M. Nakanishi, W. Nakayama, M. Behnia, D. Soodphakdee
{"title":"设计复杂传热系统的新方法:笔记本大小的计算机设计","authors":"M. Nakanishi, W. Nakayama, M. Behnia, D. Soodphakdee","doi":"10.1109/ITHERM.2002.1012508","DOIUrl":null,"url":null,"abstract":"A new approach for solving heat-transfer problems in geometrically complex systems has been developed. The purpose of this new approach is to develop a methodology whereby the packaging designers is freed from the task of performing detailed numerical analysis. The approach utilizes templates of components and electric devices rather than working on actual components, without simulation of the detailed complex geometry. By varying the template dimensions, the effects of geometrical configurations on cooling airflow and heat-transfer can be studied systematically. The approach is applicable to heat-transfer analysis of portable computers. Available numerical analysis tools, such as computational fluid dynamics (CFD) codes, are used to create heat-transfer databases from which fast design codes can be developed.","PeriodicalId":299933,"journal":{"name":"ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258)","volume":"16 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"A new approach to the design of complex heat transfer systems: notebook-size computer design\",\"authors\":\"M. Nakanishi, W. Nakayama, M. Behnia, D. Soodphakdee\",\"doi\":\"10.1109/ITHERM.2002.1012508\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A new approach for solving heat-transfer problems in geometrically complex systems has been developed. The purpose of this new approach is to develop a methodology whereby the packaging designers is freed from the task of performing detailed numerical analysis. The approach utilizes templates of components and electric devices rather than working on actual components, without simulation of the detailed complex geometry. By varying the template dimensions, the effects of geometrical configurations on cooling airflow and heat-transfer can be studied systematically. The approach is applicable to heat-transfer analysis of portable computers. Available numerical analysis tools, such as computational fluid dynamics (CFD) codes, are used to create heat-transfer databases from which fast design codes can be developed.\",\"PeriodicalId\":299933,\"journal\":{\"name\":\"ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258)\",\"volume\":\"16 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2002-08-07\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ITHERM.2002.1012508\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ITHERM.2002.1012508","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A new approach to the design of complex heat transfer systems: notebook-size computer design
A new approach for solving heat-transfer problems in geometrically complex systems has been developed. The purpose of this new approach is to develop a methodology whereby the packaging designers is freed from the task of performing detailed numerical analysis. The approach utilizes templates of components and electric devices rather than working on actual components, without simulation of the detailed complex geometry. By varying the template dimensions, the effects of geometrical configurations on cooling airflow and heat-transfer can be studied systematically. The approach is applicable to heat-transfer analysis of portable computers. Available numerical analysis tools, such as computational fluid dynamics (CFD) codes, are used to create heat-transfer databases from which fast design codes can be developed.