Chi-Kai Shen, Tzong-Lin Wu, Chung-hao Chen, Dong-ho Han
{"title":"用于功率噪声抑制的小型化和带宽增强的多层1-D EBG结构","authors":"Chi-Kai Shen, Tzong-Lin Wu, Chung-hao Chen, Dong-ho Han","doi":"10.1109/ISEMC.2014.6898997","DOIUrl":null,"url":null,"abstract":"A one-dimensional multilayer electromagnetic bandgap (EBG) structure is investigated for size reduction and bandwidth enhancement. A design concept for bandwidth enhancement of the multilayer EBG structure focuses on merging multi-bandgap into one wide bandgap by making inner passbands as narrow as possible. Such goal could be achieved by optimizing the arrangement of power/ground vias. It is also shown that the first band would drop slightly and the third band would be raised significantly with the proper vias arrangement. In addition, size reduction is due to large capacitance characteristics of multilayer structure. The proposed ten-layer structure results in bandgap from 1.6 GHz to 6.3 GHz with merging first two bandgaps. Test boards are also fabricated and measured to validate the design concepts and simulation results. Wider bandgap for insertion loss results, which ranges from 1.27 GHz to above 10 GHz, is better than dispersion diagram due to higher bandgaps.","PeriodicalId":279929,"journal":{"name":"2014 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"3 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2014-11-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":"{\"title\":\"Miniaturized and bandwidth-enhanced multilayer 1-D EBG structure for power noise suppression\",\"authors\":\"Chi-Kai Shen, Tzong-Lin Wu, Chung-hao Chen, Dong-ho Han\",\"doi\":\"10.1109/ISEMC.2014.6898997\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A one-dimensional multilayer electromagnetic bandgap (EBG) structure is investigated for size reduction and bandwidth enhancement. A design concept for bandwidth enhancement of the multilayer EBG structure focuses on merging multi-bandgap into one wide bandgap by making inner passbands as narrow as possible. Such goal could be achieved by optimizing the arrangement of power/ground vias. It is also shown that the first band would drop slightly and the third band would be raised significantly with the proper vias arrangement. In addition, size reduction is due to large capacitance characteristics of multilayer structure. The proposed ten-layer structure results in bandgap from 1.6 GHz to 6.3 GHz with merging first two bandgaps. Test boards are also fabricated and measured to validate the design concepts and simulation results. Wider bandgap for insertion loss results, which ranges from 1.27 GHz to above 10 GHz, is better than dispersion diagram due to higher bandgaps.\",\"PeriodicalId\":279929,\"journal\":{\"name\":\"2014 IEEE International Symposium on Electromagnetic Compatibility (EMC)\",\"volume\":\"3 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2014-11-20\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"5\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2014 IEEE International Symposium on Electromagnetic Compatibility (EMC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISEMC.2014.6898997\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2014 IEEE International Symposium on Electromagnetic Compatibility (EMC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISEMC.2014.6898997","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Miniaturized and bandwidth-enhanced multilayer 1-D EBG structure for power noise suppression
A one-dimensional multilayer electromagnetic bandgap (EBG) structure is investigated for size reduction and bandwidth enhancement. A design concept for bandwidth enhancement of the multilayer EBG structure focuses on merging multi-bandgap into one wide bandgap by making inner passbands as narrow as possible. Such goal could be achieved by optimizing the arrangement of power/ground vias. It is also shown that the first band would drop slightly and the third band would be raised significantly with the proper vias arrangement. In addition, size reduction is due to large capacitance characteristics of multilayer structure. The proposed ten-layer structure results in bandgap from 1.6 GHz to 6.3 GHz with merging first two bandgaps. Test boards are also fabricated and measured to validate the design concepts and simulation results. Wider bandgap for insertion loss results, which ranges from 1.27 GHz to above 10 GHz, is better than dispersion diagram due to higher bandgaps.