2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME)最新文献

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Investigating the mechanical effect of the solder joint thickness with simulation 采用仿真方法研究了焊点厚度的力学效应

2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2013-10-01 DOI: 10.1109/SIITME.2013.6743686

T. Garami, O. Krammer

引用次数: 3

Polymer matrix composites reinforced with expanded and unexpended graphite Particles for electronic packaging applications 用膨胀和未膨胀石墨颗粒增强的聚合物基复合材料，用于电子封装应用

2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 1900-01-01 DOI: 10.1109/SIITME.2013.6743642

I. Tavman, A. Turgut, N. Horny, M. Chirtoc

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引用次数: 6

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