ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258)最新文献_第10页

Modeling thermal contact resistance between elastic hemisphere and elastic layer bonded to elastic substrate 模拟弹性半球与粘接在弹性基板上的弹性层之间的热接触电阻

ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258) Pub Date : 2002-08-07 DOI: 10.1109/ITHERM.2002.1012457

M. Stevanovic

引用次数: 2

Thermal deformation analysis on flip-chip packages using high resolution moire interferometry 用高分辨率云纹干涉法分析倒装芯片封装的热变形

ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258) Pub Date : 2002-08-07 DOI: 10.1109/ITHERM.2002.1012546

Guotao Wang, Jie-Hua Zhao, Min Ding, P. Ho

{"title":"Thermal deformation analysis on flip-chip packages using high resolution moire interferometry","authors":"Guotao Wang, Jie-Hua Zhao, Min Ding, P. Ho","doi":"10.1109/ITHERM.2002.1012546","DOIUrl":"https://doi.org/10.1109/ITHERM.2002.1012546","url":null,"abstract":"Solder reliability has been an issue with many fine-pitch, area-array packages because of the large thermal expansion (CTE) mismatch between the silicon die and the substrate. One solution to flip-chip plastic ball grid array (FCPBGA) package is to underfill the solder bumps to improve the reliability by reducing the solder bump shear stresses. However, for an underfilled flip-chip package, large thermal stresses will develop along the solder bump-underfill during thermal cycling due to the materials discontinuity. Delamination along the die-underfill interface has often been found in reliability test. In this study, high-resolution moire interferometry was used to investigate the thermal deformations for some experimental flip-chip packages. Experimental details of high-resolution moire interferometry are presented. Using a phaseshift technique, the resolution of moire interferometry is achieved at 26 nm per fringe order. Displacement and, especially, the strain distribution can be obtained accurately at this resolution. This experimental technique can analyze deformations with small features, such as the C4 bumps and high density interconnect (HDI) structure. Experimental results for HDI FCPBGA packages are presented and discussed.","PeriodicalId":299933,"journal":{"name":"ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258)","volume":"101 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127165793","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 31

Controlling Variable Emittance (MEMS) Coatings for space applications 控制空间应用的可变发射度(MEMS)涂层

ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258) Pub Date : 2002-08-07 DOI: 10.1109/ITHERM.2002.1012569

D. Farrar, W. Schneider, R. Osiander, J. Champion, A. Darrin, D. Douglas, Ted Swanson

{"title":"Controlling Variable Emittance (MEMS) Coatings for space applications","authors":"D. Farrar, W. Schneider, R. Osiander, J. Champion, A. Darrin, D. Douglas, Ted Swanson","doi":"10.1109/ITHERM.2002.1012569","DOIUrl":"https://doi.org/10.1109/ITHERM.2002.1012569","url":null,"abstract":"Small spacecraft, including micro and nanosats, as they are envisioned for future missions, will require an alternative means to achieve thermal control due to their small power and mass budgets. One of the proposed alternatives is Variable Emittance (Vari-E) Coatings for spacecraft radiators. Space Technology-5 (ST-5) is a technology demonstration mission through NASA Goddard Space Flight Center (GSFC) that will utilize Vari-E Coatings. This mission involves a constellation of three (3) satellites in a highly elliptical orbit with a perigee altitude of /spl sim/200 km and an apogee of /spl sim/38,000 km. Such an environment will expose the spacecraft to a wide swing in the thermal and radiation environment of the earth's atmosphere. There are three (3) different technologies associated with this mission. The three technologies are electrophoretic, electrochromic, and Micro ElectroMechanical Systems (MEMS). The ultimate goal is to make use of Vari-E coatings, in order to achieve various levels of thermal control. The focus of this paper is to highlight the Vari-E Coating MEMS instrument, with an emphasis on the Electronic Control Unit responsible for operating the MEMS device. The Test & Evaluation approach, along with the results, is specific for application on ST-5, yet the information provides a guideline for future experiments and/or thermal applications on the exterior structure of a spacecraft.","PeriodicalId":299933,"journal":{"name":"ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258)","volume":"5 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131289049","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 25

Thermal aspects of burn-in of high power semiconductor devices 高功率半导体器件老化的热方面

ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258) Pub Date : 2002-08-07 DOI: 10.1109/ITHERM.2002.1012513

H. E. Hamilton

引用次数: 4

Prediction of temperature for underground telecom equipment 地下通信设备温度预测

ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258) Pub Date : 2002-08-07 DOI: 10.1109/ITHERM.2002.1012528

M. Sahraoui

引用次数: 0

Thermal assessment of RF integrated LTCC front end module (FEM) 射频集成LTCC前端模块(FEM)热评估

ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258) Pub Date : 2002-08-07 DOI: 10.1109/ITHERM.2002.1012500

V. Chiriac, T. Lee

{"title":"Thermal assessment of RF integrated LTCC front end module (FEM)","authors":"V. Chiriac, T. Lee","doi":"10.1109/ITHERM.2002.1012500","DOIUrl":"https://doi.org/10.1109/ITHERM.2002.1012500","url":null,"abstract":"The thermal performance of Front End Module (FEM) incorporating Low Temperature Co-fired Ceramic (LTCC) substrate is investigated. An Infrared Microscope System was used to measure device surface temperature with both RF and DC power at various duty cycles (25 to 100%). The maximum junction temperature (/spl sim/112/spl deg/C) occurs at the second stage. By powering the module with DC only, he comparison between numerical and experimental data indicates good agreement, with less than 10% difference in the peak temperature values. When replacing the common 2-layer organic substrate with a 14-layer LTCC substrate and silver paste metallization, the peak junction temperature reaches 130.1/spl deg/C, /spl sim/51% higher than before. However, by increasing the silver paste thermal conductivity from 90 to 350 W/mK, a significant drop in peak temperatures occurs, indicating the impact on module's overall thermal performance. The top metal layer thickness (10 vs. 30 microns) only contributed to 5-8% changes in peak junction temperature. An improved FEM design incorporates a higher thermal conductivity silver paste material (300 W/mK) with new thermal via array structure (25 vias, 150 microns in diameter each) in the LTCC substrate. The module junction temperature reaches 96/spl deg/C (based on 25/spl deg/C reference temperature, 100% duty cycle), corresponding to a junction-to-substrate (R/sub js/) thermal resistance of 14/spl deg/C/W. Further study reveals that 20% voiding placed at the die center has no impact on FEM thermal performance, while the voiding placed at the die comer (under the heat dissipating stages) increases the stage peak temperature significantly by more than 40/spl deg/C. Last part of the study focuses on design optimization: two particular designs provide the optimal thermal performance when reducing the thermal via number/costs by almost 40%.","PeriodicalId":299933,"journal":{"name":"ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258)","volume":"5 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125737809","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 6

Energy efficient thermal management of electronic components using solid liquid phase change materials 使用固液相变材料的电子元件节能热管理

ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258) Pub Date : 2002-08-07 DOI: 10.1109/ITHERM.2002.1012536

D. Yoo

{"title":"Energy efficient thermal management of electronic components using solid liquid phase change materials","authors":"D. Yoo","doi":"10.1109/ITHERM.2002.1012536","DOIUrl":"https://doi.org/10.1109/ITHERM.2002.1012536","url":null,"abstract":"Energy efficiency is becoming a key issue in the development of thermal management devices. To this end, thermal performance of plate fin and pin fin heat sinks incorporating a solid-liquid phase change material (PCM) has been evaluated, under periodic power inputs simulating actual heating conditions. Experiments were performed using Wood's metal (50Bi/27Pb/13Sn/10Cd, melting point: 70.0/spl deg/C) under forced convection in a wind tunnel, and also with an integrated fan. A periodic on/off power of 35 W and constant air velocities in the range of 0.5 /spl sim/ 1.5 m/s were examined. Three different periodic power patterns were utilized. A thermal stabilization period was observed during the phase change from solid to liquid, during which the temperature rise was arrested. The resulting extended operating period, prior to reaching a prescribed maximum temperature, resulted in an improvement in the allowable passive thermal operation time of the heat sinks. The experiments for fan-cooled heat sinks showed that energy savings by using PCM heat sinks were in the range of 5.4 /spl sim/ 12.4%. Computational predictions were performed using an implicit enthalpy-porosity approach, and were in good agreement with experimental data.","PeriodicalId":299933,"journal":{"name":"ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258)","volume":"52 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127688619","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 3

Enhanced thermal management by direct water spray of high-voltage, high power devices in a three-phase, 18-hp AC motor drive demonstration 在一个三相18马力交流电机驱动演示中，通过直接喷水对高压大功率设备进行热管理

ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258) Pub Date : 2002-08-07 DOI: 10.1109/ITHERM.2002.1012567

M. Shaw, J. Waldrop, S. Chandrasekaran, B. Kagalwala, X. Jing, E. R. Brown, V.J. Dhir, M. Fabbeo

{"title":"Enhanced thermal management by direct water spray of high-voltage, high power devices in a three-phase, 18-hp AC motor drive demonstration","authors":"M. Shaw, J. Waldrop, S. Chandrasekaran, B. Kagalwala, X. Jing, E. R. Brown, V.J. Dhir, M. Fabbeo","doi":"10.1109/ITHERM.2002.1012567","DOIUrl":"https://doi.org/10.1109/ITHERM.2002.1012567","url":null,"abstract":"The combination of high power dissipation (e.g., >500 W) and high power densities required of power conversion devices, such as those utilized within variable-speed motor drives, necessitates thermal management systems with ever-increasing capabilities. Although device power densities on the order of 100 W/cm/sup 2/ are relatively common in applications today, technology roadmaps project power densities in excess of 1 kW/cm/sup 2/ within a few years. Unfortunately, conventional thermal management designs based on solid-state conduction become unworkable at such power densities. In the present DARPA-funded investigation we have approached this problem through implementation of direct low-pressure water spray-cooling of both switch and diode surfaces within a variable-speed motor drive. Problems that were addressed include the packaging of a nozzle array design in a high-power module (>650 W dissipation) that operates with high standoff voltages (V/sub rms//spl sim/325 VAC). Electrical isolation of the devices was achieved by a Parylene coating. An effective thermal resistance of /spl sim/0.007 C/W was achieved through direct water spray-cooling of the electronic devices. In the presentation, we will compare the calculated and measured spray-cooling thermal resistances to those of more conventional thermal management schemes.","PeriodicalId":299933,"journal":{"name":"ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258)","volume":"17 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130893360","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 42

Experiments and modeling of the hydraulic resistance of in-line square pin fin heat sinks with top by-pass flow 带顶部旁通流的直列方形针翅片散热器水力阻力实验与建模

ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258) Pub Date : 2002-08-07 DOI: 10.1109/ITHERM.2002.1012465

M. Dogruoz, Marisely Urdaneta, A. Ortega

{"title":"Experiments and modeling of the hydraulic resistance of in-line square pin fin heat sinks with top by-pass flow","authors":"M. Dogruoz, Marisely Urdaneta, A. Ortega","doi":"10.1109/ITHERM.2002.1012465","DOIUrl":"https://doi.org/10.1109/ITHERM.2002.1012465","url":null,"abstract":"In this paper, we present some early findings from an experimental and analytical study aimed at obtaining physical insight into the behavior of square, in-line pin fin heat sinks. In the experimental study, various size aluminum heat sinks were utilized, where the pin heights were 12.5 mm, 17.5 mm, and 22.5 mm, and the base dimensions were kept fixed at 25 /spl times/ 25 mm. A \"two-branch by-pass model\" was developed, in which a one-dimensional differential approach was used to model the fluid flow through the heat sink and its top by-pass duct. Central to the analysis is the introduction of accurate correlations for inlet, exit and core pressure drop within the heat sink. Pressure drop predictions correlated well with the experimental data when pressure drop coefficients measured for the heat sinks were used. Agreement was poorer when classical circular tube bundle pressure drop correlations were utilized, but the accuracy was high enough for design purposes. Inlet and exit pressure losses were as important as the core pressure drop in establishing the overall flow and pressure drop. Available literature models for inlet and exit effects were mostly adequate.","PeriodicalId":299933,"journal":{"name":"ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258)","volume":"75 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132805797","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 8

Modified highly accelerated life test for aerospace electronics 航空航天电子设备改进的高加速寿命试验

ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258) Pub Date : 2002-08-07 DOI: 10.1109/ITHERM.2002.1012557

F.F. Wang

引用次数: 8