ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258)最新文献_第4页

The effect of model building on the accuracy of fatigue life predictions in electronic packages 模型建立对电子封装疲劳寿命预测精度的影响

ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258) Pub Date : 2002-08-07 DOI: 10.1109/ITHERM.2002.1012544

P. Towashiraporn, G. Subbarayan, B. McIlvanie, B. Hunter, D. Love, B. Sullivan

{"title":"The effect of model building on the accuracy of fatigue life predictions in electronic packages","authors":"P. Towashiraporn, G. Subbarayan, B. McIlvanie, B. Hunter, D. Love, B. Sullivan","doi":"10.1109/ITHERM.2002.1012544","DOIUrl":"https://doi.org/10.1109/ITHERM.2002.1012544","url":null,"abstract":"Empirical fatigue life models such as the Coffin-Manson rule and its variants are commonly used at the present time to predict the reliability of microelectronic packages. While there have been reports of substantial error in empirical correlations relative to the experiments, this has not been accompanied by a rigorous understanding of the sources of the error. In this paper we systematically explore the various modeling errors in the fatigue life prediction. These errors include those in geometry representation, material behavior, load history and boundary condition application, and in the numerical solution procedure. As part of the study, experimentally validated correlations between temperature cycling and power-cycling are developed for a TI 144 chip-scale package. The accuracy of the predicted life under power-cycling conditions compared to the experimentally determined life is used as the basis for judging the model accuracy. The criticality of spatial refinement, temporal refinement, and accurate boundary conditions, including the often ignored natural convection boundary conditions, and their effect on predicted life is described in detail. It is shown that model errors can be a significant part of both the constitutive life models and the application models that use the constitutive life models to predict the fatigue life under a given environmental condition. It is also shown that with careful model building, solutions accurate to within 5% can be obtained.","PeriodicalId":299933,"journal":{"name":"ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258)","volume":"8 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131799193","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 22

Thermomechanical reliability of high density wiring substrates 高密度布线基板的热机械可靠性

ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258) Pub Date : 2002-08-07 DOI: 10.1109/ITHERM.2002.1012554

S. Hedge, R. Pucha, A. Takahashi, N. Takano, S. Sitaraman

引用次数: 1

The effect of fan operating point and location on temperature distribution in electronic systems 风机工作点和位置对电子系统温度分布的影响

ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258) Pub Date : 2002-08-07 DOI: 10.1109/ITHERM.2002.1012520

R. Grimes, M. Davies

{"title":"The effect of fan operating point and location on temperature distribution in electronic systems","authors":"R. Grimes, M. Davies","doi":"10.1109/ITHERM.2002.1012520","DOIUrl":"https://doi.org/10.1109/ITHERM.2002.1012520","url":null,"abstract":"This paper investigates the effects of fan operating point and location on the temperature distribution in a simple test electronic system. First the investigation is performed with the fan mounted at the system outlet and drawing air through the system. Then the investigation is performed with the fan mounted at system inlet, pushing air through the system. Both cases were investigated at three flow rates within the fan's recommended operating range. In each case, Particle Image Velocimetry (PIV) was used to measure system air flow and infra red thermography was used to measure PCB surface temperature. At each flow rate examined, PIV showed the air velocity to be uniform in direction and magnitude in the system with the fan mounted at system outlet, with local velocities changing in proportion to the flow rate. PCB temperature increased with reduced flow rate. In the system with the fan mounted at inlet, flow had large tangential components, impingement onto the PCB and reverse flow. Mean PCB temperature was found to be unchanged by flow rate, due to the increased thermal mixing which occurred at lower flow rates. This paper illustrates the gains, which can be made through correct fan placement, and discusses how heat transfer coefficients within fan cooled electronic systems can be optimised throughout the fan operating range.","PeriodicalId":299933,"journal":{"name":"ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258)","volume":"86 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117271549","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 19

Numerical analysis of an array of ball grid components 球栅元件阵列的数值分析

ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258) Pub Date : 2002-08-07 DOI: 10.1109/ITHERM.2002.1012439

R. Cole, M. Davies

引用次数: 0

Thermal performance of IMS/spl trade/ dielectrics: data and prediction IMS/spl贸易/电介质的热性能:数据和预测

ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258) Pub Date : 2002-08-07 DOI: 10.1109/ITHERM.2002.1012578

B. P. Gundale, S. Misra

引用次数: 2

The effect of interface pressure on thermal joint conductance for flexible graphite materials: analytical and experimental study 界面压力对柔性石墨材料热接头传导性的影响:分析与实验研究

ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258) Pub Date : 2002-08-07 DOI: 10.1109/ITHERM.2002.1012518

E. Marotta, S. Lafontant, D. McClafferty, S. Mazzuca

{"title":"The effect of interface pressure on thermal joint conductance for flexible graphite materials: analytical and experimental study","authors":"E. Marotta, S. Lafontant, D. McClafferty, S. Mazzuca","doi":"10.1109/ITHERM.2002.1012518","DOIUrl":"https://doi.org/10.1109/ITHERM.2002.1012518","url":null,"abstract":"Increasingly, thermal interstitial materials (TIM), such as metallic foils, solder, metallic coatings, polymeric matrices loaded with highly conducting filler particles (i.e., elastomers), greases, and phase-change (PCM) materials are being employed to a greater extent in power generating systems. With greater use, follow an increased interest in the thermal transport and mechanical properties of these materials. These properties include thermal conductivity, thermal diffusivity, Young's modulus, Poisson's ratio, and the thermal resistance at the interface between the interstitial material with the substrate material. To provide information on the thermal joint conductance of an important interstitial material employed in microelectronic components, an experimental investigation has been conducted for flexible graphite. The experimental data were compared to an analytical model developed for elastic layers. The model and data are found to be in good agreement over the pressure range within the investigation. The proposed model can be used to predict the lower bound on the joint conductance.","PeriodicalId":299933,"journal":{"name":"ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258)","volume":"90 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123549918","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 18

Apparatus for accurate measurement of interface resistance of high performance thermal interface materials 用于精确测量高性能热界面材料界面电阻的仪器

ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258) Pub Date : 2002-08-07 DOI: 10.1109/ITHERM.2002.1012515

J. Gwinn, M. Saini, R. Webb

{"title":"Apparatus for accurate measurement of interface resistance of high performance thermal interface materials","authors":"J. Gwinn, M. Saini, R. Webb","doi":"10.1109/ITHERM.2002.1012515","DOIUrl":"https://doi.org/10.1109/ITHERM.2002.1012515","url":null,"abstract":"This manuscript describes a systematic and rational design of an experimental apparatus based on ASTM D-5470 standard for thermal interface resistance measurement of high performance thermal interface materials (TIM). The apparatus is intended to provide measurement of TIM thermal resistance as low as 0.065 K-cm/sup 2//W within 10% experimental uncertainty. The key points addressed are: 1) Apparatus design to obtain accurate measurement of TIM surface temperatures and heat flux, 2) Effects of surface flatness and roughness, and 3) Importance of and methods for surface cleaning. Design criteria are presented for choosing temperature sensors, their installation method, meter-bar material and thickness. The temperature sensors in the meter-bars should be located a sufficient distance from the heaters to ensure uniform heat flux in the thermal sensor region. Cooling plate design specifications, and a method for applying interface pressure are described. Experimental data are presented on a new TIM having 0.058 K-cm/sup 2//W interface resistance with 138 kPa contact pressure, which is lower than commercially available thermal grease and phase change materials.","PeriodicalId":299933,"journal":{"name":"ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258)","volume":"19 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122039792","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 35

High performance thermal vias in LTCC substrates LTCC基板中的高性能热通孔

ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258) Pub Date : 2002-08-07 DOI: 10.1109/ITHERM.2002.1012455

M. Zampino, R. Kandukuri, W. Jones

引用次数: 36

Thermal design of the TW-150 passive optical network access unit. II TW-150无源光网络接入单元的热设计。2。

ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258) Pub Date : 2002-08-07 DOI: 10.1109/ITHERM.2002.1012530

M. Tahmaspur, M. Berhe

引用次数: 3

A lamination study of a composite LCD flat panel display 复合液晶平板显示器的层压研究

ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258) Pub Date : 2002-08-07 DOI: 10.1109/ITHERM.2002.1012566

P. Greenfield, J. Pitarresi, G. Lehmann, D. Skinner, J. Lee, B. Sammakia, J. Zou

{"title":"A lamination study of a composite LCD flat panel display","authors":"P. Greenfield, J. Pitarresi, G. Lehmann, D. Skinner, J. Lee, B. Sammakia, J. Zou","doi":"10.1109/ITHERM.2002.1012566","DOIUrl":"https://doi.org/10.1109/ITHERM.2002.1012566","url":null,"abstract":"Historically, the research and development for large flat panel displays has focused on gas plasma devices. Another type of display under consideration uses a series of individual LCD panels to form a large monolithic display. The objective of this study involves the lamination of the tiles into a single composite assembly. A final cover is placed over a subassembly of tiles which when butted together, can vary in thickness by up to 25 microns. The attachment mechanism for this process uses a single sheet adhesive to set the initial gap thickness. A second layer of a liquid adhesive is used to compensate for geometry variations in the tiles. ne process of squeezing the cover onto the tiles is characterized in terms of the squeeze times, directionality, and void development. Two primary mechanisms were found involving the generation of voids and bubbles; the first relating to the out gassing of the volatile components in the adhesive and the second relating to entrainment or hydrodynamic mechanisms associated with squeeze flows and surface topology of the sheet adhesive.","PeriodicalId":299933,"journal":{"name":"ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258)","volume":"13 7","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"120840767","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1