2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME)最新文献_第2页

Hardware implementation of the IDEA NXT crypto-algorithm IDEA NXT加密算法的硬件实现

2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2013-10-01 DOI: 10.1109/SIITME.2013.6743640

Andreea Bozesan, Flavius Opritoiu, M. Vladutiu

引用次数: 2

Embedding Android devices in automation systems 在自动化系统中嵌入Android设备

2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2013-10-01 DOI: 10.1109/SIITME.2013.6743676

M. Nicolae, L. Lucaci, I. Moise

引用次数: 7

Investigation of thermally generated gold nanoparticles with AFM 热生成金纳米颗粒的原子力显微镜研究

2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2013-10-01 DOI: 10.1109/SIITME.2013.6743639

A. Bonyár, Balazs Wimmer, I. Csarnovics

引用次数: 2

Modeling Galden layer formation on PCB surface during Vapour Phase Soldering 气相焊接过程中PCB表面金层形成的建模

2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2013-10-01 DOI: 10.1109/SIITME.2013.6743646

B. Illés

引用次数: 12

Multifunctional communication system controller implemented in FPGA 用FPGA实现的多功能通信系统控制器

2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2013-10-01 DOI: 10.1109/SIITME.2013.6743675

C. Lung, A. Buchman

引用次数: 2

Lead/Lead Free solder joints comparative shear tests function of working temperature and soldering thermal profile 含铅/无铅焊点比较剪切测试功能的工作温度和焊接热概况

2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2013-10-01 DOI: 10.1109/SIITME.2013.6743691

I. Plotog, G. Vărzaru, B. Mihailescu, M. Branzei, A. Bibiș, I. Cristea

引用次数: 13

Low-cost picoammeter for dielectrics 用于电介质的低成本皮安计

2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2013-10-01 DOI: 10.1109/SIITME.2013.6743651

S. Epure, R. Belea, L. Frangu

{"title":"Low-cost picoammeter for dielectrics","authors":"S. Epure, R. Belea, L. Frangu","doi":"10.1109/SIITME.2013.6743651","DOIUrl":"https://doi.org/10.1109/SIITME.2013.6743651","url":null,"abstract":"The research carried on in the field of dielectric nanomaterials requires a large amount of fast and accurate measurements, such as the current/voltage characteristics, which produce currents under the 1nA range. The size of the available devices forces them to be placed outside the measurement setup, allowing a large influence of the electric noise. Supplementary, they are unable to measure during the transient phenomena and expensive (“sourcemeters” available from different producers). This paper presents a more convenient solution (under 500 euros) for fast automatically measuring the characteristics in the range of 10pA to 1000nA. A major advantage of this device is its size (10×6×10cm), allowing it to fit into the shielding enclosure, together with the probe, needle manipulator and microscope. It allows the experimenter to specify the voltage range and the number of measuring points and it automatically provides the resulting data file, without raising neither the uncertainty level (under 10pA), nor the measuring time (down to 0.1 seconds per measuring point). The error is kept low through active guarding, mains synchronization, careful shielding and the use of extremely low bias amplifiers (3fA). The device communicates with the host computer via the galvanic isolated USB interface and does not require separate power supply (USB powered).","PeriodicalId":267846,"journal":{"name":"2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115600352","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Investigating hole filling in pin-in-paste technology for vapour phase soldering 研究了气相焊接中钉入膏体工艺的补孔方法

2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2013-10-01 DOI: 10.1109/SIITME.2013.6743644

R. Bátorfi, Richard Storcz, M. Ruszinkó

引用次数: 0

Electronic ballast in half-bridge configuration with power factor correction 带功率因数校正的半桥电子镇流器

2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2013-10-01 DOI: 10.1109/SIITME.2013.6743681

A. Taut, O. Pop, A. Grama, C. Farcas

{"title":"Electronic ballast in half-bridge configuration with power factor correction","authors":"A. Taut, O. Pop, A. Grama, C. Farcas","doi":"10.1109/SIITME.2013.6743681","DOIUrl":"https://doi.org/10.1109/SIITME.2013.6743681","url":null,"abstract":"This paper presents a study and the design with the technical aspects of implementing electronic ballast used for lighting and keeping the power of a lamp while restricting and controlling the input current during its activity. The electronic ballast circuit proposed is based on two power converters, like a boost converter with power factor correction (PFC) and an a half bridge converter with resonant circuit in order to turn on one or more lamps. Taking into account the practical and technological constraints, the necessary frequency converter must be based on a DC voltage source, a capacitive divider and a series-resonant single-phase power inverter (half-bridge converter). The need for a boost converter is explained by the fact that the half bridge converter feeds with DC voltage and the presence of a simple rectifier would not solve the problems caused by distortions on the supply network. The result obtained validates the operation of the circuit and the paper presents the waveforms for output voltage and current and the total harmonic distortion and power factor correction on input AC voltage.","PeriodicalId":267846,"journal":{"name":"2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"54 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126517443","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Sensing properties of carbon nanotube based thick film layers on foils 基于碳纳米管的薄膜传感性能研究

2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2013-10-01 DOI: 10.1109/SIITME.2013.6743638

D. Bonfert, D. Hemmetzberger, G. Klink, K. Bock, P. Svasta, C. Ionescu

引用次数: 0