ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258)最新文献_第5页

Energy efficient cooling of notebook computers 笔记本电脑的节能冷却

ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258) Pub Date : 2002-08-07 DOI: 10.1109/ITHERM.2002.1012534

K. Yazawa, A. Bar-Cohen

{"title":"Energy efficient cooling of notebook computers","authors":"K. Yazawa, A. Bar-Cohen","doi":"10.1109/ITHERM.2002.1012534","DOIUrl":"https://doi.org/10.1109/ITHERM.2002.1012534","url":null,"abstract":"The majority of today's leading-edge notebook computers relies on heat pipes for internal spreading and use forced convection, with micro-fans, to reject heat to the ambient. Such techniques have worked efficiently in the relatively flat form factor of these computers, but may not be capable of providing high heat flux cooling in ever shrinking volumes. Moreover, the power limitations of portable computers, as well as growing concern for the environment, make it desirable that the requisite thermal management be accomplished with a minimum expenditure of energy. It is, thus, essential that the developers of such notebook computers follow a rigorous design methodology and achieve an optimal design for energy and space savings. This paper illustrates a \"top down\" thermal design methodology aimed at achieving energy efficient thermal management in a compact notebook computer, while satisfying the requirements for highly integrated design. The paper begins with a review of the passive cooling limits, and uses analytic models to determine the thermal performance that can be attained in a standard notebook form factor. Numerical modeling, along with additional analysis, is used to design the optimum compact active cooling system for both for space and energy efficiency.","PeriodicalId":299933,"journal":{"name":"ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258)","volume":"280 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125856972","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 13

Thermal design methodology for high-heat-flux single-phase and two-phase micro-channel heat sinks 高热流密度单相和两相微通道散热器的热设计方法

ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258) Pub Date : 2002-08-07 DOI: 10.1109/ITHERM.2002.1012478

W. Qu, I. Mudawar

{"title":"Thermal design methodology for high-heat-flux single-phase and two-phase micro-channel heat sinks","authors":"W. Qu, I. Mudawar","doi":"10.1109/ITHERM.2002.1012478","DOIUrl":"https://doi.org/10.1109/ITHERM.2002.1012478","url":null,"abstract":"This paper explores several issues important to the thermal design of single-phase and two-phase micro-channel heat sinks. The first part of the paper concerns single-phase heat transfer in rectangular micro-channels. Experimental results are compared with predictions based on both numerical as well as fin analysis models. While the best agreement between predictions and experimental results was achieved with numerical simulation, a few of the fin models are found to provide fairly accurate predictions. The second part of the paper focuses on predicting the incipient boiling heat flux. A comprehensive model based on bubble departure and superheat criteria is developed and validated with experimental data. The incipience model is capable of predicting the location, shape and size of bubbles departing in rectangular micro-channels. In the third part of the study, an analytical model is developed to predict pressure drop across a two-phase micro-channel heat sink. This model provides a detailed assessment of pressure drop concerns with two-phase micro-channels, including compressibility, flashing and choking. Overall, the present study provides important guidelines concerning practical implementation of micro-channel heat sinks in high-heat-flux electronic cooling applications.","PeriodicalId":299933,"journal":{"name":"ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258)","volume":"168 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125305829","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 56

Development of dimensionless correlation for natural convection cooling board 自然对流冷却板无量纲相关性的发展

ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258) Pub Date : 2002-08-07 DOI: 10.1109/ITHERM.2002.1012451

T. Nakanishi, K. Shimohashi

引用次数: 4

Thermal/fluid performance evaluation of serrated plate fin heat sinks 锯齿板翅散热器的热/流体性能评价

ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258) Pub Date : 2002-08-07 DOI: 10.1109/ITHERM.2002.1012467

I. K. Shwaish, C. Amon, J. Murthy

{"title":"Thermal/fluid performance evaluation of serrated plate fin heat sinks","authors":"I. K. Shwaish, C. Amon, J. Murthy","doi":"10.1109/ITHERM.2002.1012467","DOIUrl":"https://doi.org/10.1109/ITHERM.2002.1012467","url":null,"abstract":"Cooling of the electronics in people movers and other rail transportation systems require the removal of high power dissipation from the electronic equipment to ensure their long term reliability and performance. In this study, the thermal performance of in-service serrated plate fin heat sink is evaluated for a range of Reynolds number by means of fully three-dimensional numerical simulations of the air flow over the heat sink. The flow is considered to be turbulent and both hydrodynamically and thermally developing. Our computations yield local and global heat transfer and flow parameters such as temperature distribution in the fin, heat transfer coefficient, Nusselt number, pressure drop, and the maximum temperature of the heat sink. The results point to the directions for optimizing the heat sink performance. Hence, variations of design parameters around the existing configurations are investigated. These parameters are fin interruption and staggering, fin height, serration spacing, fin thickness and inter-fin spacing, fin base thickness, and clearance gap between the fin tips and the upper wall of the channel that encloses the heat sink. The computations yield the optimal designs of plate fin heat sinks for transportation applications.","PeriodicalId":299933,"journal":{"name":"ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258)","volume":"16 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122413671","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 7

Enhancement of the cooling performance of circular pin fin heat sinks under flow bypass conditions 流动旁通条件下圆针翅片散热器冷却性能的提高

ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258) Pub Date : 2002-08-07 DOI: 10.1109/ITHERM.2002.1012488

H. Jonsson, B. Moshfegh

{"title":"Enhancement of the cooling performance of circular pin fin heat sinks under flow bypass conditions","authors":"H. Jonsson, B. Moshfegh","doi":"10.1109/ITHERM.2002.1012488","DOIUrl":"https://doi.org/10.1109/ITHERM.2002.1012488","url":null,"abstract":"CFD models of circular pin fin heat sinks have been developed. The heat sinks are situated in bypass flow in a duct with constant dimensions. The air velocity was constant, the flow was turbulent, and for turbulence modeling the Chen-Kim k-/spl epsiv/ model was used. The influence of increasing fin height in the flow direction, and uneven distribution of the fins in the lengthwise and the spanwise direction are studied. In the case of increasing fin height, it was shown that an increase in the heat transfer coefficient can be achieved without an increase in pressure drop when compared at equal mean fin height. In the case of uneven distribution of the fins it was shown that the heat transfer coefficient could be increased by an uneven distribution of the fins in the lengthwise direction, using smaller fin spacing at the trailing edge of the heat sink. Results also showed that some cases of unevenly distributed fins in the spanwise direction could achieve an increase in the heat transfer coefficient. These cases had smaller fin spacing at the center of the heat sink, and the fin height was close to the duct height. The pressure drop was almost the same as for heat sinks with even distribution of the fins.","PeriodicalId":299933,"journal":{"name":"ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258)","volume":"158 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122858734","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 12

CAD-based methods for thermal modeling of coolant loops and heat pipes 基于cad的冷却剂回路和热管热建模方法

ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258) Pub Date : 2002-08-07 DOI: 10.1109/ITHERM.2002.1012437

D.A. Johnson, J. Baumann, B. Cullimore

{"title":"CAD-based methods for thermal modeling of coolant loops and heat pipes","authors":"D.A. Johnson, J. Baumann, B. Cullimore","doi":"10.1109/ITHERM.2002.1012437","DOIUrl":"https://doi.org/10.1109/ITHERM.2002.1012437","url":null,"abstract":"As air cooling of electronics reaches the limits of its applicability, the next generation of cooling technology is likely to involve heat pipes and single- or two-phase coolant loops. These technologies are not suitable for analysis using 2D/3D computational fluid dynamics (CFD) software, and yet the geometric complexities of the thermal/structural models make network-style schematic modeling methods cumbersome. This paper describes CAD line-drawing methods to quickly generate 1D fluid models of heat pipes and coolant loops within a 3D thermal model. These arcs and lines can be attached intimately or via lineal contact or saddle resistances to plates and other surfaces, whether those surfaces are modeled using thermal finite difference methods (FDM) or finite element methods (FEM) or combinations of both. The fluid lines can also be manifolded and customized as needed to represent complex heat exchangers and plumbing arrangements. To demonstrate these concepts, two distinct examples are developed: a copper-water heat pipe, and an aluminum-ammonia loop heat pipe (LHP) with a serpentined condenser. A summary of the numerical requirements for system-level modeling of these devices is also provided.","PeriodicalId":299933,"journal":{"name":"ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258)","volume":"73 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115648392","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 4

A new approach to the design of complex heat transfer systems: notebook-size computer design 设计复杂传热系统的新方法:笔记本大小的计算机设计

ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258) Pub Date : 2002-08-07 DOI: 10.1109/ITHERM.2002.1012508

M. Nakanishi, W. Nakayama, M. Behnia, D. Soodphakdee

引用次数: 3

Thermal modelling of TPV systems TPV系统的热模拟

ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258) Pub Date : 2002-08-07 DOI: 10.1109/ITHERM.2002.1012510

N. Cordero, R. Ginige, B. Corbett, K. Kennedy

{"title":"Thermal modelling of TPV systems","authors":"N. Cordero, R. Ginige, B. Corbett, K. Kennedy","doi":"10.1109/ITHERM.2002.1012510","DOIUrl":"https://doi.org/10.1109/ITHERM.2002.1012510","url":null,"abstract":"Thermophotovoltaic (TPV) systems are rapidly becoming a potential alternative to replace large batteries partially (or totally) in power applications. A selective emitter, maintained at high temperature, radiates energy which is converted to electrical power using high efficiency photovoltaic (PV) cells. Thermal management of TPV systems is complex as the PV cells operating temperature must be kept below 80/spl deg/C to maximise their efficiency. We have used numerical modelling to find a thermal management solution. In TPV systems, unlike typical electronic systems, radiation heat transfer must be maximised. However, inherent radiation losses - radiation not converted to electrical power - will contribute to increased PV cells temperature. This paper describes an iterative simulation method specially developed for TPV systems. The first step is to use an analytical, wavelength-dependent, radiation model to calculate the radiation heat transfer from the emitter to the cells. Knowing the internal efficiency of the cells, it is then possible to calculate the radiation losses for the system. Next these losses are incorporated into a standard computational fluid dynamics (CFD) thermal modelling package (conduction-convection) as a heat source. The temperature distribution calculated by CFD is fed back to the radiation model. This iterative procedure continues until the overall solution converges.","PeriodicalId":299933,"journal":{"name":"ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258)","volume":"483 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127564332","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 8

Local thermal management for space-borne inflatable RF antennas 星载充气射频天线的局部热管理

ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258) Pub Date : 2002-08-07 DOI: 10.1109/ITHERM.2002.1012568

M. Celis, K. Lien, E. Brown, J. Huang, W. Edelstein

{"title":"Local thermal management for space-borne inflatable RF antennas","authors":"M. Celis, K. Lien, E. Brown, J. Huang, W. Edelstein","doi":"10.1109/ITHERM.2002.1012568","DOIUrl":"https://doi.org/10.1109/ITHERM.2002.1012568","url":null,"abstract":"With the space shuttle payload cost at approximately $10 K per pound, emphasis is being placed on reducing the weight of space-based systems. NASA is presently developing lightweight RF components such as inflatable antennas. We have investigated one key issue of the inflatable antenna: thermal management of the RF electronics. Our approach, called local thermal management (LTM), is a technique of heat removal based on the dual use of the RF ground-plane layer of the antenna, which consists of a copper film with Kapton cladding on one side and an emissive IR material on the other. The copper reflects the RF antenna pattern and also spreads and transfers the heat to the IR emissive layer. Our LTM concept was investigated for a radar application at 1.25 GHz (L band) in which the dissipated power of the RF electronics is 1.2 W. Experiments were conducted in vacuum (3 /spl times/ 10/sup -6/ torr) on a unit cell of the antenna where a resistor was bonded and biased for 2 W heat dissipation. The experimental data was then used to calibrate an Icepak/spl trade/ 4.0 numerical simulation of an inflatable antenna cell in the low earth orbit (LEO) environment, taking into account the thermal fluxes from the earth and sun. The simulation predicted a junction temperature of 122/spl deg/C well within the range of safe electronics operation.","PeriodicalId":299933,"journal":{"name":"ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258)","volume":"5 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126942956","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

Experimental study on laminar heat transfer in microchannel heat sink 微通道散热器层流换热实验研究

ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258) Pub Date : 2002-08-07 DOI: 10.1109/ITHERM.2002.1012481

P. Lee, J. C. Ho, H. Xue

引用次数: 48