采用仿真方法研究了焊点厚度的力学效应

2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2013-10-01 DOI:10.1109/SIITME.2013.6743686

T. Garami, O. Krammer

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引用次数: 3

摘要

本文采用有限元模拟方法，研究了SMD (Surface Mound Device)片式电阻与PCB (Printed Circuit Board)焊盘之间不同焊点厚度对机械强度的影响。对不同钎料合金的力学效应进行了研究;对无铅合金和含铅合金进行了比较。采用有限元程序对机械载荷响应进行了计算和模拟。对0603 (1.6 × 0.8 mm)尺寸SMD电阻的焊点厚度从12 μm增加到130 μm进行了研究。采用非线性材料参数对焊点进行仿真。在有限元分析中，我们研究了剪切荷载引起的应力响应。Anand模型的解表明，焊点越厚，机械应力越小。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Investigating the mechanical effect of the solder joint thickness with simulation

In this paper, the effect of the various thickness of the solder joint between the SMD (Surface Mound Device) chip resistor and the PCB (Printed Circuit Board) pad on the mechanical strength was investigated with FEM (Finite Element Method) simulation. The mechanical effect was studied for different solder alloys too; lead-free and lead-bearing alloys were compared together. A FEM program was used to calculate and simulate the response for the mechanical loading. The solder joint of a 0603 (1.6 × 0.8 mm) size SMD resistor was investigated while the mentioned thickness was increased from 12 μm up to 130 μm. The simulation used non-linear material parameters for the solder joint. In the finite element analysis, we examined the stress response that was induced by shear load. The solution of the Anand model showed that a thicker solder joint results in a less mechanical stress.

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2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME)

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