用于功率噪声抑制的小型化和带宽增强的多层1-D EBG结构

Chi-Kai Shen, Tzong-Lin Wu, Chung-hao Chen, Dong-ho Han
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引用次数: 5

摘要

研究了一维多层电磁带隙(EBG)结构的尺寸减小和带宽增强。多层EBG结构的带宽增强设计概念侧重于通过使内带尽可能窄,将多个带隙合并为一个宽带隙。这一目标可以通过优化电源/地过孔的布置来实现。通过适当的通孔布置,第一波段略有下降,第三波段明显升高。此外,尺寸减小是由于多层结构的大电容特性。通过合并前两个带隙,所提出的十层结构产生了1.6 GHz到6.3 GHz的带隙。还制作了测试板并进行了测量,以验证设计概念和仿真结果。更宽的带隙使得插入损耗结果在1.27 GHz到10 GHz以上,比色散图效果更好。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Miniaturized and bandwidth-enhanced multilayer 1-D EBG structure for power noise suppression
A one-dimensional multilayer electromagnetic bandgap (EBG) structure is investigated for size reduction and bandwidth enhancement. A design concept for bandwidth enhancement of the multilayer EBG structure focuses on merging multi-bandgap into one wide bandgap by making inner passbands as narrow as possible. Such goal could be achieved by optimizing the arrangement of power/ground vias. It is also shown that the first band would drop slightly and the third band would be raised significantly with the proper vias arrangement. In addition, size reduction is due to large capacitance characteristics of multilayer structure. The proposed ten-layer structure results in bandgap from 1.6 GHz to 6.3 GHz with merging first two bandgaps. Test boards are also fabricated and measured to validate the design concepts and simulation results. Wider bandgap for insertion loss results, which ranges from 1.27 GHz to above 10 GHz, is better than dispersion diagram due to higher bandgaps.
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