2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)最新文献

{"title":"Thermal Simulation of Processing-in-Memory Devices using HotSpot 7.0","authors":"Jun-Han Han, R. West, K. Skadron, M. Stan","doi":"10.1109/THERMINIC52472.2021.9626520","DOIUrl":"https://doi.org/10.1109/THERMINIC52472.2021.9626520","url":null,"abstract":"3D Integrated Circuits (3D ICs) offer many advantages over their 2D counterparts, such as increased bandwidth and energy efficiency, that has lead to the popularity of commercial products such as HBM and HMC. However, they also have well-known thermal challenges that need to be resolved before they can be integrated with high performance processors or Processing in Memory (PIM). Microfluidic cooling is a promising solution to these thermal challenges, but its associated design space is large enough and complex enough that we need a design space exploration tool. We extend HotSpot, an existing thermal simulator, to support flexible modeling and simulation of microfluidic cooling designs. We believe this tool will enable research into novel microfluidic cooling techniques, ultimately resulting in higher performance 3D ICs with reduced thermal constraints.","PeriodicalId":302492,"journal":{"name":"2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)","volume":"156 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-09-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123744078","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Measurement and simulation of the three-dimensional temperature field in an RF SOI chip","authors":"T. Nguyen, Isaac Haïk Dunn, E. Nefzaoui, G. Hamaoui, P. Basset, J. Loraine, I. Lahbib, B. Grandchamp, G. U'ren","doi":"10.1109/THERMINIC52472.2021.9626402","DOIUrl":"https://doi.org/10.1109/THERMINIC52472.2021.9626402","url":null,"abstract":"We present in this study a novel way to determine the three-dimensional (3D) temperature field o f a R adio Frequency Silicon On Insulator (RF SOI) electronic chip, using several resistance temperature detectors (RTDs) embedded at different locations of the chip. The RTDs are designed and placed at different locations to experimentally obtain the temperature at key locations of the chip enabling the calibration of a multiphysical numerical model that provides the 3D temperature field in the whole chip under operating conditions. The obtained results provide useful insights on the role of different parameters (e.g. used materials properties, heat source power, substrate, boundary conditions, etc.) to engineers interested in the modelling and optimization of heat transport and thermal management of electronic chips for RF applications.","PeriodicalId":302492,"journal":{"name":"2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)","volume":"27 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-09-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127145135","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"A Comparison of the Thermohydraulic Performance of Oil-Cooled Heat Sink Geometries for Power Electronics","authors":"Judith Vander Heyde, I. T’Jollyn, J. Rogiers, T. Schoonjans, J. Nonneman, S. Schlimpert, M. De Paepe","doi":"10.1109/THERMINIC52472.2021.9626484","DOIUrl":"https://doi.org/10.1109/THERMINIC52472.2021.9626484","url":null,"abstract":"Using oils as a coolant for electrical drivetrains has several advantages. Firstly, the lubricant and coolant circuits can be combined, thereby eliminating the (water-glycol) coolant circuit and reducing the component volume and cost by using a single oil circuit. Secondly, using oils can enable direct contact cooling technologies, for example direct winding cooling for electric motors, which can significantly improve the thermal performance. The drawback of using oil as a coolant are its inferior heat transfer characteristics compared to water-glycol mixtures (mainly higher viscosity and lower thermal conductivity). This increases the complexity for cooling the power electronics of the drivetrain. This paper presents a comparison of different geometries for the heat sink used to cool the inverter of an electrical drivetrain. For all assessed geometries, the oil is in direct contact with the base plate of the inverter, while the heat sink acts both as a flow disturbance and as a fin. The heat sink geometries under consideration are: multiple parallel rectangular channels, offset strip fin inserts, impinging flows, pin fins and metal foam fins. Analytical models are constructed based on correlations from literature, determining the heat transfer coefficient and pressure drop. The effect of the thermal interface resistance from base plate to heat sink on the fin efficiency is analyzed by considering different bonding techniques. The inlet oil mass flow rate is varied and the results of the thermohydraulic models are analyzed by the Pareto front of the thermal resistance as a function of the required pumping power.","PeriodicalId":302492,"journal":{"name":"2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)","volume":"20 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-09-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117043241","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Molecular dynamics simulations supporting the development of a continuum model of heat transport in nanowires","authors":"I. Bejenari, A. Burenkov, P. Pichler, I. Deretzis, Alberto Sciuto, A. La Magna","doi":"10.1109/THERMINIC52472.2021.9626512","DOIUrl":"https://doi.org/10.1109/THERMINIC52472.2021.9626512","url":null,"abstract":"We establish a suitable methodology for Molecular Dynamics (MD) simulations to provide reliable data for the development of continuum model extensions of Fourier’s law, which reproduce effects arising from phonon confinement and interface scattering. This continuum approach for thermal transport is required for TCAD tools dedicated to nanoscaled electron device simulations.","PeriodicalId":302492,"journal":{"name":"2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)","volume":"105 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-09-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117220794","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Thermal Fluid Simulation Modeling and Fatigue Analysis of Double-Sided Cooling Power Module Based on Thermal Transient Test","authors":"T. Hara, Yoshitaka Aoki, T. Funaki","doi":"10.1109/THERMINIC52472.2021.9626519","DOIUrl":"https://doi.org/10.1109/THERMINIC52472.2021.9626519","url":null,"abstract":"Double-Sided Cooling method of power device has been developed for high thermal dissipation capability to realize high power density. Thermal Transient Test is presented first to identify the heat dissipation path from the junction to the ambient of the studied double-sided cooling power module. The thermal fluid simulation model is calibrated by the extracted structure function. Fatigue analysis of the solder layers is shown as an application example of the model.","PeriodicalId":302492,"journal":{"name":"2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)","volume":"14 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-09-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126246485","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Investigation of the effect of PCB inner copper layer plastic deformation on solder joint fatigue simulations of mechanical cyclic bending tests","authors":"Maofen Zhang, Y. S. Chan, Martin Richard Niessner, P. Altieri-Weimar, B. Wunderle","doi":"10.1109/THERMINIC52472.2021.9626524","DOIUrl":"https://doi.org/10.1109/THERMINIC52472.2021.9626524","url":null,"abstract":"Microelectronic packages undergo both thermal and mechanical loading during application, which can affect solder joint lifetime. Therefore, solder joint fatigue under both cycling thermal loading and mechanical bending should be assessed. This can be done by finite element simulation method during early design stage. An accurate finite element simulation model is needed to describe the fatigue of the solder joint and derive lifetime predictions. Especially in mechanical cycle bending test simulation, the PCB mechanical properties are a key factor for accurate description of the loading on the solder joint. In this study, a multilayer FR4 PCB is used, including several copper layers, which undergo plastic deformation under bending. Copper plasticity is included in the finite element model and calibrated using force-displacement data from the bending tests. It is found that PCB inner copper plasticity should not be neglected, otherwise the loading on the solder joint would be overestimated and the lifetime prediction inaccurate.","PeriodicalId":302492,"journal":{"name":"2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)","volume":"88 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-09-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126062216","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Utilizing Additive Manufacturing to Enhance Two-Phase Heat Transfer Devices","authors":"Steffan Winkelhorst, D. Jafari, W. Wits","doi":"10.1109/THERMINIC52472.2021.9626473","DOIUrl":"https://doi.org/10.1109/THERMINIC52472.2021.9626473","url":null,"abstract":"Two-phase heat transfer devices are among the most popular devices in thermal management systems due to their superior thermal characteristics. This paper investigates a thermosyphon for electronics cooling applications into which a freeform wick structure is inserted to enhance thermal performance. Additive manufacturing is employed to fabricate the wick structure tailored to the thermosyphon at hand using a conductive thermoplastic material. The goal of this study is to investigate how the freeform wick structure inserted into a thermosyphon affects the local liquid and vapor distributions and thus improving the thermal performance. Experiments were carried out with various heat loads and inclination angles, while the temperature distribution was recorded along the length of the thermosyphon. Thermal resistances were determined for both a conventional thermosyphon and an adapted version with an inserted wick structure in order to quantify the enhancement. The obtained experimental data demonstrate that the additively manufactured wick structure gives benefits at higher heat loads due to enhanced evaporation and boiling modes. The evaporation thermal resistance improves by 7% to 13% at heat loads above 55 W for the vertical orientation. Likewise, an improvement of about 7% to 9% was found at a heat load of 105 W for inclination angles of 30° and 60°. Both results exemplify the advantages additive manufacturing may bring to thermal management systems and in particular to two-phase heat transfer devices.","PeriodicalId":302492,"journal":{"name":"2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)","volume":"5 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-09-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121123758","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Research on Heat Dissipation Performance and Long-term Reliability of the Flapping Wing Cooling Technology Applied to the 5G Communications Equipment","authors":"Yanhua Guo, Xian-ming Zhang, Daiyan Lan, Yue Zhu","doi":"10.1109/THERMINIC52472.2021.9626474","DOIUrl":"https://doi.org/10.1109/THERMINIC52472.2021.9626474","url":null,"abstract":"To further improve the heat dissipation efficiency of the 5G communications equipment, this study innovatively applies the flapping wing cooling technology to outdoor 5G base stations. A series of experimental and numerical studies have been conducted to explore effects of the flapping wing cooling device on heat dissipation performance and long-term reliability of 5G communications devices. Specifically, (1) Taguchi method was used to determine geometric parameters (length, width and spacing) of the flapping wing cooling device’s blades, where airflow and noise were objective functions of the optimization method; (2) additionally, Computational Fluid Dynamics simulation and thermal tests were conducted to demonstrate advantages of forced convection compared to natural convection. The results indicate that: (1) when blades of the flapping wing cooling device are 15 mm in width, 70 mm in length, 14 mm in spacing, the airflow reaches the maximum of 10.7 CFM, with the noise level meeting the permissible noise standard of the 5G outdoor devices; (2) the flapping wing cooling device reduces the temperature of electronic components of the 5G AAU by about 10 °C on average. The temperature drop of electronic components near the fan outlet is 6 °C higher than that of electronic components 0.5 m away from the fan outlet. In terms of reliability, Finite Element Method simulation was conducted to research the failure probability of the flapping wing cooling device under vibration fatigue; besides, based on a series of environmental durability tests, the reliability of the flapping wing cooling device for long-term usage outdoors was explored. The results show that: (1) the maximal Mises stress of blades is lower than fatigue limit of its own materials, and vibration fatigue life meets the requirement of 10 years; (2) the flapping wing cooling device has passed high temperature aging test, temperature cycling test, high temperature and high humidity aging test, salt spray test, demonstrating the feasibility of long-term outdoor operation. In conclusion, the flapping wing cooling device can effectively reduce the size and weight of the 5G communications devices by improving the heat dissipation efficiency, which is a great breakthrough in enhancing the competitiveness of products, and what is more, it is reliable to operate outdoors for a long time.","PeriodicalId":302492,"journal":{"name":"2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)","volume":"105 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-09-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126978486","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Study of the thermal behavior of double-sided cooled power modules","authors":"A. P. Catalano, C. Scognamillo, A. Castellazzi, L. Codecasa, V. d’Alessandro","doi":"10.1109/THERMINIC52472.2021.9626525","DOIUrl":"https://doi.org/10.1109/THERMINIC52472.2021.9626525","url":null,"abstract":"In this paper, the thermal behavior of double sided cooled (DSC) power modules (PMs) is investigated through an in-depth analysis based on finite-element method simulations. Although the innovative DSC technology undoubtedly improves the electrical performance and mechanical ruggedness of power modules, its promising thermal behavior – characterized by peculiar heat pathways – deserves to be further discussed. DSC PMs are analyzed by activating and de-activating each cooling surface in a wide range of boundary conditions. To provide a comprehensive explanation of the thermal phenomena occurring in such assemblies, a steady-state model relying on an equivalent thermal circuit is proposed.","PeriodicalId":302492,"journal":{"name":"2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)","volume":"53 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-09-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121943499","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Suggestions for Extending the Scope of the Transient Dual Interface Method","authors":"A. Poppe, A. Vass-Várnai, Z. Sárkány, M. Rencz, G. Hantos, G. Farkas","doi":"10.1109/THERMINIC52472.2021.9626508","DOIUrl":"https://doi.org/10.1109/THERMINIC52472.2021.9626508","url":null,"abstract":"A decade ago the JEDEC JESD51-14 standard was a real breakthrough in the thermal measurements of semiconductor devices. This standard introduces the Transient Dual (thermal) Interface Method (TDIM) for the measurement of the junction to case thermal resistance (RthJC) of power device packages with a single dominant heat-flow path through an exposed cooling surface.The recommendations of the standard are based on experiences obtained from many numerical and physical experiments performed typically on power devices in small packages such as TO types. The precise test procedure descriptions, however, seem to be too restrictive for large modules, power LED constructions and other.The aim of this paper is to examine package types for which a TDIM based RthJC measurement is feasible and to identify how the recommendations of the present JESD51-14 standard could be extended to these package types, keeping the merits of the present methodology. Moreover, it is investigated how the TDIM method can be extended to the measurement of other standard thermal metrics, such as the junction to pin thermal resistance.","PeriodicalId":302492,"journal":{"name":"2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-09-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129670745","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}