Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93)最新文献_第5页

Dual-Level Metal (DLM) method for fabricating thin film wiring structures 制造薄膜布线结构的双能级金属(DLM)方法

Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) Pub Date : 1993-06-01 DOI: 10.1109/ECTC.1993.346793

S. Ray, D. Berger, G. Czornyj, A. Kumar, R. Tummala

引用次数: 6

A high density pad-on-pad connector utilizing a flexible circuit 一种利用柔性电路的高密度板对板连接器

Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) Pub Date : 1993-06-01 DOI: 10.1109/ECTC.1993.346806

R. Pokrzywa, V. Fiacco

引用次数: 1

Automatic process control of wire bonding 焊线自动过程控制

Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) Pub Date : 1993-06-01 DOI: 10.1109/ECTC.1993.346839

R. Pufall

{"title":"Automatic process control of wire bonding","authors":"R. Pufall","doi":"10.1109/ECTC.1993.346839","DOIUrl":"https://doi.org/10.1109/ECTC.1993.346839","url":null,"abstract":"For the real-time recording of essential bond parameters: bond-force; ultrasonic amplitude; bonding time; during the bonding process, sensors are applied to the bond arm. The methods (measuring procedures) and necessary hardware and software for the monitoring of the measured values have been developed. Strain gauges are fixed to the bond arm and provide a signal proportional to the applied bond-force. A piezo-ceramic sensor is attached to the horn of the bond arm to measure the amplitude of the ultrasound. The bond-time is deducible from the duration of the ultrasonic signal. The electrical signals are recorded and interpreted in real-time using a PC compatible PCD3T (Siemens) computer. The sensorised bond arm can be used advantageously with either nail-head or wedge-wedge bond machines, with both thick and thin wire bonds. Results are discussed for 25 /spl mu/m Al-wire bonds on different surfaces. To show correlation for ultrasound and bond-sticking, frequency-distributions are presented. To check bond quality, extensive shear tests and pull tests were performed. Results show that shear tests are more sensitive to bond quality than pull tests. The data from automatic process control can be used to substitute SPC (Statistical Process Control) and minimise destructive tests. Bond quality can be monitored by observing the 2nd harmonic of the ultrasonic signal. Bond parameters drifting towards bad bond quality can be avoided.<<ETX>>","PeriodicalId":281423,"journal":{"name":"Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93)","volume":"26 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1993-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125486297","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 26

A fine pitch COG technique for a TFT-LCD panel using an indium alloy 使用铟合金的TFT-LCD面板的细间距COG技术

Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) Pub Date : 1993-06-01 DOI: 10.1109/ECTC.1993.346732

M. Mori, Y. Kizaki, M. Saito, A. Hongu

{"title":"A fine pitch COG technique for a TFT-LCD panel using an indium alloy","authors":"M. Mori, Y. Kizaki, M. Saito, A. Hongu","doi":"10.1109/ECTC.1993.346732","DOIUrl":"https://doi.org/10.1109/ECTC.1993.346732","url":null,"abstract":"A fine pitch chip-on-glass (COG) bonding technique for liquid crystal display (LCD) panels has been developed. An IC chip with gold bumps was dipped in a stirred indium alloy bath in a nitrogen atmosphere without flux. Shallow-bowl-shaped In alloy bumps were selectively formed on the Au bumps on the IC electrodes. The minimum bump pitch was 50 /spl mu/m, and the bump size was 31 by 31 /spl mu/m. The In alloy bumps whose minimum pitch was 100 /spl mu/m were connected to molybdenum conductors without flux at low pressure (30 gf/bump or less) and low temperature (110/spl deg/C or less). The temperature was lower than the alloy melting point. The mean contact resistance was 0.78 /spl Omega/. It was found that the calculation of the minimum bump pitch for the bump sizes and the In alloy bump height is useful for designing new ICs with fine pitch bumps. It has been demonstrated through a thermal shock test (TST), a high temperature and high-humidity storage test; and a high-temperature storage test that the contact resistance changes satisfied the specification. Prototype TFT-LCD panels with 80-/spl mu/m pitch driver ICs were successfully developed.<<ETX>>","PeriodicalId":281423,"journal":{"name":"Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1993-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130425418","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 16

A high mechanical strength Z5U dielectric for surface mount MLC capacitors 一种高机械强度Z5U电介质，用于表面贴装MLC电容器

Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) Pub Date : 1993-06-01 DOI: 10.1109/ECTC.1993.346827

L. Mann, S.P. Gupta

引用次数: 0

Coaxial SMT module connector for high-speed MCM 用于高速MCM的同轴SMT模块连接器

Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) Pub Date : 1993-06-01 DOI: 10.1109/ECTC.1993.346808

S. Sasaki, T. Kishimoto, N. Sugiura

引用次数: 1

Thermal enhancement of surface mount electronic packages with heat sinks 带散热器的表面贴装电子封装的热增强

Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) Pub Date : 1993-06-01 DOI: 10.1109/ECTC.1993.346832

H. Shaukatullah, M. Gaynes, L.H. White

{"title":"Thermal enhancement of surface mount electronic packages with heat sinks","authors":"H. Shaukatullah, M. Gaynes, L.H. White","doi":"10.1109/ECTC.1993.346832","DOIUrl":"https://doi.org/10.1109/ECTC.1993.346832","url":null,"abstract":"Surface mount plastic packages are a cost effective way to package integrated circuit chips. However, plastics have poor thermal conductivity and therefore, plastic packages are not suitable for packaging high powered chips. Recently several variations of surface mount plastic packages have been developed for improving the thermal performance. These various techniques for improving the thermal performance can be broadly classified into two categories: internal enhancement of the package and external enhancement. For internal enhancement, high conductivity materials are used to improve heat spreading within the package. Examples of such enhancement include plastic packages with molded and exposed heat spreaders, packages made from metals like aluminium, and ceramic packages. For external enhancement, the thermal performance is improved by attaching a suitable heat sink to the package. This paper discusses the thermal performance of the various surface mount packages with and without heat sinks. It is shown that with a suitable heat sink, the thermal performance of a plastic package is similar to that of a metal or a plastic package with exposed heat spreader. In terms of cost, heat sink attachment offers the most cost effective way of improving the thermal performance of the plastic package, provided there is some space available for the heat sink.<<ETX>>","PeriodicalId":281423,"journal":{"name":"Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93)","volume":"106 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1993-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133017073","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 13

Development of a low stress silicon-carbon liquid encapsulant 低应力硅碳液体封装剂的研制

Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) Pub Date : 1993-06-01 DOI: 10.1109/ECTC.1993.346762

D. L. Robinson, R. Brady, I. M. Higgins

{"title":"Development of a low stress silicon-carbon liquid encapsulant","authors":"D. L. Robinson, R. Brady, I. M. Higgins","doi":"10.1109/ECTC.1993.346762","DOIUrl":"https://doi.org/10.1109/ECTC.1993.346762","url":null,"abstract":"Mismatches in thermal expansion between encapsulant, die and substrate lead to stresses that can cause failures in thermal cycling of electronic parts. These stresses become especially troublesome as die size increases. In order to minimize failures, low stress encapsulants are needed. This paper describes development of a low stress silicon-carbon liquid encapsulant. Development was done on multichip modules (MCM-L) with large die. In order to develop a low stress encapsulant, a designed experiment was run. Variables in the full factorial design included: (1) encapsulant filler level, (2) encapsulant elastomer type, (3) encapsulant elastomer level, (4) board thickness, and (5) cure schedule. The material variables (1-3) gave rise to 8 formulations with widely varying properties, such as CTE and modulus. Air to air thermal cycling (-55/spl deg/C to +125/spl deg/C) was performed on MCM-L test boards with encapsulated 7.62 mm/spl times/19.05 mm (300 mil/spl times/750 mil) die. Parts were tested in situ throughout the cycling up to 2000 cycles. Results of the designed experiment indicated that filler level was the dominant variable, with high filler level providing the most reliability. Several other variables perhaps had minor effects. Continuing work is examining filler content, elastomer content, and dispensability further.<<ETX>>","PeriodicalId":281423,"journal":{"name":"Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93)","volume":"9 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1993-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133232640","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Active board concurrent maintenance 主控板并发维护

Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) Pub Date : 1993-06-01 DOI: 10.1109/ECTC.1993.346804

S. Makow

引用次数: 0

The preparation and electrical conduction of Li/sub 2/SnO/sub 3/ thick film humidity sensitive material Li/ sub2 /SnO/ sub3 /厚膜湿敏材料的制备及其导电性

Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) Pub Date : 1993-06-01 DOI: 10.1109/ECTC.1993.346698

J.L. Zhang, Y.D. Lu, B.R. Li, J. Meng

引用次数: 2