{"title":"IMS/spl贸易/电介质的热性能:数据和预测","authors":"B. P. Gundale, S. Misra","doi":"10.1109/ITHERM.2002.1012578","DOIUrl":null,"url":null,"abstract":"Copper clad insulated metal substrates (IMS/spl trade/) can be a solution for thermal problems caused by high power density. An IMS is a metal board laminated to a circuit layer with a thermally conductive dielectric. The dielectric's thermal conductivity and thickness are critical to the thermal performance of the electronic assembly. These parameters were experimentally evaluated using a TO-220 package as a heat source. In addition, a detailed model was built using the CFD software Flotherm/spl trade/. The predicted thermal performance matches the data well if experimental data is used to correlate the model. This study indicates that for a given dielectric thickness, the thermal impedance reduces to its asymptotic value at a characteristic thermal conductivity. For a relatively thin dielectric of 75 /spl mu/m, a thermal conductivity of 4 W/m-K is sufficient, while for a thick dielectric of 250 /spl mu/m, maximum performance is not achieved until about 8 W/m-K.","PeriodicalId":299933,"journal":{"name":"ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258)","volume":"4 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Thermal performance of IMS/spl trade/ dielectrics: data and prediction\",\"authors\":\"B. P. Gundale, S. Misra\",\"doi\":\"10.1109/ITHERM.2002.1012578\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Copper clad insulated metal substrates (IMS/spl trade/) can be a solution for thermal problems caused by high power density. An IMS is a metal board laminated to a circuit layer with a thermally conductive dielectric. The dielectric's thermal conductivity and thickness are critical to the thermal performance of the electronic assembly. These parameters were experimentally evaluated using a TO-220 package as a heat source. In addition, a detailed model was built using the CFD software Flotherm/spl trade/. The predicted thermal performance matches the data well if experimental data is used to correlate the model. This study indicates that for a given dielectric thickness, the thermal impedance reduces to its asymptotic value at a characteristic thermal conductivity. For a relatively thin dielectric of 75 /spl mu/m, a thermal conductivity of 4 W/m-K is sufficient, while for a thick dielectric of 250 /spl mu/m, maximum performance is not achieved until about 8 W/m-K.\",\"PeriodicalId\":299933,\"journal\":{\"name\":\"ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258)\",\"volume\":\"4 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2002-08-07\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ITHERM.2002.1012578\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ITHERM.2002.1012578","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Thermal performance of IMS/spl trade/ dielectrics: data and prediction
Copper clad insulated metal substrates (IMS/spl trade/) can be a solution for thermal problems caused by high power density. An IMS is a metal board laminated to a circuit layer with a thermally conductive dielectric. The dielectric's thermal conductivity and thickness are critical to the thermal performance of the electronic assembly. These parameters were experimentally evaluated using a TO-220 package as a heat source. In addition, a detailed model was built using the CFD software Flotherm/spl trade/. The predicted thermal performance matches the data well if experimental data is used to correlate the model. This study indicates that for a given dielectric thickness, the thermal impedance reduces to its asymptotic value at a characteristic thermal conductivity. For a relatively thin dielectric of 75 /spl mu/m, a thermal conductivity of 4 W/m-K is sufficient, while for a thick dielectric of 250 /spl mu/m, maximum performance is not achieved until about 8 W/m-K.