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2014 IEEE International Symposium on Electromagnetic Compatibility (EMC)最新文献

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ITE EMC requirements in BRIC countries: EMC compliance in Brazil, Russia, India, and China ITE在金砖四国的EMC要求:符合巴西、俄罗斯、印度和中国的EMC要求
2014 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2014-11-20 DOI: 10.1109/ISEMC.2014.6899098
M. Maynard
{"title":"ITE EMC requirements in BRIC countries: EMC compliance in Brazil, Russia, India, and China","authors":"M. Maynard","doi":"10.1109/ISEMC.2014.6899098","DOIUrl":"https://doi.org/10.1109/ISEMC.2014.6899098","url":null,"abstract":"The growing and developing economies of Brazil, Russia, India, and China are bringing a new group of consumers to global ITE companies. Given the acronym of BRIC, all of these countries are at similar stages in the growth of a larger number of middle class residents that are demanding access to the latest technology as well as an improved information infrastructure environment. Each has their own unique regulatory compliance environment, shaped by the culture, as well as the existing governmental agencies and bureaucracies that pre-date the invention of the personal computer. In this paper we will identify and discuss the EMC regulatory agencies, EMC compliance standards, typical agency submittal requirements for ITE, and some valuable tips on how to have a successful certification project in these four countries with expanding customer bases.","PeriodicalId":279929,"journal":{"name":"2014 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"38 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-11-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132585221","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
A method to quantify the coupling between DVI and HDMI connectors 一种量化DVI和HDMI连接器之间耦合的方法
2014 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2014-11-20 DOI: 10.1109/ISEMC.2014.6898986
A. Patnaik, Yaojiang Zhang, S. De, D. Pommerenke, Chen Wang, Charles Jackson
{"title":"A method to quantify the coupling between DVI and HDMI connectors","authors":"A. Patnaik, Yaojiang Zhang, S. De, D. Pommerenke, Chen Wang, Charles Jackson","doi":"10.1109/ISEMC.2014.6898986","DOIUrl":"https://doi.org/10.1109/ISEMC.2014.6898986","url":null,"abstract":"In a high-speed connector system, coupling to an adjacent cable-connector system is not uncommon. It is essential to understand and quantify this coupling path in order to mitigate the coupling. Though simulation based methods are widely used, such an approach is generally very time consuming and computationally resource hungry. A measurement based method for quantifying the EMI coupling path between a highspeed connector and an adjacent connector on the same board is presented. This is based on measured S-parameters for the mode conversion representing the coupling from the differential mode in one connector to the antenna mode current on the other connector-cable system. The method is validated on two test structures comparing estimated and measured radiated field emissions.","PeriodicalId":279929,"journal":{"name":"2014 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"42 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-11-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132868457","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Part 2: Dealing with complexities of worldwide regulatory compliance; beginning with EMC 第2部分:处理全球法规遵从性的复杂性;从EMC开始
2014 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2014-11-20 DOI: 10.1109/ISEMC.2014.6899100
D. Staggs
{"title":"Part 2: Dealing with complexities of worldwide regulatory compliance; beginning with EMC","authors":"D. Staggs","doi":"10.1109/ISEMC.2014.6899100","DOIUrl":"https://doi.org/10.1109/ISEMC.2014.6899100","url":null,"abstract":"There are many processes associated with product regulatory compliance that either are not documented or not adhered to by companies. This lack of clear process and responsibility represents added complexity from product development all the way through product manufacturing. The field of electromagnetic compatibility (EMC) is one of the most difficult of all required regulatory approvals due to the number of standards, number of test methods involved and number of processes needed to initially obtain and sustain compliance. This paper provides insight to establishing authority in handling and enforcing product compliance, examines the risk to companies of product non-compliance, gives an example on how to evaluate methods of bringing a product into compliance, discusses the need for regulatory compliance training for signal integrity and EMC engineers, and offers different approaches to managing the regulatory compliance of original equipment manufacturer products. Recommendations are made on how to implement a quality management system that will greatly reduce these complexities and provide for a clear structure for documenting EMC processes.","PeriodicalId":279929,"journal":{"name":"2014 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"30 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-11-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134561624","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Evaluation of radiated emissions from multi-port integrated connector modules (ICM) by S-parameters 用s参数评价多端口集成连接器模块(ICM)的辐射发射
2014 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2014-11-20 DOI: 10.1109/ISEMC.2014.6899023
Hongmei Fan, Jianquan Lou, Hailong Zhang, Jinghan Yu, A. Bhobe, F. Ji, Dewen Xu, Wenbin Ma, Xinyi Hu
{"title":"Evaluation of radiated emissions from multi-port integrated connector modules (ICM) by S-parameters","authors":"Hongmei Fan, Jianquan Lou, Hailong Zhang, Jinghan Yu, A. Bhobe, F. Ji, Dewen Xu, Wenbin Ma, Xinyi Hu","doi":"10.1109/ISEMC.2014.6899023","DOIUrl":"https://doi.org/10.1109/ISEMC.2014.6899023","url":null,"abstract":"In this paper we present a systematic method to evaluate radiation of multi-port integrated connector modules (ICM) by S-parameters. A novel test jig is designed and built to measure S-parameters of two columns of ICM ports simultaneously. Based on radiation physics of ICM, a radiation model is created and an F factor to correlate S-parameters to far field radiation is defined. A good correlation is found between the F value and radiation from ICM ports.","PeriodicalId":279929,"journal":{"name":"2014 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-11-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131779012","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
AC harmonics effects on small external power supplies (wall warts) 交流谐波对小型外部电源的影响(壁疣)
2014 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2014-11-20 DOI: 10.1109/ISEMC.2014.6899030
E. Savage, W. Radasky, M. Madrid
{"title":"AC harmonics effects on small external power supplies (wall warts)","authors":"E. Savage, W. Radasky, M. Madrid","doi":"10.1109/ISEMC.2014.6899030","DOIUrl":"https://doi.org/10.1109/ISEMC.2014.6899030","url":null,"abstract":"This paper reports on tests performed to determine the response of common low voltage power supplies when their AC power feed is distorted by various types and levels of harmonic distortion. Such distortion could be a possible form of IEMI attack on a facility. It is found that switched mode power supplies are immune to such attacks, but rectifier type supplies are very susceptible, if the distortion is not symmetrical.","PeriodicalId":279929,"journal":{"name":"2014 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"16 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-11-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127844236","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Optimization of PCB PDN design using enhanced VRM model 基于增强VRM模型的PCB PDN优化设计
2014 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2014-11-20 DOI: 10.1109/ISEMC.2014.6899085
Guang Chen, A. Abou-Alfotouh, Zhiwei Liu, M. Shabban, D. Oh
{"title":"Optimization of PCB PDN design using enhanced VRM model","authors":"Guang Chen, A. Abou-Alfotouh, Zhiwei Liu, M. Shabban, D. Oh","doi":"10.1109/ISEMC.2014.6899085","DOIUrl":"https://doi.org/10.1109/ISEMC.2014.6899085","url":null,"abstract":"Decoupling for power rails that demand large current, such as FPGA core, is difficult. The capacitors required for derived solution requires excessive board area for placement and raise system cost significantly. Switcher with high loop Band Width helps reducing the decoupling needs with all the design improvements. In this paper, we proposed a 3-stage behavioral model for switcher to help PCB designer optimize PCB decoupling design. The paper also covers some issues related to switcher application, such as layout optimization for best noise performance.","PeriodicalId":279929,"journal":{"name":"2014 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"60 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-11-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128643618","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Enhanced estimates of field distribution's uncertainty contribution for TEM waveguides 对瞬变电磁法波导场分布不确定度贡献的改进估计
2014 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2014-11-20 DOI: 10.1109/ISEMC.2014.6899095
D. Hamann, H. Garbe
{"title":"Enhanced estimates of field distribution's uncertainty contribution for TEM waveguides","authors":"D. Hamann, H. Garbe","doi":"10.1109/ISEMC.2014.6899095","DOIUrl":"https://doi.org/10.1109/ISEMC.2014.6899095","url":null,"abstract":"The expanded measurement uncertainty of both the measurement of radiated emission and the measurement of electromagnetic field immunity depends mostly on the field distribution within the testing volume. In general, that uncertainty contribution has to be estimated from sampled measurement data. In most cases this results in an overestimation. The estimate can be reduced by exact knowledge of the field distribution and extensive measurements. In this paper a method is described, that calculates enhanced estimates from the calibration data of the test method. This calibration data has to be measured for the validation of the test volume and thus there is no need to perform another extensive measurement to calculate the uncertainty contribution. The enhanced estimate is obtained from the combination of analytical knowledge of the theoretical field distribution, measurement data and stochastical methods. The theory explained in this paper is applied to the calibration data of a GTEM 1250. It is shown, that the estimates are in good agreement with uncertainty contributions obtained from more extensive measurements.","PeriodicalId":279929,"journal":{"name":"2014 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-11-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115629446","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 7
Integrated-circuit countermeasures against information leakage through EM radiation 电磁辐射信息泄漏的集成电路对策
2014 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2014-11-20 DOI: 10.1109/ISEMC.2014.6899068
N. Miura, Daisuke Fujimoto, Y. Hayashi, N. Homma, T. Aoki, M. Nagata
{"title":"Integrated-circuit countermeasures against information leakage through EM radiation","authors":"N. Miura, Daisuke Fujimoto, Y. Hayashi, N. Homma, T. Aoki, M. Nagata","doi":"10.1109/ISEMC.2014.6899068","DOIUrl":"https://doi.org/10.1109/ISEMC.2014.6899068","url":null,"abstract":"EM radiation from a cryptographic processor IC contains side-channel information of secret data hidden inside the chip. This side-channel information leakage is a potential threat critical to our information society. This paper introduces several circuit-level countermeasures integrated with the cryptographic processor core for advanced hardware security.","PeriodicalId":279929,"journal":{"name":"2014 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"54 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-11-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115239304","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 6
A common-mode active filter in a compact package for a switching mode power supply 一种用于开关模式电源的紧凑封装的共模有源滤波器
2014 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2014-11-20 DOI: 10.1109/ISEMC.2014.6898994
Dongil Shin, K. Han, Jingook Kim, Sungnam Kim, Geunseok Jeong, Jaesu Park, Joungwook Park
{"title":"A common-mode active filter in a compact package for a switching mode power supply","authors":"Dongil Shin, K. Han, Jingook Kim, Sungnam Kim, Geunseok Jeong, Jaesu Park, Joungwook Park","doi":"10.1109/ISEMC.2014.6898994","DOIUrl":"https://doi.org/10.1109/ISEMC.2014.6898994","url":null,"abstract":"A common-mode (CM) active filter was designed in a compact package to suppress CM conducted emission at a switching mode power supply. A very compact structure was implemented in the voltage-sense voltage-compensation feedforward topology. The proposed filter was analyzed, and a prototype was applied to a real switching mode power supply (SMPS) board, demonstrating its usefulness by experiments.","PeriodicalId":279929,"journal":{"name":"2014 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"111 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-11-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115440636","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
On-chip voltage regulator module (VRM) effect on power/ground noise and jitter at high-speed output buffer 片上稳压模块(VRM)对高速输出缓冲器电源/地噪声和抖动的影响
2014 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2014-11-20 DOI: 10.1109/ISEMC.2014.6898946
Heegon Kim, Jingook Kim, B. Achkir, C. Yoon, J. Fan
{"title":"On-chip voltage regulator module (VRM) effect on power/ground noise and jitter at high-speed output buffer","authors":"Heegon Kim, Jingook Kim, B. Achkir, C. Yoon, J. Fan","doi":"10.1109/ISEMC.2014.6898946","DOIUrl":"https://doi.org/10.1109/ISEMC.2014.6898946","url":null,"abstract":"On-chip voltage regulator module (VRM) for the reduction of power/ground noise on power distribution network (PDN) and jitter minimization at high-speed output buffer is introduced. The basic topology and optimized operation for on-chip VRM is analyzed. A PDN with on-chip VRM shows reduced power/ground noise through removing additional effects coming from package/PCB PDN. Also, when on-chip VRM is implemented on PDN of high-speed output buffers, jitter at output signal is lower. Improvements on PDN and jitter through on-chip VRM are shown and validated with SPICE simulation with 110nm CMOS technology library.","PeriodicalId":279929,"journal":{"name":"2014 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"72 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-11-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127148211","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 9
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