Numerical analysis of an array of ball grid components

R. Cole, M. Davies
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引用次数: 0

Abstract

Numerical modeling is a valuable analysis tool, however it is still a time consuming process and it is imperative that models be validated. The authors have proposed an alternative to full-scale numerical modeling as a first level design tool, which involves the use aerodynamic and thermal influence factors. Cole et al. [2001] presented a ball grid array (BGA) test apparatus, and also presented aerodynamic measurements made using particle image velocimetry (PIV). Part II of that paper presented thermal resistance measurements, influence factors calculated, and infrared images of surface temperatures. This paper presents numerical models made with an industry standard computational fluid dynamics (CFD) package, using the benchmark data provided from the previous work. The objective is to validate the numerical models, in order to be able to examine additional geometries.
球栅元件阵列的数值分析
数值模拟是一种有价值的分析工具,但它仍然是一个耗时的过程,模型的验证是必要的。作者提出了一种替代全尺寸数值模拟作为一级设计工具的方法,该方法涉及使用气动和热影响因素。Cole等人[2001]提出了球栅阵列(BGA)测试装置,并提出了使用粒子图像测速(PIV)进行的气动测量。第二部分给出了热阻的测量、影响因素的计算以及表面温度的红外图像。本文介绍了用工业标准计算流体动力学(CFD)软件包建立的数值模型,使用了以前工作中提供的基准数据。目的是验证数值模型,以便能够检查其他几何形状。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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