Thermal Fluid Simulation Modeling and Fatigue Analysis of Double-Sided Cooling Power Module Based on Thermal Transient Test

Abstract

Double-Sided Cooling method of power device has been developed for high thermal dissipation capability to realize high power density. Thermal Transient Test is presented first to identify the heat dissipation path from the junction to the ambient of the studied double-sided cooling power module. The thermal fluid simulation model is calibrated by the extracted structure function. Fatigue analysis of the solder layers is shown as an application example of the model.