New method for calculating the necessary amount of solder paste for Pin-in-paste technology

2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2013-10-01 DOI:10.1109/SIITME.2013.6743647

O. Krammer

{"title":"New method for calculating the necessary amount of solder paste for Pin-in-paste technology","authors":"O. Krammer","doi":"10.1109/SIITME.2013.6743647","DOIUrl":null,"url":null,"abstract":"In this paper, a new method for calculating the amount of solder paste required for Pin-in-paste technology is presented and compared to a widely used explicit expression from literature. The optimal shape of the solder profile for through-hole components is calculated with Surface Evolver, and the necessary volume is determined based on the profile calculation. The boundary conditions of the Surface Evolver calculations are the following: the solder wets until the edge of the solder pads and the contact angle is equal to the wetting angle. In the experiment, the volume is determined for different through-hole diameters and for various widths of solder pads (annular rings). The plated-hole diameter was increased from +100 μm to +750 μm compared to the diameter of a component lead, while the width of the solder ring was investigated in the range of 100 μm to 400 μm. The determined volumes were then compared to volumes calculated based on the literature expression; and a correction factor was defined.","PeriodicalId":267846,"journal":{"name":"2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"111 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2013-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SIITME.2013.6743647","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 2

Abstract

In this paper, a new method for calculating the amount of solder paste required for Pin-in-paste technology is presented and compared to a widely used explicit expression from literature. The optimal shape of the solder profile for through-hole components is calculated with Surface Evolver, and the necessary volume is determined based on the profile calculation. The boundary conditions of the Surface Evolver calculations are the following: the solder wets until the edge of the solder pads and the contact angle is equal to the wetting angle. In the experiment, the volume is determined for different through-hole diameters and for various widths of solder pads (annular rings). The plated-hole diameter was increased from +100 μm to +750 μm compared to the diameter of a component lead, while the width of the solder ring was investigated in the range of 100 μm to 400 μm. The determined volumes were then compared to volumes calculated based on the literature expression; and a correction factor was defined.

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提出了一种计算Pin-in-paste工艺中锡膏用量的新方法

本文提出了一种计算Pin-in-paste工艺所需锡膏量的新方法，并与文献中广泛使用的显式表达式进行了比较。利用Surface Evolver计算出通孔元件焊料的最佳形状，并在此基础上确定所需的体积。Surface Evolver计算的边界条件如下:焊料湿润直到焊盘边缘和接触角等于湿润角。在实验中，确定了不同通孔直径和不同宽度的焊盘(环形环)的体积。与元件引线直径相比，焊孔直径从+100 μm增加到+750 μm，焊环宽度在100 μm到400 μm范围内进行了研究。然后将确定的体积与根据文献表达计算的体积进行比较;并定义了一个修正因子。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME)

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