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2014 IEEE International Symposium on Electromagnetic Compatibility (EMC)最新文献

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Transient grounding characteristics of a wind turbine foundation with grounding wires and plates 带接地线和接地板的风力发电机基础暂态接地特性
2014 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2014-11-20 DOI: 10.1109/ISEMC.2014.6899036
Kazuo Yamamoto, S. Sumi
{"title":"Transient grounding characteristics of a wind turbine foundation with grounding wires and plates","authors":"Kazuo Yamamoto, S. Sumi","doi":"10.1109/ISEMC.2014.6899036","DOIUrl":"https://doi.org/10.1109/ISEMC.2014.6899036","url":null,"abstract":"Lightning damages to facilities inside or in the vicinity of wind turbines become remarkably common. Most of the breakdowns and malfunctions of the electrical and control systems inside or in the vicinity of wind turbines are caused by ground potential rise due to lightning current flowing into the foundation with grounding electrodes and wires consisting of the wind turbine grounding system. To clarify the transient characteristics of the wind turbine grounding systems and to understand the mechanism of the breakdowns and malfunctions, we have carried out field tests. In this paper, the measurements and analyses of the transient grounding characteristics carried out at a wind turbine site are described.","PeriodicalId":279929,"journal":{"name":"2014 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"s3-42 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-11-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130189491","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
Effective roughness dielectric in a PCB: Measurement and full-wave simulation verification PCB中的有效粗糙度介电:测量和全波仿真验证
2014 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2014-11-20 DOI: 10.1109/ISEMC.2014.6899077
T. Vincent, M. Koledintseva, A. Ciccomancini, S. Hinaga
{"title":"Effective roughness dielectric in a PCB: Measurement and full-wave simulation verification","authors":"T. Vincent, M. Koledintseva, A. Ciccomancini, S. Hinaga","doi":"10.1109/ISEMC.2014.6899077","DOIUrl":"https://doi.org/10.1109/ISEMC.2014.6899077","url":null,"abstract":"Surface roughness topography of printed circuit boards (PCBs) needs to be included in SI simulations in order to accurately predict the insertion loss of the structure. An effective roughness dielectric (ERD) model can be used to substitute an inhomogeneous interface between copper foil and laminate dielectric in a PCB. Herein, this approach is tested for verification using 3D full-wave numerical simulations. These effective roughness dielectric layers with the appropriate complex permittivity are included in the modeling of stripline examples. The parameters of an ambient laminate dielectric free of conductor roughness effects in the stripline are determined using differential extrapolation roughness measurement teachnique (DERM). The agreement of the results of 3D full-wave modeling simulations with the proposed approach and measurements justifies the proposed approach.","PeriodicalId":279929,"journal":{"name":"2014 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"65 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-11-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130671243","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
Electrostatic discharge (ESD) effects on wireless power transfer using magnetic resonance coupling 静电放电(ESD)对磁共振耦合无线电力传输的影响
2014 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2014-11-20 DOI: 10.1109/ISEMC.2014.6899004
Sukjin Kim, Yeonje Cho, Jonghoon J. Kim, Bumhee Bae, Sunkyu Kong, Joungho Kim
{"title":"Electrostatic discharge (ESD) effects on wireless power transfer using magnetic resonance coupling","authors":"Sukjin Kim, Yeonje Cho, Jonghoon J. Kim, Bumhee Bae, Sunkyu Kong, Joungho Kim","doi":"10.1109/ISEMC.2014.6899004","DOIUrl":"https://doi.org/10.1109/ISEMC.2014.6899004","url":null,"abstract":"In this paper, we present the analysis of electrostatic discharge (ESD) effects in wireless power transfer (WPT) using magnetic resonance coupling. For analyzing ESD effects, we use the simple equivalent circuit model which consists of self-inductance, mutual inductance, parasitic resistance, and capacitance. The ESD pulse is generated by the model of an ESD generator. The generated ESD pulse is injected to the source coil and the transferred ESD pulse is obtained in the time-domain. In addition, the transferred ESD pulse is analyzed in the frequency-domain. We compare the resonant frequency of the WPT system with the frequency of the transferred ESD pulse, and analyze the relationship between the two frequencies.","PeriodicalId":279929,"journal":{"name":"2014 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"11 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-11-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125267717","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Influence of cable routing for indoor multi-system omnidirectional antenna horizontal pattern ripple measurement 电缆布放对室内多系统全向天线水平方向图纹波测量的影响
2014 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2014-11-20 DOI: 10.1109/ISEMC.2014.6899008
G. Feng, Shan Runhong, Lei Zhou, Qi Yihong, Zhao Yan, Hu Yang
{"title":"Influence of cable routing for indoor multi-system omnidirectional antenna horizontal pattern ripple measurement","authors":"G. Feng, Shan Runhong, Lei Zhou, Qi Yihong, Zhao Yan, Hu Yang","doi":"10.1109/ISEMC.2014.6899008","DOIUrl":"https://doi.org/10.1109/ISEMC.2014.6899008","url":null,"abstract":"Horizontal pattern ripple or roundness is an important figure of merit for indoor omnidirectional antennas. The roundness measurement uncertainty due to test cable routing is investigated in this paper. Simulations on GSM, TD-SCDMA, WCDMA, wireless local area network (WLAN) and long term evolution (LTE) system have been done for eight kinds of testing cable routing influence for the indoor antenna roundness of horizontal pattern. By analyzing typical cases of ripple measurement, it is found that some kinds of testing cable routing could influence the roundness of antenna horizontal pattern significantly. Simulation and experimental results demonstrate that straight or spiral ripple has little influence for the antenna roundness measurement. This work will help standardize the measurement setup for the omnidirectional antennas.","PeriodicalId":279929,"journal":{"name":"2014 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"34 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-11-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126302203","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
High-speed differential IO crosstalk — The impact of phase, bit rate, jitter and equalization 高速差分IO串扰——相位、比特率、抖动和均衡的影响
2014 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2014-11-20 DOI: 10.1109/ISEMC.2014.6899053
C. Ye, X. Ye, Brian Wang, Juan Robledo
{"title":"High-speed differential IO crosstalk — The impact of phase, bit rate, jitter and equalization","authors":"C. Ye, X. Ye, Brian Wang, Juan Robledo","doi":"10.1109/ISEMC.2014.6899053","DOIUrl":"https://doi.org/10.1109/ISEMC.2014.6899053","url":null,"abstract":"Loss, reflection, and crosstalk are among the key factors in the design of high-speed differential channels for signal integrity. Some signal integrity techniques are used to improve link performance to compensate for loss, such as TXLE and receiver equalization using CTLE and DFE. When these techniques are used they also impact crosstalk. In this paper, impacts on crosstalk are studied for various factors including phase difference among aggressors and victim, jitter, and bit rate. TXLE of aggressors are studied in detail with several cases. Receiver equalization using CTLE and DFE is included to reveal how RX equalization responds to the crosstalk from aggressors. Observations are made through this study to guide future signal integrity simulation and design to properly control the crosstalk.","PeriodicalId":279929,"journal":{"name":"2014 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"7 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-11-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126451569","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Software-related EMI behavior of embedded microcontroller 嵌入式微控制器与软件相关的电磁干扰行为
2014 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2014-11-20 DOI: 10.1109/ISEMC.2014.6898954
Shih-Yi Yuan, Wei-Yen Chung, Cheng-Chang Chen, Chiu-Kuo Chen
{"title":"Software-related EMI behavior of embedded microcontroller","authors":"Shih-Yi Yuan, Wei-Yen Chung, Cheng-Chang Chen, Chiu-Kuo Chen","doi":"10.1109/ISEMC.2014.6898954","DOIUrl":"https://doi.org/10.1109/ISEMC.2014.6898954","url":null,"abstract":"This paper studies software-related microcontroller's conducted electromagnetic interference (SW-cEMI) behaviors when microcontrollers are executing different programs of the same functionality. The SW-cEMI behaviors of different program types, clock sources, and programmable PLL settings are measured and observed. Two major trends of microcontrollers are used as devices under test. The result shows that 10-12 dB cEMI differences even on a simple LED blinking function implemented by different program types. To the best of our knowledge, this work is the first observation on EMI phenomena of software implementations on microcontroller's programs. Some advises are given to μC programmers for cEMI reduction.","PeriodicalId":279929,"journal":{"name":"2014 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"35 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-11-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132462285","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 7
RF shielding performance of thin flexible graphene nanoplatelets-based papers 柔性石墨烯纳米薄片基薄纸的射频屏蔽性能
2014 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2014-11-20 DOI: 10.1109/ISEMC.2014.6898967
A. Tamburrano, L. Paliotta, A. Rinaldi, G. De Bellis, M. S. Sarto
{"title":"RF shielding performance of thin flexible graphene nanoplatelets-based papers","authors":"A. Tamburrano, L. Paliotta, A. Rinaldi, G. De Bellis, M. S. Sarto","doi":"10.1109/ISEMC.2014.6898967","DOIUrl":"https://doi.org/10.1109/ISEMC.2014.6898967","url":null,"abstract":"Thin and flexible freestanding graphene nanoplatelets (GNPs)-based paper-like materials are fabricated and experimentally characterized to assess their employment as radiofrequency electromagnetic interference shields. Samples are obtained by vacuum filtration of ultrasonicated suspensions. Different suspensions are prepared by mixing either acetone/DMF or acetone/NMP and worm-like exfoliated graphite expanded at the temperature of 1150 °C or 1250 °C for 5s. We investigated the effect of thermal annealing and mechanical compression on the sheet resistance, thickness, dc electrical conductivity and electromagnetic shielding of the produced GNP papers. Their shielding effectiveness (SE) is measured in the frequency range 10 MHz-18 GHz and validated by simulations. Electrical conductivity of 144 kS/m and SE as high as 55 dB are reached for a few microns thick GNP paper subjected to a compression of 5 MPa.","PeriodicalId":279929,"journal":{"name":"2014 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"57 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-11-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132075011","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
Development of human resources in hardware security through practical information technology education program 通过实用的信息技术教育计划开发硬件安全方面的人力资源
2014 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2014-11-20 DOI: 10.1109/ISEMC.2014.6899071
N. Homma, Y. Hayashi, T. Katashita, H. Sone
{"title":"Development of human resources in hardware security through practical information technology education program","authors":"N. Homma, Y. Hayashi, T. Katashita, H. Sone","doi":"10.1109/ISEMC.2014.6899071","DOIUrl":"https://doi.org/10.1109/ISEMC.2014.6899071","url":null,"abstract":"This paper presents a framework for developing human resources in the field of hardware security based on a practical education program, called enPiT Security. The Hardware Security Exercise of enPiT Security aims to learn the fundamentals of information leakage from computer hardware, such as information communication devices, and to understand the importance of hardware security through practical exercises. Specifically, in this exercise, students learn about the principles of side-channel attacks and possible countermeasures against them. Such attacks can be threats to steal secret information from secondary (side-channel) information leaked during the operation of cryptographic hardware installed on IC cards, smartphones and other personal communication terminals.","PeriodicalId":279929,"journal":{"name":"2014 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"11 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-11-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131794425","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Bench level automotive EMC validation test laboratory challenges and preferences 台架级汽车EMC验证测试实验室的挑战和偏好
2014 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2014-11-20 DOI: 10.1109/ISEMC.2014.6898989
Lawrence Banasky
{"title":"Bench level automotive EMC validation test laboratory challenges and preferences","authors":"Lawrence Banasky","doi":"10.1109/ISEMC.2014.6898989","DOIUrl":"https://doi.org/10.1109/ISEMC.2014.6898989","url":null,"abstract":"Automotive original equipment manufacturers (OEMs) and suppliers of electrical and electronic subsystems are required to perform bench level electrical and electromagnetic compatibility (EMC) validation testing. This is an important process that requires a significant investment in time and money. In an effort to improve the efficiency of testing, a survey was developed to gain an understanding of the challenges faced by test laboratories and also their preferences. This paper summarizes the results of the survey. Given the amount of time and money spent annually for the type of testing considered, the results suggest that pursuing improvements will result in a long term savings for the original equipment manufacturers (OEMs), suppliers, and labs involved. In order to increase test efficiency, the OEMs, suppliers, and laboratories will need to work together to better prepare test plans and test setups. It is suggested that the results of this survey are used to prioritize the improvement activities.","PeriodicalId":279929,"journal":{"name":"2014 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"8 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-11-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133083713","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
An Ethernet Cable Discharge Event (CDE) test and measurement system 以太网电缆放电事件(CDE)测试和测量系统
2014 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2014-11-20 DOI: 10.1109/ISEMC.2014.6898988
Wei Huang, J. Tichenor, D. Pommerenke, Viswa Pilla, Pratik Maheshwari, Giorgi Maghlakelidze
{"title":"An Ethernet Cable Discharge Event (CDE) test and measurement system","authors":"Wei Huang, J. Tichenor, D. Pommerenke, Viswa Pilla, Pratik Maheshwari, Giorgi Maghlakelidze","doi":"10.1109/ISEMC.2014.6898988","DOIUrl":"https://doi.org/10.1109/ISEMC.2014.6898988","url":null,"abstract":"A Cable Discharge Event (CDE) is an electrostatic discharge between a cable and a connector. CDEs occur on unshielded Ethernet based communication interfaces and inject currents into the pins directly [1-3]. The charging processes are in general understood; however, the discharge processes are complicated due to the number of pins involved and their connections to a system. Based on an understanding of the factors which determine the severity of a CDE, this article describes how to setup a variety of repeatable CDE tests and how to analyze the measurement results.","PeriodicalId":279929,"journal":{"name":"2014 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"20 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-11-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124764021","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 6
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