ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258)最新文献_第3页

Experimental analysis of shrouded pin fin heat sinks for electronic equipment cooling 电子设备冷却用带冠针翅片散热器的实验分析

ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258) Pub Date : 2002-08-07 DOI: 10.1109/ITHERM.2002.1012466

Hocheol Ryu, Duckjong Kim, S. Kim

引用次数: 7

Emerging MOSFET packaging technologies and their thermal evaluation 新兴的MOSFET封装技术及其热评估

ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258) Pub Date : 2002-08-07 DOI: 10.1109/ITHERM.2002.1012581

Xuejun Fan, S. Haque

{"title":"Emerging MOSFET packaging technologies and their thermal evaluation","authors":"Xuejun Fan, S. Haque","doi":"10.1109/ITHERM.2002.1012581","DOIUrl":"https://doi.org/10.1109/ITHERM.2002.1012581","url":null,"abstract":"Major MOSFET manufacturers have recently introduced innovative packaging options to achieve the next level of breakthroughs in electrical and thermal performance. Some of the innovations involve replacement of wire-bonds with solder-bumps for device interconnections in power devices and reduction in number of interfaces/paths for heat dissipation. The overall goal is to achieve small form factor MOSFET packages with significant improvements in electrical and thermal performance. This paper outlines the recent trends in MOSFET packaging and provides package-level thermal modeling results of wire-bond, strap bond, flipchip, ball-grid-array, and micro-lead-frame based packages. It also highlights the critical issues related to the processing, cost and reliability of such packages, which must be addressed before the conventional lead-frame based discrete solutions can be replaced with the new ones. Fundamental cooling mechanisms associated with different packaging technologies for MOSFETs are investigated. The impact of the internal package design on thermal performance is discussed in detail. The role of underfill materials in flip chip and BGA applications is also addressed.","PeriodicalId":299933,"journal":{"name":"ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258)","volume":"1986 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130518289","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 22

Effect of surface asperity truncation on thermal contact conductance 表面粗糙度截断对接触热导的影响

ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258) Pub Date : 2002-08-07 DOI: 10.1109/ITHERM.2002.1012456

F. Milanez, M. Yovanovich, J. Culham

引用次数: 27

Use of shell conduction plates for compact models of extruded heat sinks in forced convection environments 在强制对流环境中挤压散热器的紧凑模型中壳传导板的使用

ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258) Pub Date : 2002-08-07 DOI: 10.1109/ITHERM.2002.1012475

M. Nagulapally, K. Karimanal

{"title":"Use of shell conduction plates for compact models of extruded heat sinks in forced convection environments","authors":"M. Nagulapally, K. Karimanal","doi":"10.1109/ITHERM.2002.1012475","DOIUrl":"https://doi.org/10.1109/ITHERM.2002.1012475","url":null,"abstract":"Shell conduction plates (thin conducting plates) are computational fluid dynamics (CFD) objects that may be used to model three-dimensional conduction in thin, plate-like objects used in electronic cooling applications. The use of zero thickness conducting plates for fins of extruded heat sinks can result in significant reduction in mesh elements when compared to an equivalent case using thick fins. Shell conduction plates model three dimensional conduction in a solid as well as viscous stresses at a fin surface accurately. However, they do not account for the flow impedance caused by the thickness of the actual plates. Therefore, volumetric resistances with appropriate flow loss coefficients derived from existing channel flow correlations were used to account for the flow blockage caused by the fins. The validity of using such a hybrid approach to model extruded heat sinks was studied using Icepak, a CFD software for electronics cooling applications. Results suggest that the present approach can be used to reduce the cost of computational analysis while maintaining accuracy. The above approach resulted in savings in CPU requirements by a factor of approximately 4 to 5. For the cases considered, the grid sizes were reduced by approximately 60%.","PeriodicalId":299933,"journal":{"name":"ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258)","volume":"33 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131661284","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 4

Grain growth in eutectic Pb/Sn ball grid array solder joints 共晶Pb/Sn球栅阵列焊点的晶粒生长

ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258) Pub Date : 2002-08-07 DOI: 10.1109/ITHERM.2002.1012551

C. Basaran, Y. Wen

引用次数: 8

Experimental study of failure mechanisms in particle filled acrylic composites 颗粒填充丙烯酸复合材料破坏机理的实验研究

ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258) Pub Date : 2002-08-07 DOI: 10.1109/ITHERM.2002.1012563

C. Basaran, S. Nie, C. Hutchins

引用次数: 1

Thermal analyses of a PCM thermal control unit for portable electronic devices: experimental and numerical studies 便携式电子设备用PCM热控制单元的热分析:实验和数值研究

ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258) Pub Date : 2002-08-07 DOI: 10.1109/ITHERM.2002.1012493

E. Alawadhi, C. Amon

{"title":"Thermal analyses of a PCM thermal control unit for portable electronic devices: experimental and numerical studies","authors":"E. Alawadhi, C. Amon","doi":"10.1109/ITHERM.2002.1012493","DOIUrl":"https://doi.org/10.1109/ITHERM.2002.1012493","url":null,"abstract":"This paper investigates the effectiveness of a Thermal Control Unit (TCU) for portable electronic devices by performing experimental and numerical analyses. The TCU objective is to improve thermal management of electronic devices where their operating time is limited to few hours. It is composed of an organic Phase Change Material (PCM) and a Thermal Conductivity Enhancer (TCE). The TCU can provide a reliable solution to portable electronic devices, which avoids overheating and thermally-induced fatigue, as well as a solution which satisfies the ergonomic requirement. Since the thermal conductivity of the PCM is very low, a TCE is incorporated into the PCM to boost its conductivity. The TCU structure is complex, and modeling an electronic device with it requires time and effort. Hence, this research develops approximate, yet effective, solutions for the TCU. The TCU component properties are averaged and a single TCU material is considered. This approach is evaluated by comparing the numerical predictions with the experimental results. The numerical model is used to study the effect of some important parameters that are experimentally expensive to examine, such as the heat transfer coefficient, the PCM latent heat, the Stefan number, and the effect of the heat source power.","PeriodicalId":299933,"journal":{"name":"ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258)","volume":"25 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127663159","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 24

Thermal transport properties of gold-covered thin-film silicon dioxide 包金二氧化硅薄膜的热输运性质

ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258) Pub Date : 2002-08-07 DOI: 10.1109/ITHERM.2002.1012450

M. Burzo, P. Komarov, P. Raad

{"title":"Thermal transport properties of gold-covered thin-film silicon dioxide","authors":"M. Burzo, P. Komarov, P. Raad","doi":"10.1109/ITHERM.2002.1012450","DOIUrl":"https://doi.org/10.1109/ITHERM.2002.1012450","url":null,"abstract":"The performance and reliability of electronic devices composed of multiple thin layers of material are highly dependent on effective thermal management. Since the thermal properties of thin films, such as SiO/sub 2/, can vary considerably from bulk values, the determination of those properties is critical for the purposes of design. A new transient thermo-reflectance system has been employed to measure the thermal characteristics of thin-film SiO/sub 2/ layers. Results show that for layers of SiO/sub 2/ in the range of 100-1000 /spl Aring/, the intrinsic thermal conductivity is independent of thickness and smaller than the traditionally reported value of bulk silicon dioxide (1.4 W/m-K). The intrinsic value was measured to be around 90% and 75% of this bulk value for thermally grown (TG) and ion beam sputtered (IBS) oxides, respectively. The thermal interface resistances of TG and IBS SiO/sub 2/ films were measured at 1.68 /spl times/ 10/sup -8/ m/sup 2/-K/W and 2.58 /spl times/ 10/sup -8/ m/sup 2/-K/W, respectively. If a chromium film of around 100 /spl Aring/ is deposited between the gold and SiO/sub 2/ layers, the interface thermal resistance improves to 0.78 /spl times/ 10/sup -8/ m/sup 2/-K/W for TG films and 1.15 /spl times/ 10/sup -8/ m/sup 2/-K/W for IBS films. Thus, the effective thermal resistance of SiO/sub 2/ thin-films (i.e., with interface effects) is up to one order of magnitude smaller than the values reported for bulk SiO/sub 2/.","PeriodicalId":299933,"journal":{"name":"ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258)","volume":"13 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127798741","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 69

Performance analysis of a phase change energy storage system for pulsed power dissipation 脉冲功耗相变储能系统的性能分析

ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258) Pub Date : 2002-08-07 DOI: 10.1109/ITHERM.2002.1012494

S. Krishnan, S. Garimella

{"title":"Performance analysis of a phase change energy storage system for pulsed power dissipation","authors":"S. Krishnan, S. Garimella","doi":"10.1109/ITHERM.2002.1012494","DOIUrl":"https://doi.org/10.1109/ITHERM.2002.1012494","url":null,"abstract":"The melting and re-solidification of a phase change material in a container of rectangular cross-section with multiple discrete heat sources mounted on one side is investigated for electronics cooling by latent heat energy storage. This numerical study focuses on the thermal management issues that arise when electronic components experience a sudden surge in power dissipation. The transient response of the energy storage system to short pulses in power dissipation is studied. Convective cooling using air-cooled heat sinks on the sides of the containment remote from the heat sources provides for heat rejection to ambient air. The analysis is performed under different pulse frequencies. Different aspect ratios for the containment volume as well as different locations for the heat sources are studied in order to identify an optimal arrangement. Conduction and convection in the phase change material as well as conduction through the containment walls are considered in the computations. The constitutive equations are implicitly solved using a fully transient method on fixed orthogonal co-located finite volumes. The system is characterized based on the rate of heat absorption as well as the maximum temperatures experienced at the heat sources. Improvements that can be made in the application of latent heat energy storage in electronics cooling applications are discussed based on the results from the present study.","PeriodicalId":299933,"journal":{"name":"ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258)","volume":"9 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127927978","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 4

Visualization of forced air flows over a populated printed circuit board and their impact on convective heat transfer 印制电路板上强制气流的可视化及其对对流传热的影响

ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258) Pub Date : 2002-08-07 DOI: 10.1109/ITHERM.2002.1012498

J. Lohan, V. Eveloy, P. Rodgers

{"title":"Visualization of forced air flows over a populated printed circuit board and their impact on convective heat transfer","authors":"J. Lohan, V. Eveloy, P. Rodgers","doi":"10.1109/ITHERM.2002.1012498","DOIUrl":"https://doi.org/10.1109/ITHERM.2002.1012498","url":null,"abstract":"A detailed characterization of the airflow patterns around Printed Circuit Board (PCB)-mounted electronic components has been undertaken using three different, but complementary flow visualization techniques. Uniform airflows of 2 m/s, 4 m/s and 5.5 m/s were directed over Plastic Quad Flat Pack (PQFP) components mounted on a double Euro-Card PCB. The complexity of PCB topology and resulting flow phenomena, was increased in three stages from just one, centrally placed component, to seven components and finally to the most complex case consisting of a symmetrical in-line array of fifteen components. Traditional smoke- and paint-flow visualization techniques, as well as a novel paint-film evaporation technique, were applied to help identify the sensitivity of the flow phenomena and its impact on convective heat transfer, to both air velocity and PCB topology. Combined, these techniques not only helped characteristic features of these flows such as separation/reattachment points, re-circulation zones and horseshoe vortices to be identified, but also showed in a qualitative way, using the evaporation technique, how these flow phenomena impact on PCB/component surface heat transfer. Linking the flow phenomena with the surface heat transfer in this way also provides, in the early design phase, a means of identifying both an appropriate numerical flow modeling strategy for the flow phenomena present, and the locations of high aerodynamic disturbance on the PCB, where temperature prediction accuracy must be viewed with caution.","PeriodicalId":299933,"journal":{"name":"ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258)","volume":"72 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128008990","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 19