共晶Pb/Sn球栅阵列焊点的晶粒生长

ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258) Pub Date : 2002-08-07 DOI:10.1109/ITHERM.2002.1012551

C. Basaran, Y. Wen

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引用次数: 8

摘要

随着球栅阵列(BGA)封装技术的迅速发展，电子封装中焊点的可靠性变得越来越重要。自引入表面贴装技术(SMT)以来，焊点的热疲劳一直是电子封装行业的可靠性问题。显微组织粗化(晶粒长大)被认为与热疲劳失效密切相关。许多研究人员提出了大块金属的粗化模型。但这些模型从未在微米级的实际BGA焊料球上得到验证。本文研究了实际电子封装中BGA焊料球的三种不同晶粒生长模式。将三种模型的模拟结果与试验数据进行了比较。选取性能最好的模型进行基于连续损伤力学的有限元疲劳可靠性研究。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Grain growth in eutectic Pb/Sn ball grid array solder joints

The reliability of solder joints in electronic packaging is becoming more important as Ball Grid Array (BGA) develops rapidly into the most popular packaging technology. Thermal fatigue of solder joints has been a reliability concern in the electronic packaging industry since the introduction of surface mount technology (SMT). Micro-structural coarsening (grain growth) is considered to be closely related to thermomechanical fatigue failure. Many researchers proposed coarsening models for bulk scale metals. But these models have never been verified for micron scale actual BGA solder balls. In the present study, three different grain growth models are investigated experimentally on BGA solder balls in a real life electronic package. Model simulations obtained from three models were compared against test data. The best performing model was chosen for finite element fatigue reliability studies based on continuum damage mechanics.

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ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258)

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