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2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME)最新文献

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Shunt less current monitoring technique: Alternative current measurement method, voltage drop on wires due to supply variation 并联小电流监测技术:交流电流测量方法，由于电源变化导致导线电压下降
2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2013-10-01 DOI: 10.1109/SIITME.2013.6743672
T. Dachin, D. Pitica, G. Chindris
{"title":"Shunt less current monitoring technique: Alternative current measurement method, voltage drop on wires due to supply variation","authors":"T. Dachin, D. Pitica, G. Chindris","doi":"10.1109/SIITME.2013.6743672","DOIUrl":"https://doi.org/10.1109/SIITME.2013.6743672","url":null,"abstract":"The paper proposes an alternative way of measuring the current of an application using an linear actuator. The goal is to stop the application's supply when the current's value will reach a pre determined value. Using the supply's voltage variations it's quite tricky due to the need of knowing the exact value of voltage variation linked to the current consumed.","PeriodicalId":267846,"journal":{"name":"2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"31 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128433606","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Electro-magnetic actuated vibrating platform 电磁驱动振动平台
2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2013-10-01 DOI: 10.1109/SIITME.2013.6743683
A. Vasile, Elena-Laura Trifan, C. Bucșan, C. Micu
{"title":"Electro-magnetic actuated vibrating platform","authors":"A. Vasile, Elena-Laura Trifan, C. Bucșan, C. Micu","doi":"10.1109/SIITME.2013.6743683","DOIUrl":"https://doi.org/10.1109/SIITME.2013.6743683","url":null,"abstract":"In vibration therapy, mechanical vibrations are induced in the body while the person sits upright on a high frequency vibrating platform. Multiple meta-analyzes have shown growing interest in this type of therapy, not only to fortify muscles, for the prevention and treatment of bone decalcification (osteoporosis), but also for patients suffering from certain chronic diseases [1]. The vibrations of the platform are specific for each patient because the frequency and amplitude of the oscillations are directly related to the person's weight. The original system, which was patented [7], was an electromechanical one with limited possibilities for further research. This paper presents a low frequency electromagnetic actuated vibrating platform and the corresponding electronic control system which automatically corrects the vibrations frequency through a feedback loop. Frequency stability in this case is ± 0.5 Hz.","PeriodicalId":267846,"journal":{"name":"2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"63 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129257763","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
Modeling and simulation of inductive structures for non-invasive medical uses 非侵入性医疗用途感应结构的建模和仿真
2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2013-10-01 DOI: 10.1109/SIITME.2013.6743666
B. Mihailescu, I. Plotog, P. Svasta, C. Marghescu
{"title":"Modeling and simulation of inductive structures for non-invasive medical uses","authors":"B. Mihailescu, I. Plotog, P. Svasta, C. Marghescu","doi":"10.1109/SIITME.2013.6743666","DOIUrl":"https://doi.org/10.1109/SIITME.2013.6743666","url":null,"abstract":"This paper presents results obtained by simulating the electromagnetic field generated by an inductive planar structure with different parameters using FR4 substrate. The characterization/simulations of these passive devices were conducted using finite element software named Ansys HFSS. The key modeling considerations taken into account are: ground return path, skin depth, and dielectric stack-up simplification and via field simplification. The results were used to assess the possible usefulness of such structure for medical applications that use pulsed electromagnetic field therapy.","PeriodicalId":267846,"journal":{"name":"2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124778703","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Monitoring of metalized film capacitors degradation with impedance nonlinearity measurement 用阻抗非线性测量监测金属化薄膜电容器退化
2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2013-10-01 DOI: 10.1109/SIITME.2013.6743687
M. Placek, P. Mach
{"title":"Monitoring of metalized film capacitors degradation with impedance nonlinearity measurement","authors":"M. Placek, P. Mach","doi":"10.1109/SIITME.2013.6743687","DOIUrl":"https://doi.org/10.1109/SIITME.2013.6743687","url":null,"abstract":"Self-healing capacitors fabricated of metalized polypropylene film as the dielectric material are widely used in power electronics. Self-healing process makes elimination of local defects in these capacitors possible and extends the life-time of them. It was shown that the measuring of capacitor V/A characteristic nonlinearity is usable and effective tool for monitoring of capacitor quality. Six capacitors of this type were aged in an oven at the temperature of 90 °C for 1000 hours under normal ambient conditions and changes caused by ageing were monitored with the nonlinearity measurement. It was found that nonlinearity of capacitor grows with the time of ageing.","PeriodicalId":267846,"journal":{"name":"2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"16 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121560719","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
Soldering tests with biodegradable printed circuit boards 生物可降解印刷电路板的焊接试验
2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2013-10-01 DOI: 10.1109/SIITME.2013.6743641
A. Géczy, T. Garami, B. Kovács, D. Nagy, L. Gál, M. Ruszinkó, I. Hajdu
{"title":"Soldering tests with biodegradable printed circuit boards","authors":"A. Géczy, T. Garami, B. Kovács, D. Nagy, L. Gál, M. Ruszinkó, I. Hajdu","doi":"10.1109/SIITME.2013.6743641","DOIUrl":"https://doi.org/10.1109/SIITME.2013.6743641","url":null,"abstract":"The paper presents soldering tests on biodegradable printed circuit boards (PCB) focusing on different alternative base materials. The aim of the work was to investigate and optimize different low-temperature soldering profiles on cellulose-acetate (CA) and polylactide (PLA) biopolymer-based PCBs with the application of special lead-free solder alloy suited for the temperatures. The investigations were focused on the minimization of the heating effect on the heat-sensitive biopolymers, where on the other hand, sufficient thermal energy is required to melt the solder alloys. The soldering profiles were created with a custom vapour phase soldering (VPS) approach where the heat transfer is controlled with an adaptive height-setting, temperature tracking sample holder. The profiles were evaluated according to their heating factor values. The soldered joints were evaluated with X-Ray microscopy and Shear Tests. The deformation of the PCB tracks was also investigated. The preliminary results reveal the priority of CA for further experiments.","PeriodicalId":267846,"journal":{"name":"2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"79 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122603975","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 6
New method for calculating the necessary amount of solder paste for Pin-in-paste technology 提出了一种计算Pin-in-paste工艺中锡膏用量的新方法
2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2013-10-01 DOI: 10.1109/SIITME.2013.6743647
O. Krammer
{"title":"New method for calculating the necessary amount of solder paste for Pin-in-paste technology","authors":"O. Krammer","doi":"10.1109/SIITME.2013.6743647","DOIUrl":"https://doi.org/10.1109/SIITME.2013.6743647","url":null,"abstract":"In this paper, a new method for calculating the amount of solder paste required for Pin-in-paste technology is presented and compared to a widely used explicit expression from literature. The optimal shape of the solder profile for through-hole components is calculated with Surface Evolver, and the necessary volume is determined based on the profile calculation. The boundary conditions of the Surface Evolver calculations are the following: the solder wets until the edge of the solder pads and the contact angle is equal to the wetting angle. In the experiment, the volume is determined for different through-hole diameters and for various widths of solder pads (annular rings). The plated-hole diameter was increased from +100 μm to +750 μm compared to the diameter of a component lead, while the width of the solder ring was investigated in the range of 100 μm to 400 μm. The determined volumes were then compared to volumes calculated based on the literature expression; and a correction factor was defined.","PeriodicalId":267846,"journal":{"name":"2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"111 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114902025","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Simulator for signals from semiconductor radiation sensors used in testing of radiation measurement apparatus 用于辐射测量仪器测试的半导体辐射传感器信号模拟器
2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2013-10-01 DOI: 10.1109/SIITME.2013.6743664
I. B. Cioc, I. Lita, D. Visan
{"title":"Simulator for signals from semiconductor radiation sensors used in testing of radiation measurement apparatus","authors":"I. B. Cioc, I. Lita, D. Visan","doi":"10.1109/SIITME.2013.6743664","DOIUrl":"https://doi.org/10.1109/SIITME.2013.6743664","url":null,"abstract":"This paper presents an application for simulation and generation of signals from semiconductor radiation detectors which can be used in testing and calibrating of the processing circuitry within radiation measurement apparatus. The proposed application acts as a virtual semiconductor radiation sensor, generating the specific pulse signals delivered by the sensor processing circuitry in case of a radiation probe at the input. Signals generated by the virtual radiation sensor can be used in developing and testing phases of the signal processing circuitry and algorithms in a safe mode, without the need of any radiation source to be present at the input. For better accuracy of developing process, the simulator of the semiconductor radiation sensor can work with both simulated signal patterns and real signals acquired previously from different radiation sources.","PeriodicalId":267846,"journal":{"name":"2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"34 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128373584","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Pseudo random self-test architecture for Advanced Encryption Standard 高级加密标准的伪随机自检体系结构
2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2013-10-01 DOI: 10.1109/SIITME.2013.6743689
Flavius Opritoiu, Andreea Bozesan, M. Vladutiu
{"title":"Pseudo random self-test architecture for Advanced Encryption Standard","authors":"Flavius Opritoiu, Andreea Bozesan, M. Vladutiu","doi":"10.1109/SIITME.2013.6743689","DOIUrl":"https://doi.org/10.1109/SIITME.2013.6743689","url":null,"abstract":"A pseudo random test strategy for the AES is presented in this paper, suitable for fault tolerant cryptographic designs. The proposed solution is capable of assessing the integrity of a crypto-chip in a non-concurrent, autonomous manner. The error detection strategy relies on iterated execution of the crypto-system's components in order to reduce the complexity of the test architecture and the test length. Alternative verification structures are considered with respect to uniform pseudo random stimulation of the datapath and the key scheduler. Furthermore, the proposed test method offers a good trade-off between the length of the test process and the storage requirements for the correct responses. The article investigates the integration of the proposed error detection technique into fault tolerant designs. The presented test architecture entails reduced area overhead.","PeriodicalId":267846,"journal":{"name":"2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"12 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123828834","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
Optimal microheater Patterns with PEDOT:PSS conductors for flexible sensor applications 最佳微加热器模式与PEDOT:PSS导体柔性传感器应用
2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2013-10-01 DOI: 10.1109/SIITME.2013.6743643
C. Ionescu, N. Codreanu, P. Svasta, D. Bonfert
{"title":"Optimal microheater Patterns with PEDOT:PSS conductors for flexible sensor applications","authors":"C. Ionescu, N. Codreanu, P. Svasta, D. Bonfert","doi":"10.1109/SIITME.2013.6743643","DOIUrl":"https://doi.org/10.1109/SIITME.2013.6743643","url":null,"abstract":"This paper continues the study in the field of microheaters on flexible substrates. The idea of using flexible substrates comes together with the need for low manufacturing costs, having in mind the applications of sensors for home usage and other possible applications as monitors for buildings or basements where possible toxic gases can be accumulated, for instance mathane, carbon monoxide or carbon dioxide. In the current paper we propose the use of poly(3,4-ethylenedioxythiophene) doped with polystyrenesulfonic acid (PEDOT:PSS) as active heating element. The data from literature and our previous experiments have proven that this material can be used as resistive material having the possibility to operate within the desired range of temperatures for sensor applications, between 80 and 100 °C. The test samples with different patterns will be prepared by ink-jetting, with silver ink used as terminations.","PeriodicalId":267846,"journal":{"name":"2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"50 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127647667","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Programmable interface for a signal generator and logic analyzer system 用于信号发生器和逻辑分析仪系统的可编程接口
2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2013-10-01 DOI: 10.1109/SIITME.2013.6743680
R. Szabó, A. Gontean
{"title":"Programmable interface for a signal generator and logic analyzer system","authors":"R. Szabó, A. Gontean","doi":"10.1109/SIITME.2013.6743680","DOIUrl":"https://doi.org/10.1109/SIITME.2013.6743680","url":null,"abstract":"This paper presents a new approach for programming acquisition cards. We know that an acquisition card which can be connected to the PC sometimes can be really expensive. Very often an engineer needs to generate signals or to make an acquisition of signals. To buy an acquisition card or a signal generator and an oscilloscope can be really expensive. Fortunately for us the PC has many acquisition cards that are already built in, but many of us don't know that they have it. One acquisition card which can be programmed is the LPT or the parallel printer port. With this port we can generate and make an acquisition of digital signals. We can say that we have a built-in digital signal generator and logic analyzer (digital signal oscilloscope) system on 8 channels.","PeriodicalId":267846,"journal":{"name":"2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"31 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129421222","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
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