基于AHDL的微机电系统集成仿真器,采用FEM实现,采用正面求解器求解大型稀疏方程组

Z. Mrcarica, V. Risojevic, M. Lenczner, M. Jakovljević, V. Litovski
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引用次数: 4

摘要

MEMS在电子学和力学之间表现出很强的耦合,需要在统一的仿真环境中进行描述和仿真,以便从描述的角度实现更大的灵活性,并避免收敛问题。行为模拟器和模拟硬件描述语言实现了MEMS的建模。即使是空间连续的机械问题也可以用硬件描述语言来描述。这种描述应该并且可以自动化。空间离散化通常会导致非常大的方程组。为了求解这类系统,机械有限元仿真器通常采用具有非常低内存需求的迭代算法。然而,如果手头的问题包含电子,如智能材料的情况下,迭代方法可能不适用,因为收敛性不再得到保证。在我们的行为模拟器中,我们实现了一个正面求解器,通过一次只存储矩阵的一部分,可以用适度的主内存资源解决非常大的稀疏矩阵。模拟了超过20000个节点的热问题。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Integrated simulator for MEMS using FEM implementation in AHDL and frontal solver for large sparse systems of equations
MEMS that exhibit strong coupling between electronics and mechanics need to be described and simulated in a united simulation environment, in order to achieve more flexibility from the description point of view, and to avoid convergence problems. Behavioral simulators and analogue hardware description languages enable modeling of MEMS. Even space- continuous mechanical problems can be described in the hardware description language. That description should and can be automated. Space-discretization commonly leads to very large system of equations. For solving such systems, mechanical FEM simulators usually exploit iterative algorithms that have very low memory demands. However, if the problem at hand contains electronics, as in the case of intelligent materials, iterative methods might be not applicable, since the convergence is not guaranteed anymore. In our behavioral simulator we have implemented a frontal solver, enabling solution of very large sparse matrices with modest main memory resources by storing only part of the matrix at the time. Thermal problems with more than 20000 nodes have been simulated.
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