一种利用柔性电路的高密度板对板连接器

Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) Pub Date : 1993-06-01 DOI:10.1109/ECTC.1993.346806

R. Pokrzywa, V. Fiacco

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引用次数: 1

摘要

本文介绍了一种在冷却液浸没环境中用于子卡和母板之间的高密度、可控阻抗柔性互连系统。介绍的主题包括连接器设计、使用的对准技术、均匀接触压力方法、连接器组装以及在连接器上进行的可行性/可靠性测试

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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A high density pad-on-pad connector utilizing a flexible circuit

This paper describes a high density, controlled impedance flexible interconnect system used between daughter cards and a mother board in a coolant immersed environment. Topics presented include connector design, alignment techniques utilized, uniform contact pressure methods, connector assembly and feasibility/reliability testing performed on the connector.<>

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来源期刊

Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93)

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