Effective roughness dielectric in a PCB: Measurement and full-wave simulation verification

T. Vincent, M. Koledintseva, A. Ciccomancini, S. Hinaga
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引用次数: 5

Abstract

Surface roughness topography of printed circuit boards (PCBs) needs to be included in SI simulations in order to accurately predict the insertion loss of the structure. An effective roughness dielectric (ERD) model can be used to substitute an inhomogeneous interface between copper foil and laminate dielectric in a PCB. Herein, this approach is tested for verification using 3D full-wave numerical simulations. These effective roughness dielectric layers with the appropriate complex permittivity are included in the modeling of stripline examples. The parameters of an ambient laminate dielectric free of conductor roughness effects in the stripline are determined using differential extrapolation roughness measurement teachnique (DERM). The agreement of the results of 3D full-wave modeling simulations with the proposed approach and measurements justifies the proposed approach.
PCB中的有效粗糙度介电:测量和全波仿真验证
为了准确预测结构的插入损耗,需要在SI仿真中考虑印刷电路板的表面粗糙度形貌。有效粗糙介电介质(ERD)模型可以用来代替PCB中铜箔与层压介电介质之间的非均匀界面。本文利用三维全波数值模拟对该方法进行了验证。这些具有适当复介电常数的有效粗糙介电层包含在带状线实例的建模中。采用微分外推粗糙度测量技术(DERM)确定了带状线中不受导体粗糙度影响的环境层状介质的参数。三维全波模拟结果与所提出的方法和测量结果一致,证明了所提出的方法是正确的。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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