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2014 IEEE International Symposium on Electromagnetic Compatibility (EMC)最新文献

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System level analysis and benchmarking of graphene interconnects for low-power applications 低功耗应用中石墨烯互连的系统级分析和基准测试
2014 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2014-11-20 DOI: 10.1109/ISEMC.2014.6898968
Vachan Kumar, R. Nashed, K. Brenner, Romeil Sandhu, A. Naeemi
{"title":"System level analysis and benchmarking of graphene interconnects for low-power applications","authors":"Vachan Kumar, R. Nashed, K. Brenner, Romeil Sandhu, A. Naeemi","doi":"10.1109/ISEMC.2014.6898968","DOIUrl":"https://doi.org/10.1109/ISEMC.2014.6898968","url":null,"abstract":"Stochastic wiring distribution models are used to predict the improvement in energy obtained by replacing a few or all copper metal levels with graphene nanoribbons (GNRs) in a low-power digital circuit. The models developed here also estimate the degradation in the performance by replacing a few or all copper metal levels with GNRs. Replacing a few local copper interconnect levels with GNRs is expected to reduce the energy consumed by local interconnects, without severely degrading the performance of longer global interconnects. The hybrid GNR+copper interconnect is shown to perform worse compared to the all GNR interconnect, if the length of the GNR segment is greater than a critical value. For a logic circuit with 30k gates, it is shown that the hybrid interconnect offers a 30 to 40% decrease in energy and a 4× decrease in maximum frequency, whereas the all GNR interconnect offers a 50 to 60% decrease in energy and a 7× decrease in maximum frequency. Further, the impact of edge doping on the resistance per unit length of graphene is analyzed.","PeriodicalId":279929,"journal":{"name":"2014 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"102 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-11-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126974502","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Wavelet compression for signal integrity analysis 小波压缩在信号完整性分析中的应用
2014 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2014-11-20 DOI: 10.1109/ISEMC.2014.6899065
J. Zhu, A. Norman
{"title":"Wavelet compression for signal integrity analysis","authors":"J. Zhu, A. Norman","doi":"10.1109/ISEMC.2014.6899065","DOIUrl":"https://doi.org/10.1109/ISEMC.2014.6899065","url":null,"abstract":"Signal integrity (SI) analysis heavily relies on simulations. To support various interfaces and an increasing number of topologies, extensive simulations have been run over years. Such SI analysis is time and resource intensive, generating a huge amount of data. Can the existing big data set be exploited to ease our simulation and analysis efforts? In this work, we utilize wavelet techniques to compress one channel response (tens of thousands of data points) into only a small set of coefficients. There are many potential applications, if the reconstruction accuracy is maintained. One such application is to construct a Neural Net model of those coefficients over physical design parameters, such that the channel impulse response for any physical design can be obtained without any circuit simulation. This application, along with several others will be discussed in this paper. Moreover, wavelet-based techniques will be compared to more traditional compression techniques.","PeriodicalId":279929,"journal":{"name":"2014 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"108 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-11-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123068112","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Modelling jitter induced by fibre weave effect in PCB dielectrics PCB介质中纤维编织效应引起的建模抖动
2014 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2014-11-20 DOI: 10.1109/ISEMC.2014.6899078
Y. Shlepnev, C. Nwachukwu
{"title":"Modelling jitter induced by fibre weave effect in PCB dielectrics","authors":"Y. Shlepnev, C. Nwachukwu","doi":"10.1109/ISEMC.2014.6899078","DOIUrl":"https://doi.org/10.1109/ISEMC.2014.6899078","url":null,"abstract":"Dielectric properties of Printed Circuit Board (PCB) glass weave re-enforcement can differ greatly from the properties of the resin matrix due to processes inherent in the engineering of dielectric substrates. This inhomogeneity can contribute to increases in skew and deterministic jitter at data rates of 10 Gbps and higher for paired transmission lines routed on typical PCB materials. This paper proposes a new model for accurately characterizing the glass weave-induced skew and jitter in PCB substrates. This new model will be used to predict the package-level performance of existing and next-generation skew mitigating laminate materials. The model provides guidance for PCB material selection on the basis of skew/jitter estimates for the corner cases.","PeriodicalId":279929,"journal":{"name":"2014 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-11-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122229995","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 16
NEXT and FEXT characteristics and suppressions in dense 25Gbps+ backplane vias 密集25Gbps+背板过孔中的NEXT和ext特性和抑制
2014 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2014-11-20 DOI: 10.1109/ISEMC.2014.6899110
P. Amleshi, Cong Gao
{"title":"NEXT and FEXT characteristics and suppressions in dense 25Gbps+ backplane vias","authors":"P. Amleshi, Cong Gao","doi":"10.1109/ISEMC.2014.6899110","DOIUrl":"https://doi.org/10.1109/ISEMC.2014.6899110","url":null,"abstract":"At 25Gbps and beyond, crosstalk noise can degrade a backplane channel signal quality significantly. High density interconnects can generate high crosstalk noise due to the close proximities of the components. In particular, interfacing dense chips and connectors with PCB requires dense implementation of signal via structures. Placing ground via guards can reduce the field overlap between signal via structures but this would also reduce density and create impedance discontinuities; therefore, these guarding via structures need to be placed strategically to reduce their adverse effects. In this study we analyze how near and far end crosstalk (NEXT and FEXT) within the signal via fields are affected by anti-pad, ground via, and ground plane layers. It will be shown that FEXT and NEXT can be affected differently in the presence of ground plane anti-pads. Relationships between these parameters with respect to ground anti-pads and the effectiveness of guarding via structures in reducing crosstalk will be presented.","PeriodicalId":279929,"journal":{"name":"2014 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"51 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-11-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130512822","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 6
A hybrid approach to calculate mean response and variance in a reverberant environment 计算混响环境中平均响应和方差的混合方法
2014 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2014-11-20 DOI: 10.1109/ISEMC.2014.6899072
R. Langley, A. Barbarulo, L. Kovalevsky
{"title":"A hybrid approach to calculate mean response and variance in a reverberant environment","authors":"R. Langley, A. Barbarulo, L. Kovalevsky","doi":"10.1109/ISEMC.2014.6899072","DOIUrl":"https://doi.org/10.1109/ISEMC.2014.6899072","url":null,"abstract":"In this paper a statistical approach is employed to solve high frequency EMC problems at a reduced computational cost. The case of interest is a system lying within a reverberant cavity that has random or uncertain properties. If a conventional numerical approach is employed for this problem then very significant computational effort is required since Maxwell's equations need to be solved for both the cavity and the system. The key aspect of the proposed approach is to avoid solving Maxwell's equations inside the cavity by employing a relation known as the diffuse field reciprocity principle, which leads directly to the ensemble mean response of the system and its variance; all that is required is the impedance matrix of the system associated with radiation into infinite space. Theoretical developments leading to the mean and variance are presented. This technique is then applied to a numerical example.","PeriodicalId":279929,"journal":{"name":"2014 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"57 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-11-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"120946992","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A mass-matrix based frequency-domain finite-element method accelerated by a reduced eigenspace method for circuit modeling 一种基于质量矩阵的频率域有限元电路建模方法
2014 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2014-11-20 DOI: 10.1109/ISEMC.2014.6898983
J. Zhu, Duo Chen, Qing He, D. Jiao
{"title":"A mass-matrix based frequency-domain finite-element method accelerated by a reduced eigenspace method for circuit modeling","authors":"J. Zhu, Duo Chen, Qing He, D. Jiao","doi":"10.1109/ISEMC.2014.6898983","DOIUrl":"https://doi.org/10.1109/ISEMC.2014.6898983","url":null,"abstract":"The mass matrix resulting from a finite-element-method (FEM) based electromagnetic analysis possesses favorable properties that can be exploited to reduce the computational time and memory cost for large-scale circuit modeling. In this paper, a mass-matrix based frequency-domain FEM method is developed for the analysis of integrated circuits. Its convergence is theoretically proved, and its efficiency is accelerated by a reduced eigenspace method.","PeriodicalId":279929,"journal":{"name":"2014 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"4 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-11-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133851688","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Characterizing a Device's susceptibility to broadband signals: A case study 表征设备对宽带信号的敏感性:一个案例研究
2014 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2014-11-20 DOI: 10.1109/ISEMC.2014.6898987
J. Coder, J. Ladbury, David F. Hunter
{"title":"Characterizing a Device's susceptibility to broadband signals: A case study","authors":"J. Coder, J. Ladbury, David F. Hunter","doi":"10.1109/ISEMC.2014.6898987","DOIUrl":"https://doi.org/10.1109/ISEMC.2014.6898987","url":null,"abstract":"Electronic devices are commonly tested for their susceptibility to radiated signals which they may be exposed to during normal operation. A reverberation chamber is well suited to perform this type of testing because it can expose the device under test to a radiated signal from all polarization and incidence angles. Testing devices by exposing them to a narrow-band or CW signal has been well documented. However, with the increase in broadband communication signals, device manufacturers and users are becoming more interested in the device's performance when exposed to a broadband signal. In this case study, measurements of cable television/telecommunications equipment (i.e., set-top boxes, modems) are used to examine the potential for interference from 4G/LTE signals. We show that several difficulties arise when testing with broadband signals, particularly when measuring the incident electric field. We also examine how different device configurations (i.e., cabling and/or the use of splitters) can significantly change device performance.","PeriodicalId":279929,"journal":{"name":"2014 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"85 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-11-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132467772","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 6
Impact of clock net routing on EMC emissions performance of automotive electronic modules 时钟网路由对汽车电子模块电磁兼容发射性能的影响
2014 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2014-11-20 DOI: 10.1109/ISEMC.2014.6899026
S. Filipov, A. Hadzhikrasteva, C. Nandyala, S. Mee, K. Russa, A. Lutz
{"title":"Impact of clock net routing on EMC emissions performance of automotive electronic modules","authors":"S. Filipov, A. Hadzhikrasteva, C. Nandyala, S. Mee, K. Russa, A. Lutz","doi":"10.1109/ISEMC.2014.6899026","DOIUrl":"https://doi.org/10.1109/ISEMC.2014.6899026","url":null,"abstract":"Modern automotive electronic products with highspeed digital interfaces pose design challenges in the areas of signal integrity (SI) and electromagnetic compatibility (EMC). On one hand, the manufacturer must comply with legal and industry specific EMC requirements and on the other hand, the product is expected to function seamlessly over all environmental conditions and process tolerances. Numerous guidelines have been published on how to optimize the design performance in these two areas (EMC & SI) but few address the impact one can have on the other. This paper examines the impact several SI compliant routing patterns have on EMC emissions performance.","PeriodicalId":279929,"journal":{"name":"2014 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"114 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-11-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132471856","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Size of devices to be measured at 3 m 待测器件的尺寸为3米
2014 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2014-11-20 DOI: 10.1109/ISEMC.2014.6899102
A. Griffin
{"title":"Size of devices to be measured at 3 m","authors":"A. Griffin","doi":"10.1109/ISEMC.2014.6899102","DOIUrl":"https://doi.org/10.1109/ISEMC.2014.6899102","url":null,"abstract":"This paper addresses the issues of the size of equipment that should be measure at 3 m, for radiated electric field emissions, in the frequency range 30 MHz to 1 GHz. Different standards take a different approach and therefore it would beneficial if a common approach was adopted based upon measurements and from a pragmatic perspective and not just `because we know'.","PeriodicalId":279929,"journal":{"name":"2014 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"5 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-11-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134440172","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Simulation and analysis for power frequency electric field of building close to power transmission lines 输电线路附近建筑工频电场仿真与分析
2014 IEEE International Symposium on Electromagnetic Compatibility (EMC) Pub Date : 2014-11-20 DOI: 10.1109/ISEMC.2014.6899014
Bin Yang, Shuhong Wang, Qiang Wang, Han Du, Youpeng Huangfu
{"title":"Simulation and analysis for power frequency electric field of building close to power transmission lines","authors":"Bin Yang, Shuhong Wang, Qiang Wang, Han Du, Youpeng Huangfu","doi":"10.1109/ISEMC.2014.6899014","DOIUrl":"https://doi.org/10.1109/ISEMC.2014.6899014","url":null,"abstract":"Based on the design demands of the 330kV overhead transmission lines, the power frequency electric field for the power transmission lines near and over the building is simulated and analyzed in this paper. The 3-dimentional (3D) Finite Element Method (FEM) is employed to analyze the distribution of the electric field at the level of 1.5m above the ground around and inside a typical building model. The influences on electric field distribution of building located near and under the line are considered. A three-floor building model, which can be constructed with different materials, is proposed. The computational results show the shielding effect on the electric field distribution of the building and large electric field distortion near the outline of the building. The influence on the electric field intensity of the material of the building, the transmission line height, the number of the floors and the orientation of the window is respectively discussed, which can provide important references for the design and construction of the power transmission lines.","PeriodicalId":279929,"journal":{"name":"2014 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"42 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-11-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134010714","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
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