基于热瞬态试验的双面冷却电源模块热流体仿真建模与疲劳分析

2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Pub Date : 2021-09-23 DOI:10.1109/THERMINIC52472.2021.9626519

T. Hara, Yoshitaka Aoki, T. Funaki

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引用次数: 0

摘要

为了提高功率器件的散热能力，实现高功率密度，发展了功率器件的双面冷却方法。首先进行了热瞬态测试，以确定所研究的双面冷却电源模块从结到环境的散热路径。利用提取的结构函数对热流体仿真模型进行标定。最后以焊接层的疲劳分析为应用实例。

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Thermal Fluid Simulation Modeling and Fatigue Analysis of Double-Sided Cooling Power Module Based on Thermal Transient Test

Double-Sided Cooling method of power device has been developed for high thermal dissipation capability to realize high power density. Thermal Transient Test is presented first to identify the heat dissipation path from the junction to the ambient of the studied double-sided cooling power module. The thermal fluid simulation model is calibrated by the extracted structure function. Fatigue analysis of the solder layers is shown as an application example of the model.

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2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)

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