03-10 DOI: 10.1117/12.341153
N. Deb, Sitaraman V. Iyer, T. Mukherjee, R. D. Blanton
{"title":"MEMS resonator synthesis for testability","authors":"N. Deb, Sitaraman V. Iyer, T. Mukherjee, R. D. Blanton","doi":"10.1117/12.341153","DOIUrl":"https://doi.org/10.1117/12.341153","url":null,"abstract":"We combine our MEMS synthesis and test capabilities into a synthesis-for-test environment. A microresonator design meeting a variety of specifications is synthesized. The susceptibility of this design is then measured using our MEMS contamination analyzer. The nature of each defective microresonator is determined and the deviation form nominal performance is correlated to the bounds and design constraints used in the synthesis process. Feedback from this analysis is formulated into additional design constraints for the synthesis tool with the object of minimizing the impact of spot contaminations. Re-synthesis of the same designs using these additional constraints indicates that a certain class of catastrophic and parametric faults can be reduced by 25 percent without sacrificing performance.","PeriodicalId":318748,"journal":{"name":"Design, Test, Integration, and Packaging of MEMS/MOEMS","volume":"3680 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1999-03-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130285542","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
Laser-micromachined and laminated microfluidic components for miniaturized thermal, chemical, and biological systems 用于微型热、化学和生物系统的激光微机械和层压微流体组件
Design, Test, Integration, and Packaging of MEMS/MOEMS Pub Date : 1999-03-10 DOI: 10.1117/12.341279
P. Martin, D. Matson, W. Bennett, D. C. Stewart, Yuehe Lin
{"title":"Laser-micromachined and laminated microfluidic components for miniaturized thermal, chemical, and biological systems","authors":"P. Martin, D. Matson, W. Bennett, D. C. Stewart, Yuehe Lin","doi":"10.1117/12.341279","DOIUrl":"https://doi.org/10.1117/12.341279","url":null,"abstract":"Microchannel microfluidic components are being developed for heat transfer, chemical reactor, chemical analysis, and biological analytical applications. Specific applications include chemical sensing, DNA replication, blood analysis, capillary electrophoresis, fuel cell reactors, high temperature chemical reactors, heat pumps, combustors, and fuel processors. Two general types of component architectures have been developed and the fabrication processes defined. All involve a lamination scheme using plastic, ceramic, or metal laminates, as opposed to planar components. The first type is a stacked architecture that utilizes functionality built in each layer, with fluid flow interconnects between layers. Each layer of the laminate has specific microchannel geometry, and performs a specific function. Polymeric materials are used primarily. Fabrication processes used are laser micromachining, wet and dry etching, and coating deposition. the laminates can also be micromolded plastics. The second architecture employs laminates to form internal microchannels and interconnects. Materials include ceramic tapes and high temperature metals. Catalysts can be placed in the microchannels. Fabrication processes used are diffusion bonding, ceramic bonding and firing, photochemical etching, and electrochemical micromachining. Bonding, thus sealing, the laminates is an important issue. Process conditions have been develop to reduce distortion of the laminates and to hermetically seal the components.","PeriodicalId":318748,"journal":{"name":"Design, Test, Integration, and Packaging of MEMS/MOEMS","volume":"55 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1999-03-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134421978","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 16
Physical modeling and simulation of microdevices and microsystems 微设备和微系统的物理建模和仿真
Design, Test, Integration, and Packaging of MEMS/MOEMS Pub Date : 1999-03-10 DOI: 10.1117/12.341195
G. Wachutka
{"title":"Physical modeling and simulation of microdevices and microsystems","authors":"G. Wachutka","doi":"10.1117/12.341195","DOIUrl":"https://doi.org/10.1117/12.341195","url":null,"abstract":"In the development of microdevices and microsystems, computer simulations constitute a cost-effective and time- saving alternative to the traditional experimental approach by 'straightforward trial and error'. Application-oriented modeling does not only allow the visualization of fabrication processes and operational principles, but it also assists the designer in making decisions with a view to finding optimized microstructures under technological and economical constraints. The long-term vision is the automated optimization of microsystems according to customer-supplied specifications in a computer-based 'virtual factory' prior to the real fabrication. To this end, strong efforts have to be made towards a predictive 'CAD tool box' for top-down and closed-loop simulation of microsystems. We discuss the most important aspects to be focussed on and practicable methodologies for microdevice and system modeling such as the consistent treatment of coupled fields and coupled domains, physically-based models for full system and mixed-mode simulation, and the reliable validation and calibration of models.","PeriodicalId":318748,"journal":{"name":"Design, Test, Integration, and Packaging of MEMS/MOEMS","volume":"38 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1999-03-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131794197","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Testing philosophy behind the micro analysis system 微分析系统背后的测试哲学
Design, Test, Integration, and Packaging of MEMS/MOEMS Pub Date : 1999-03-10 DOI: 10.1117/12.341224
H. Kerkhoff
{"title":"Testing philosophy behind the micro analysis system","authors":"H. Kerkhoff","doi":"10.1117/12.341224","DOIUrl":"https://doi.org/10.1117/12.341224","url":null,"abstract":"Microsystem testing has to cope with many problems, resulting from inaccessibility, different technologies and non-electrical failure modes. Possible test techniques have been investigated to test a new advanced microsystem. The implementation form and application area highly contributes to the choices made.","PeriodicalId":318748,"journal":{"name":"Design, Test, Integration, and Packaging of MEMS/MOEMS","volume":"54 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1999-03-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132593123","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 22
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