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2014 IEEE International Symposium on Electromagnetic Compatibility (EMC)最新文献

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Robust SPICE circuit generation using scattering parameters 利用散射参数生成稳健的SPICE电路
2014 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2014-11-20 DOI: 10.1109/ISEMC.2014.6898975
J. Schutt-Ainé
{"title":"Robust SPICE circuit generation using scattering parameters","authors":"J. Schutt-Ainé","doi":"10.1109/ISEMC.2014.6898975","DOIUrl":"https://doi.org/10.1109/ISEMC.2014.6898975","url":null,"abstract":"The generation of macromodel-based SPICE subcircuits has received widespread attention in CAD applications. Model-order reduction techniques that utilize frequency-dependent representations of packages and systems are used to obtain a simplified and more analytically tractable representation for these systems. Circuit extraction algorithms are then used to extract the equivalent circuit elements from these representations. This paper introduces two techniques for the synthesis of circuits characterized by broadband S parameters. Simulations are performed to verify the robustness and accuracy of these techniques.","PeriodicalId":279929,"journal":{"name":"2014 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"15 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-11-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133639968","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
Crosstalk study of high speed on-package interconnects for multi-chip package 多芯片封装中高速封装互连的串扰研究
2014 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2014-11-20 DOI: 10.1109/ISEMC.2014.6899001
B. E. Cheah, J. Kong, K. Yong, L. Lo, Po Yin Yaw
{"title":"Crosstalk study of high speed on-package interconnects for multi-chip package","authors":"B. E. Cheah, J. Kong, K. Yong, L. Lo, Po Yin Yaw","doi":"10.1109/ISEMC.2014.6899001","DOIUrl":"https://doi.org/10.1109/ISEMC.2014.6899001","url":null,"abstract":"This paper presents the crosstalk analysis study for high-speed on-package interconnects in multi-chip package (MCP). The crosstalk coupling effects from adjacent aggressors on signaling performance e.g. eye opening and signal overshoot were investigated in this study. Simulations were performed on both microstrip and stripline structures from 2Gbps up-to 6Gbps. Several key design parameters e.g. package trace width and trace spacing ratio as well as the channel length were further explored to identify the dominating factor of crosstalk coupling in the high-speed on-package interconnect design. Simulation results indicated the crosstalk effects from adjacent aggressors beyond second order still have significant impacts on the signaling performance and need to be carefully considered for high-speed MCP applications. This paper also establishes several guidelines to enable optimum design trade-off between signaling performance and silicon real-estate.","PeriodicalId":279929,"journal":{"name":"2014 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"57 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-11-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134431643","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
A novel microwave network analysis method on transient response of power delivery network 一种新的输电网暂态响应微波网络分析方法
2014 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2014-11-20 DOI: 10.1109/ISEMC.2014.6899020
Chunlei Guo, Jiangqi He
{"title":"A novel microwave network analysis method on transient response of power delivery network","authors":"Chunlei Guo, Jiangqi He","doi":"10.1109/ISEMC.2014.6899020","DOIUrl":"https://doi.org/10.1109/ISEMC.2014.6899020","url":null,"abstract":"IR drop, voltage droops and other transient behaviors of power delivery network are critical for CPU to achieve high performance, and have to be carefully designed and analyzed. This paper proposed a novel method utilizing microwave network analysis for such transient response. It results in transfer functions that are well-conditioned at low frequencies and are very suitable for reliable and stable DC and transient analysis. All frequency domain and time domain analysis can be performed without using circuit simulators. Examples are presented to demonstrate good correlations with other methodologies.","PeriodicalId":279929,"journal":{"name":"2014 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"13 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-11-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133816039","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Impact on signal integrity of interconnect variabilities 互连变量对信号完整性的影响
2014 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2014-11-20 DOI: 10.1109/ISEMC.2014.6899054
P. Manfredi, D. Vande Ginste, D. De Zutter, F. Canavero
{"title":"Impact on signal integrity of interconnect variabilities","authors":"P. Manfredi, D. Vande Ginste, D. De Zutter, F. Canavero","doi":"10.1109/ISEMC.2014.6899054","DOIUrl":"https://doi.org/10.1109/ISEMC.2014.6899054","url":null,"abstract":"In this paper, literature results on the statistical simulation of lossy and dispersive interconnect networks with uncertain physical properties are extended to general nonlinear circuits. The approach is based on the expansion of circuit voltages and currents into polynomial chaos approximations. The derivation of deterministic circuit equivalents for nonlinear components allows to retrieve the unknown expansion coefficients with a single circuit simulation, that can be carried out via standard SPICE-type solvers. These coefficients provide direct statistical information. The methodology allows the inclusion of arbitrary nonlinear elements and is validated via transmission-line networks terminated by diodes and driven by inverters.","PeriodicalId":279929,"journal":{"name":"2014 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"173 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-11-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115719292","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Causality and delay and physics in real systems 真实系统中的因果关系，延迟和物理
2014 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2014-11-20 DOI: 10.1109/ISEMC.2014.6899107
M. Tsiklauri, M. Zvonkin, J. Fan, J. Drewniak, Q. Chen, A. Razmadze
{"title":"Causality and delay and physics in real systems","authors":"M. Tsiklauri, M. Zvonkin, J. Fan, J. Drewniak, Q. Chen, A. Razmadze","doi":"10.1109/ISEMC.2014.6899107","DOIUrl":"https://doi.org/10.1109/ISEMC.2014.6899107","url":null,"abstract":"In the present work causality property and physics behind it is analyzed for physical systems. Different methodologies for checking or enforcing causality in both time and frequency domain are discussed. Causality metric for measuring causality violation is introduced. Physical anomaly of a system with perfectly linear phase is discussed and shown that small perturbation of non-linear portion of the phase can fix the non-causal anomaly.","PeriodicalId":279929,"journal":{"name":"2014 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"46 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-11-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123285357","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 11
Influence of software effects on the susceptibility of Ethernet connections 软件效应对以太网连接易感性的影响
2014 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2014-11-20 DOI: 10.1109/ISEMC.2014.6899031
M. Kreitlow, H. Garbe, F. Sabath
{"title":"Influence of software effects on the susceptibility of Ethernet connections","authors":"M. Kreitlow, H. Garbe, F. Sabath","doi":"10.1109/ISEMC.2014.6899031","DOIUrl":"https://doi.org/10.1109/ISEMC.2014.6899031","url":null,"abstract":"It is widely known that Ethernet networks are susceptible to high-power electromagnetics (HPEM). Even with electromagnetic disturbance levels below the threshold, at which a hardware failure of components can be observed, there are impacts on the data transmission between two computers. A typical effect on the application level is a decrease of the maximum data rate between two endpoints with a higher field strength until the transmission completely breaks down. To quantify the effect of electromagnetic disturbances it is necessary to distinguish between effects which are software-related due to control algorithms and applications behaviour on higher protocol layers, and hardware-related effects caused by physical interaction between the network components and the disturbance. This paper shows the results of a new measurement method compared to classical tests using a FTP data transmission.","PeriodicalId":279929,"journal":{"name":"2014 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"17 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-11-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130155501","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 7
VR noise analysis and reduction in printed circuit board designs 印刷电路板设计中的虚拟现实噪声分析与降低
2014 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2014-11-20 DOI: 10.1109/ISEMC.2014.6899000
Yinglei Ren, Wei Shen, Kai Xiao
{"title":"VR noise analysis and reduction in printed circuit board designs","authors":"Yinglei Ren, Wei Shen, Kai Xiao","doi":"10.1109/ISEMC.2014.6899000","DOIUrl":"https://doi.org/10.1109/ISEMC.2014.6899000","url":null,"abstract":"Noise caused by switching voltage regulator (VR noise) can have a big impact on system signal / power performance, leading to signal integrity (SI) / power integrity (PI) issues. This paper introduces systematic ways of reducing VR noise as well as VR noise analysis methods. And a real design case with VR noise issue is shared with simulation and measurement results.","PeriodicalId":279929,"journal":{"name":"2014 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"59 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-11-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121233776","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
EMC model of low voltage DC motor 低压直流电机电磁兼容模型
2014 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2014-11-20 DOI: 10.1109/ISEMC.2014.6898947
I. Oganezova, R. Kado, B. Khvitia, Z. Kuchadze, A. Gheonjian, R. Jobava
{"title":"EMC model of low voltage DC motor","authors":"I. Oganezova, R. Kado, B. Khvitia, Z. Kuchadze, A. Gheonjian, R. Jobava","doi":"10.1109/ISEMC.2014.6898947","DOIUrl":"https://doi.org/10.1109/ISEMC.2014.6898947","url":null,"abstract":"This paper proposes a high-frequency dynamic circuit network model of a DC motor for predicting conductive emissions in low-voltage automotive applications, and discusses a study in which this model was examined. The proposed model, which is based on a behavioral approach, introduces some physical features and phenomena of motor armature windings. Together with impedance characterization current model gives possibility to perform accurate transient analysis and describe complex commutation processes in motor during rotation.","PeriodicalId":279929,"journal":{"name":"2014 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"37 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-11-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125712324","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 7
Miniaturized and bandwidth-enhanced multilayer 1-D EBG structure for power noise suppression 用于功率噪声抑制的小型化和带宽增强的多层1-D EBG结构
2014 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2014-11-20 DOI: 10.1109/ISEMC.2014.6898997
Chi-Kai Shen, Tzong-Lin Wu, Chung-hao Chen, Dong-ho Han
{"title":"Miniaturized and bandwidth-enhanced multilayer 1-D EBG structure for power noise suppression","authors":"Chi-Kai Shen, Tzong-Lin Wu, Chung-hao Chen, Dong-ho Han","doi":"10.1109/ISEMC.2014.6898997","DOIUrl":"https://doi.org/10.1109/ISEMC.2014.6898997","url":null,"abstract":"A one-dimensional multilayer electromagnetic bandgap (EBG) structure is investigated for size reduction and bandwidth enhancement. A design concept for bandwidth enhancement of the multilayer EBG structure focuses on merging multi-bandgap into one wide bandgap by making inner passbands as narrow as possible. Such goal could be achieved by optimizing the arrangement of power/ground vias. It is also shown that the first band would drop slightly and the third band would be raised significantly with the proper vias arrangement. In addition, size reduction is due to large capacitance characteristics of multilayer structure. The proposed ten-layer structure results in bandgap from 1.6 GHz to 6.3 GHz with merging first two bandgaps. Test boards are also fabricated and measured to validate the design concepts and simulation results. Wider bandgap for insertion loss results, which ranges from 1.27 GHz to above 10 GHz, is better than dispersion diagram due to higher bandgaps.","PeriodicalId":279929,"journal":{"name":"2014 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-11-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131227689","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
Practical de-embedding solution for PoP devices using a transfer function methodology 实用的解嵌入解决方案的PoP设备使用传递函数方法
2014 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2014-11-20 DOI: 10.1109/ISEMC.2014.6899006
G. Romo, Scott Powers, T. Michalka, Saifee Jasdanwala
{"title":"Practical de-embedding solution for PoP devices using a transfer function methodology","authors":"G. Romo, Scott Powers, T. Michalka, Saifee Jasdanwala","doi":"10.1109/ISEMC.2014.6899006","DOIUrl":"https://doi.org/10.1109/ISEMC.2014.6899006","url":null,"abstract":"This paper presents a de-embedding methodology based on transfer function concepts applicable to probed measurements performed on PoP configurations for a highperformance SoC. This methodology is applied for recovering signals at the receiver's IO pads in a mission-mode configuration, from those measured at probe points in a probing configuration in real-time. It also offers physical insight into the interposer's performance thus allowing for solution space exploration and meaningful comparisons of the two different interposer technologies to be presented.","PeriodicalId":279929,"journal":{"name":"2014 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"8 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-11-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131231556","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
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