2014 IEEE International Symposium on Electromagnetic Compatibility (EMC)最新文献_第9页

Surge voltage and environmental electromagnetic field analysis for HV composite transmission tower under lightning strokes 高压复合输电塔雷击下的浪涌电压及环境电磁场分析

2014 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2014-11-20 DOI: 10.1109/ISEMC.2014.6899013

Youpeng Huangfu, Shuhong Wang, X. Tao, Song Wang, Bin Yang, Guolin Wang, Yuxi Zhang

{"title":"Surge voltage and environmental electromagnetic field analysis for HV composite transmission tower under lightning strokes","authors":"Youpeng Huangfu, Shuhong Wang, X. Tao, Song Wang, Bin Yang, Guolin Wang, Yuxi Zhang","doi":"10.1109/ISEMC.2014.6899013","DOIUrl":"https://doi.org/10.1109/ISEMC.2014.6899013","url":null,"abstract":"In this paper, the surge voltages of grounding system for a 330 kV high voltage (HV) composite transmission tower under lightning strokes are comprehensively presented. An equivalent distributed parameter model of the tower is established to investigate the lightning overvoltage by using EMTP program. The distributed capacitances among the adjacent two layers of cross arms, the capacitances between the lines and grounding ladders are calculated by using three dimensional (3D) Finite Element Method (FEM). The wave impedances of the ground wire cross arm, grounding ladder, and metallic tower body are determined by using the analytic equations. The lightning overvoltage calculation and comparison are conducted considering the diverse grounding configurations, such as the single-, double-, and three-ladder grounding systems. The influence of the radius of the grounding ladder on the overvoltage characteristics is analyzed. The proper grounding ladder system is determined so that the voltage between ladder and transmission lines is less than the flashover initial voltage of the cross arm. In order to evaluate the electromagnetic environment around the tower, the induced electromagnetic field at the level of 1.5 m above the ground is computed by 3D FEM. The simulated results suggest that the electric field intensity is much greater than the safety threshold of electric field intensity around the transmission lines.","PeriodicalId":279929,"journal":{"name":"2014 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"74 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-11-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126979506","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

Investigation in burst pulse injection method for fault based cryptanalysis 基于故障密码分析的突发脉冲注入方法研究

2014 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2014-11-20 DOI: 10.1109/ISEMC.2014.6899067

K. Iokibe, K. Maeshima, H. Kagotani, Y. Nogami, Y. Toyota, Tetsushi Watanabe

{"title":"Investigation in burst pulse injection method for fault based cryptanalysis","authors":"K. Iokibe, K. Maeshima, H. Kagotani, Y. Nogami, Y. Toyota, Tetsushi Watanabe","doi":"10.1109/ISEMC.2014.6899067","DOIUrl":"https://doi.org/10.1109/ISEMC.2014.6899067","url":null,"abstract":"This paper investigated about introduction of the burst pulse injection method standardized for immunity tests to a cryptanalysis using faulty ciphertexts. We investigated the potential of the burst injection method to induce faulty ciphertexts experimentally. Firstly, the standard burst pulse was injected through the power cable to a cryptographic module implementing the Advanced Encryption Standard (AES) on a field programmable gate array (FPGA). As a result, it was confirmed that the burst pulse injection might cause clock glitches on the module. Secondly, the clock glitch was varied in magnitude and timing by use of two pulse generators and transmitted to the AES circuit to clarify what types of clock glitch induce critical faulty ciphertexts suited for recovering the crypto-key successfully. Results confirmed that the clock glitch had potential to induce faulty ciphertexts when it exceeded the threshold and produced a clock interval shorter than the critical path delay in the target round. The two experimental results suggested that burst pulse injection to cryptographic modules through their power cables is a possible scenario of fault analysis attacks.","PeriodicalId":279929,"journal":{"name":"2014 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-11-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129024467","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

Nanocrescent antenna as a transceiver for optical communication systems 纳米月牙天线作为光通信系统的收发器

2014 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2014-11-20 DOI: 10.1109/ISEMC.2014.6898940

I. Hashem, N. Rafat, E. Soliman

{"title":"Nanocrescent antenna as a transceiver for optical communication systems","authors":"I. Hashem, N. Rafat, E. Soliman","doi":"10.1109/ISEMC.2014.6898940","DOIUrl":"https://doi.org/10.1109/ISEMC.2014.6898940","url":null,"abstract":"A novel Metal Dielectric Metal (MDM) nanocrescent antenna is presented in this paper. It is formed by locating a gold circular patch, on the top of a circular aperture etched within a 30 nm gold plate. The vertical spacing between the two gold layers is filled with Al2O3. The centers of both aperture and patch are not on top of each other, resulting in a crescent-shaped nantenna. This nantenna can be fed by a nanostrip line connected to the patch. The proposed nantenna can be tuned to operate at any wavelength of interest by optimizing its geometrical parameters. It offers a relative electric field intensity enhancement of 780 with a FWHM of 960 nm centered around 1550 nm, which is equivalent to more than 61% fractional bandwidth compared to 35% of the conventional dipoles and bowties. Analysis of the proposed nanoantenna is performed using two well-known full-wave electromagnetic solvers. Very good agreement between the two solvers is achieved. A geometrical parametric study is presented, which illustrates the impact of varying different nantenna dimensions on its spectral response. The sensitivity of the response to the used metal type is investigated. The radiation properties of the proposed antenna as a transmitter has been also studied.","PeriodicalId":279929,"journal":{"name":"2014 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"39 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-11-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129262750","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 8

Virtual ground fence options for shielding power plane noise 屏蔽电源平面噪声的虚拟接地围栏选项

2014 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2014-11-20 DOI: 10.1109/ISEMC.2014.6899016

A. Ege Engin, J. Bowman

引用次数: 5

A global approach to time-domain shielding problems 时域屏蔽问题的一种全局方法

2014 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2014-11-20 DOI: 10.1109/ISEMC.2014.6898948

R. Araneo, G. Attolini, G. Lovat, S. Celozzi

引用次数: 4

MTL modeling of spacecraft harness cable assemblies 航天器线束电缆组件的MTL建模

2014 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2014-11-20 DOI: 10.1109/ISEMC.2014.6898984

N. Mora, F. Rachidi, P. Pelissou, A. Junge

引用次数: 2

Reducing emissions from an AC-DC-AC converter to improve Power Delivery Network behavior 减少AC-DC-AC变换器的排放，改善输电网行为

2014 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2014-11-20 DOI: 10.1109/ISEMC.2014.6898958

P. Nicolae, I. Nicolae, G. Mihai, I. Pătru

引用次数: 3

A new and easy approach to create BCI models 创建BCI模型的一种新的简单方法

2014 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2014-11-20 DOI: 10.1109/ISEMC.2014.6898949

I. Oganezova, X. Bunlon, A. Gheonjian, I. Chahine, B. Khvitia, R. Jobava

引用次数: 11

Susceptibility of notebook computers to HPM 笔记本电脑对HPM的易感性

2014 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2014-11-20 DOI: 10.1109/ISEMC.2014.6899032

Y. Murata, T. Hoshina, Yoshifumi Hatori

引用次数: 4

PCB via to trace return loss optimization for >25Gbps serial links PCB通过跟踪返回损耗优化>25Gbps串行链路

2014 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2014-11-20 DOI: 10.1109/ISEMC.2014.6899045

Ji Zhang, Jane Lim, Wei Yao, K. Qiu, R. Brooks

{"title":"PCB via to trace return loss optimization for >25Gbps serial links","authors":"Ji Zhang, Jane Lim, Wei Yao, K. Qiu, R. Brooks","doi":"10.1109/ISEMC.2014.6899045","DOIUrl":"https://doi.org/10.1109/ISEMC.2014.6899045","url":null,"abstract":"High speed serial links usually have extremely tight requirement on the quality of the signal channels, in terms of insertion loss and return loss. Along with an end-to-end channel design, the transition from plated-through-hole (PTH) via to fan-out traces on printed circuit board (PCB) creates unavoidable impedance discontinuity, which greatly impacts the channel return loss performance. It is important to understand and model this discontinuity for optimization purpose. This paper discusses several approaches of improving the channel's properties, by optimizing the via-to-trace transition. Considering the impedance continuity at via to trace fan-out region, usually bigger anti-pad size (to reduce capacitive discontinuity) and larger return-path area (to reduce inductive discontinuity) are employed. In this paper, we inserted a short segment of fan-out-traces, named as “transition traces”, with slightly lower impedance than the system impedance; it significantly helps on improving the overall return loss performance, while being able to take care of the above-mentioned capacitive and inductive discontinuities very well. Besides, the impact of various parameters, including transition trace impedance, anti-pad sizes on different layers, is analyzed; and the optimum combination of these design parameters is suggested. Lastly, the manufactured test board is measured to verify the optimization method.","PeriodicalId":279929,"journal":{"name":"2014 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"48 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-11-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129534450","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 15