2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME)最新文献

Progressive transmission line matching when encountering via mismatching 当遇到通过错配时，渐进式传输线匹配

2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2013-10-01 DOI: 10.1109/SIITME.2013.6743659

M. Daraban, D. Pitica

引用次数: 2

On change detection for improved reliability 关于改进可靠性的变更检测

2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2013-10-01 DOI: 10.1109/SIITME.2013.6743684

D. Aiordachioaie, M. Andrei

引用次数: 0

PCB layout optimization for LED backlight module using FEM simulation 基于有限元仿真的LED背光模块PCB布局优化

2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2013-10-01 DOI: 10.1109/SIITME.2013.6743657

Aurelian Botau, C. Negrea

{"title":"PCB layout optimization for LED backlight module using FEM simulation","authors":"Aurelian Botau, C. Negrea","doi":"10.1109/SIITME.2013.6743657","DOIUrl":"https://doi.org/10.1109/SIITME.2013.6743657","url":null,"abstract":"Nowadays the size of Liquid Crystal Displays (LCD) displays on the market has a continuous ascending trend which demands higher and higher resolutions. The backlight system of a LCD is the structure that offers light which passes through the liquid crystals layer. No matter what method is used, it has to provide a high luminous intensity and a uniform light distribution on screen visible surface. One significant problem in such designs is the difference in light intensity of individual LEDs due to their different junction temperatures. This paper presents a method of optimization for a LED matrix assembly, where the main purpose is to improve the thermal uniformity on the PCB in order to reduce the luminous flux output difference between the devices, while also maintaining the junction temperatures in the acceptable operating range. As a consequence, the need of custom pattern diffusers used in the LCD displays as light uniformity corrections structures can be eliminated. The method implies defining the geometry for the cooling areas on the PCB by using a specific formula obtained after curve fitting FEM simulation results.","PeriodicalId":267846,"journal":{"name":"2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"110 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122585256","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 3

Reducing lead-free soldering failures caused by Printed Circuit Board shrinkage 减少印刷电路板收缩造成的无铅焊接故障

2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2013-10-01 DOI: 10.1109/SIITME.2013.6743645

A. Géczy, L. Tersztyanszky, B. Illés, A. Kemler, A. Szabó

{"title":"Reducing lead-free soldering failures caused by Printed Circuit Board shrinkage","authors":"A. Géczy, L. Tersztyanszky, B. Illés, A. Kemler, A. Szabó","doi":"10.1109/SIITME.2013.6743645","DOIUrl":"https://doi.org/10.1109/SIITME.2013.6743645","url":null,"abstract":"The paper presents a novel approach on an emerging problem in lead-free reflow soldering technology. The trend of miniaturized SMD device application and the increasing component density cause newfound problems during the reflow process. In this work, the issue of Printed Circuit Board (PCB) shrinkage is inspected in the environment of automotive electronics production. The shrinkage effect results in linear offset on the double sided PCB along the (XY) dimensions during stencil printing of the second reflow pass. The observed phenomenon causes tombstone and bridging failures on specific fine-pitch SMD components. To investigate and obtain deeper understanding of the phenomenon, a new method was developed for the measurement of shrinkage. The novel measurement method is evaluated with a less-productive, but more precise measurement device. With the collected data it is possible to approximate the overall shrinkage of the given product. After introducing a compensation step on the stencil design (based on the measurements), it is possible to significantly reduce the quantity of failures caused by the shrinkage.","PeriodicalId":267846,"journal":{"name":"2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"34 4 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125721374","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 3

Factors influencing the formation of voids in chip component solder joints 影响芯片元件焊点空隙形成的因素

2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2013-10-01 DOI: 10.1109/SIITME.2013.6743690

M. Pantazica, P. Svasta, H. Wohlrabe, K. Wolter

引用次数: 5

Six channel AC/DC current data logger used in industrial application 六通道交流/直流电流数据记录仪用于工业应用

2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2013-10-01 DOI: 10.1109/SIITME.2013.6743678

S. Pop, V. Bande, D. Pitica

引用次数: 6

High-low impedance transformer using transmission line method 高低阻抗变压器采用传输线法

2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2013-10-01 DOI: 10.1109/SIITME.2013.6743670

R. Fang, Chia-fen Liu, Chieh-Yu Liao, Chun-Long Wang

引用次数: 0

An innovative approach towards E-health in development of tele auscultation system for heart using GSM mobile communication technology 利用GSM移动通信技术开发心脏远程听诊系统是实现电子健康的创新途径

2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2013-10-01 DOI: 10.1109/SIITME.2013.6743673

Muhammad Ahmed Khan, S. F. Jawed, Muhammad Owais Khan, Osama Mazhar

{"title":"An innovative approach towards E-health in development of tele auscultation system for heart using GSM mobile communication technology","authors":"Muhammad Ahmed Khan, S. F. Jawed, Muhammad Owais Khan, Osama Mazhar","doi":"10.1109/SIITME.2013.6743673","DOIUrl":"https://doi.org/10.1109/SIITME.2013.6743673","url":null,"abstract":"Health is one of the major issues for normal existence of human life and it is a global agenda to increase the health care facilities for the peoples who don't have an immediate access to these facilities and are living in rural and undeveloped areas. From the beginning of twenty first century field of E-health has been developed rapidly to encounter these problems properly. The healthcare infrastructure gaining betterment day by day under the shadow of E-health technologies, where using mobile phones are becoming an efficient tool in monitoring and transmitting different physiological signals. Cardiac sound is an initiative physiological parameter that is helpful for diagnosing changes in physiological conditions and disease. Hence in this research a tele auscultation system is designed for the transmission of cardiac sounds to the medical practitioner from distant place by using an electronic stethoscope through a GSM (Global System for mobile communication) technology. The physiological signals of low frequency and voltages, after amplification and filtration can be easily transmitted with low noise interference in the signal. This portable wireless cardiac sound transmission device can send heart sounds of a patient just in one call. The information about the placement of stethoscope at different position of heart can be transmitted to medical practitioner through a SMS (Short Messaging Service). For the purpose stated a GSM modem of SIM900D is used which is interfaced with a Microcontroller Unit in order to control and send instructions to modem using AT (Attention) commands. Therefore, it is concluded that the cardiac sounds of a patient can be transmitted from the distant areas to the medical practitioner for the purpose of diagnosing many illness of the patients.","PeriodicalId":267846,"journal":{"name":"2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"26 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127112763","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 5

Study and implementation of a vaporizer used in plasma equipment for heavy metals detection 用于重金属检测等离子体设备的汽化器的研究与实现

2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2013-10-01 DOI: 10.1109/SIITME.2013.6743655

T. Patarau, D. Petreus, R. Etz, C. Orian, E. Darvasi, T. Frențiu

引用次数: 1

New frontiers in education — Training in Biology for Electrical Engineers 教育的新领域——电气工程师的生物学培训

2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2013-10-01 DOI: 10.1109/SIITME.2013.6743692

M. Varga, K. Wolter

引用次数: 0