A. P. Catalano, C. Scognamillo, A. Castellazzi, L. Codecasa, V. d’Alessandro
{"title":"双面冷却电源模块热性能研究","authors":"A. P. Catalano, C. Scognamillo, A. Castellazzi, L. Codecasa, V. d’Alessandro","doi":"10.1109/THERMINIC52472.2021.9626525","DOIUrl":null,"url":null,"abstract":"In this paper, the thermal behavior of double sided cooled (DSC) power modules (PMs) is investigated through an in-depth analysis based on finite-element method simulations. Although the innovative DSC technology undoubtedly improves the electrical performance and mechanical ruggedness of power modules, its promising thermal behavior – characterized by peculiar heat pathways – deserves to be further discussed. DSC PMs are analyzed by activating and de-activating each cooling surface in a wide range of boundary conditions. To provide a comprehensive explanation of the thermal phenomena occurring in such assemblies, a steady-state model relying on an equivalent thermal circuit is proposed.","PeriodicalId":302492,"journal":{"name":"2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)","volume":"53 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2021-09-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Study of the thermal behavior of double-sided cooled power modules\",\"authors\":\"A. P. Catalano, C. Scognamillo, A. Castellazzi, L. Codecasa, V. d’Alessandro\",\"doi\":\"10.1109/THERMINIC52472.2021.9626525\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper, the thermal behavior of double sided cooled (DSC) power modules (PMs) is investigated through an in-depth analysis based on finite-element method simulations. Although the innovative DSC technology undoubtedly improves the electrical performance and mechanical ruggedness of power modules, its promising thermal behavior – characterized by peculiar heat pathways – deserves to be further discussed. DSC PMs are analyzed by activating and de-activating each cooling surface in a wide range of boundary conditions. To provide a comprehensive explanation of the thermal phenomena occurring in such assemblies, a steady-state model relying on an equivalent thermal circuit is proposed.\",\"PeriodicalId\":302492,\"journal\":{\"name\":\"2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)\",\"volume\":\"53 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2021-09-23\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/THERMINIC52472.2021.9626525\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/THERMINIC52472.2021.9626525","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Study of the thermal behavior of double-sided cooled power modules
In this paper, the thermal behavior of double sided cooled (DSC) power modules (PMs) is investigated through an in-depth analysis based on finite-element method simulations. Although the innovative DSC technology undoubtedly improves the electrical performance and mechanical ruggedness of power modules, its promising thermal behavior – characterized by peculiar heat pathways – deserves to be further discussed. DSC PMs are analyzed by activating and de-activating each cooling surface in a wide range of boundary conditions. To provide a comprehensive explanation of the thermal phenomena occurring in such assemblies, a steady-state model relying on an equivalent thermal circuit is proposed.