发布求助
文献互助 智能选刊 最新文献

2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME)最新文献

筛选
英文 中文
Lead/lead free solder joints comparative electrical tests as function of microstructure and soldering thermal profile 含铅/无铅焊点的微观结构和焊接热特性比较电学测试
2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2013-10-01 DOI: 10.1109/SIITME.2013.6743685
M. Branzei, F. Miculescu, A. Bibiș, I. Cristea, I. Plotog, G. Vărzaru, B. Mihailescu
{"title":"Lead/lead free solder joints comparative electrical tests as function of microstructure and soldering thermal profile","authors":"M. Branzei, F. Miculescu, A. Bibiș, I. Cristea, I. Plotog, G. Vărzaru, B. Mihailescu","doi":"10.1109/SIITME.2013.6743685","DOIUrl":"https://doi.org/10.1109/SIITME.2013.6743685","url":null,"abstract":"The solder joints properties are determined by the specific morphology of their microstructure. In the paper are presented the comparative resistance measurements of the solder joints resulted by usage of lead/lead-free solder pastes from Vapor Phase Soldering Processes (VPS) having thermal profile with two different cooling rate, slow one (0.5 K/s) and rapid one (4 K/s). The results will be promote to develop the practical applications of this soldering technology and to contribute at realization of a data base useful for better selection of lead-free solder paste in the design and manufacturing area.","PeriodicalId":267846,"journal":{"name":"2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"29 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124114407","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 10
A new forward based converter with power factor correction 一种新型功率因数校正正演变换器
2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2013-10-01 DOI: 10.1109/SIITME.2013.6743650
C. Farcas, N. Palaghita, I. Ciocan, A. Cozma, A. Tulbure
{"title":"A new forward based converter with power factor correction","authors":"C. Farcas, N. Palaghita, I. Ciocan, A. Cozma, A. Tulbure","doi":"10.1109/SIITME.2013.6743650","DOIUrl":"https://doi.org/10.1109/SIITME.2013.6743650","url":null,"abstract":"The paper presents a forward converter with power factor correction. The novelty of the paper consists in a combination between a forward converter and a valley fill circuit. The auxiliary winding of forward converter is included in valley fill converter. The new converter has a high power factor. The paper will present the design, simulations and experimental results of the proposed circuit. Another important advantage of the proposed circuit is a reduced stress of the power transistor.","PeriodicalId":267846,"journal":{"name":"2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"10 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126448715","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Thermal modelling of IC packages IC封装的热建模
2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2013-10-01 DOI: 10.1109/SIITME.2013.6743662
A. Fodor, R. Jano
{"title":"Thermal modelling of IC packages","authors":"A. Fodor, R. Jano","doi":"10.1109/SIITME.2013.6743662","DOIUrl":"https://doi.org/10.1109/SIITME.2013.6743662","url":null,"abstract":"The presented work analyses the effect of the IC package on heat dissipation. Thermal simulations of three types of IC packaging have been carried out. DIP-28, TQFP-32 and MLF-32 packaging models have been implemented in SolidWorks 2012 and their efficiency in evacuating heat has been evaluated and compared. Natural cooling was investigated in an open environment and investigations in closed spaces and with forced cooling applied were made. The research focuses on accurately modelling electronic packaging of integrated components.","PeriodicalId":267846,"journal":{"name":"2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"103 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133401968","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Influence of filler concentration on frequency dependence of electrically conductive adhesive joints impedance 填料浓度对导电胶接头阻抗频率依赖性的影响
2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2013-10-01 DOI: 10.1109/SIITME.2013.6743648
P. Mach, M. Placek
{"title":"Influence of filler concentration on frequency dependence of electrically conductive adhesive joints impedance","authors":"P. Mach, M. Placek","doi":"10.1109/SIITME.2013.6743648","DOIUrl":"https://doi.org/10.1109/SIITME.2013.6743648","url":null,"abstract":"Impedance of adhesive joints formed of eight types of electrically conductive adhesives of epoxy type with silver filler was examined in the frequency range of 20 Hz-1 MHz. Adhesives with isotropic electrical conductivity and filler concentration in the range of 60-75 % (b.w.) were used for experiments. Relationship between the dependence of the joints impedance on the frequency and the filler concentration in adhesive was examined. It was found that the influence of the filler concentration on the frequency dependence of the joint impedance is very low.","PeriodicalId":267846,"journal":{"name":"2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"112 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133777940","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Adaptive noise cancellation using LabVIEW 使用LabVIEW进行自适应噪声消除
2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2013-10-01 DOI: 10.1109/SIITME.2013.6743660
C. Dumitrescu, I. Moise, B. Soare, N. Dumitru
{"title":"Adaptive noise cancellation using LabVIEW","authors":"C. Dumitrescu, I. Moise, B. Soare, N. Dumitru","doi":"10.1109/SIITME.2013.6743660","DOIUrl":"https://doi.org/10.1109/SIITME.2013.6743660","url":null,"abstract":"This paper presents the implementation of a Least-mean squares (LMS) algorithm using the graphical language LabVIEW. The LMS algorithm underpins the vast majority of current signal processing adaptive algorithms including noisecancellation, beamforming, deconvolution, equalization and medical signal analysis. From the results obtained, it will be shown that LabVIEW is a convenient and powerful method of implementing such algorithms.","PeriodicalId":267846,"journal":{"name":"2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"175 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"120947971","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Comparative analysis of two digital control algorithms for a DC-DC converter DC-DC变换器两种数字控制算法的比较分析
2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2013-10-01 DOI: 10.1109/SIITME.2013.6743654
C. Orian, D. Petreus, R. Etz, T. Patarau
{"title":"Comparative analysis of two digital control algorithms for a DC-DC converter","authors":"C. Orian, D. Petreus, R. Etz, T. Patarau","doi":"10.1109/SIITME.2013.6743654","DOIUrl":"https://doi.org/10.1109/SIITME.2013.6743654","url":null,"abstract":"This paper describes the impact of two different control algorithms on the behavior of a DC-DC step down converter. The compared algorithms are average current mode control and voltage mode control. Both feature advantages and disadvantages, with the former being more difficult to implement but yielding better dynamic parameters and the latter being easier to implement and more cost effective, but compromising on performance. A complete design of the converter is presented, including the design of the power stage, the feedback loop and other particular blocks such as the the quantizer. Experimental and simulation results will be included to prove the validity of the theoretical considerations. The resulting design supplied a vaporizer used in a spectrometric instrumentation analyzer.","PeriodicalId":267846,"journal":{"name":"2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"44 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127577685","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Two parameter extraction solutions for high temperature SiC Schottky diodes — Converging to reality 高温碳化硅肖特基二极管的两种参数提取方案——向现实收敛
2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2013-10-01 DOI: 10.1109/SIITME.2013.6743669
G. Pristavu, G. Brezeanu, F. Draghici
{"title":"Two parameter extraction solutions for high temperature SiC Schottky diodes — Converging to reality","authors":"G. Pristavu, G. Brezeanu, F. Draghici","doi":"10.1109/SIITME.2013.6743669","DOIUrl":"https://doi.org/10.1109/SIITME.2013.6743669","url":null,"abstract":"This paper presents two methods of parameter extraction for SiC Schottky diodes. These methods are implemented and tested for characteristics of real devices (SiC Schottky diodes). Extra attention is paid to how these two methods can converge to the same solution and how the extracted results can offer valuable information about potential device technology improvement.","PeriodicalId":267846,"journal":{"name":"2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"82 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126990010","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Microcontroller based health monitoring system 基于单片机的健康监测系统
2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2013-10-01 DOI: 10.1109/SIITME.2013.6743679
J. Suto, Stefan Oniga, Ioan Orha
{"title":"Microcontroller based health monitoring system","authors":"J. Suto, Stefan Oniga, Ioan Orha","doi":"10.1109/SIITME.2013.6743679","DOIUrl":"https://doi.org/10.1109/SIITME.2013.6743679","url":null,"abstract":"This paper presents a cheap and simple health monitoring system which is well applicable at home or in an institution. The system provides a good opportunity to gather and store health information about one or more observed patients. The collected information can help analyze the patient's state of heath. In the regularly gathered information the analyzer methods can search patterns which refer to symptoms. Therefore doctors can prevent or treat the initial illnesses. The system includes one Java server and lots of microcontroller based clients. Clients are responsible for sensor control and data transmission. On the server side, a Java based program handles the incoming information and stores it in a MySQL database.","PeriodicalId":267846,"journal":{"name":"2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"42 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124499966","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 8
Comparative analysis of the measurement methods for the wire's position using the TSL1410R optical sensor 采用TSL1410R光学传感器对导线位置测量方法进行比较分析
2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2013-10-01 DOI: 10.1109/SIITME.2013.6743671
V. Bande, S. Pop, D. Pitica
{"title":"Comparative analysis of the measurement methods for the wire's position using the TSL1410R optical sensor","authors":"V. Bande, S. Pop, D. Pitica","doi":"10.1109/SIITME.2013.6743671","DOIUrl":"https://doi.org/10.1109/SIITME.2013.6743671","url":null,"abstract":"In the dams monitoring procedure there are several important aspects that must be taken into consideration when the specialists must give a detail report regarding the construction behavior during the operation. One of the above physical phenomena that must be followed is the inclination of the concrete blocks during the freezing / unfreezing intervals or maximal / minimal loads (from the lake's water volume perspective) periods. That can be made using a dedicated sensor, a linear optical sensor with a large number of pixels that basically calculates the position of a wire, by its shadow position, by projecting it on the optical sensor using an area of powerful LEDs. The paper wants to identify the best method for the wire's position determination using the TSL1410R optical sensor from two points of view: the speed of the wire's position determination and the stability of the obtained results.","PeriodicalId":267846,"journal":{"name":"2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"26 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123536968","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Wireless control system for angular positioning applications 用于角度定位应用的无线控制系统
2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2013-10-01 DOI: 10.1109/SIITME.2013.6743653
D. Visan, I. Lita, I. B. Cioc
{"title":"Wireless control system for angular positioning applications","authors":"D. Visan, I. Lita, I. B. Cioc","doi":"10.1109/SIITME.2013.6743653","DOIUrl":"https://doi.org/10.1109/SIITME.2013.6743653","url":null,"abstract":"In this paper is presented an angular positioning system based on stepper motors and remotely controlled using a wireless communication link. The wireless control system is intended to be used in a wide range of applications including the robotic arm positioning, automatic orientation of photovoltaic panels, video cameras or antennas. The proposed design is compose by two modules (transmission/reception) which can communicate wireless in 2.4 GHz frequency bandwidth using direct sequence spread spectrum transmission technique (DSSS) for achieving high immunity to noises and jamming. Both modules are implemented around two PIC 16F887 microcontrollers. The radio system is based on dedicated module XTR VF 2.4 LP which is connected to the microcontroller using serial peripheral interface bus (SPI). The system uses two stepper motors for obtaining two degree of freedom in angular positioning. The accuracy of the stepper motors is of 0.9 degrees. The user interface of the system consists in a display and a small size keyboard for introducing the positioning parameters. Compared with other implementations, the novelty of the proposed system consists in a reliable hardware design, based on performing communication modules and versatile microcontrollers running complex software application that allows accurate control, without operation errors.","PeriodicalId":267846,"journal":{"name":"2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"52 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115311516","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
首页 上一页 下一页 尾页
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整，为了账户安全，请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
请完成安全验证×
相关产品
×
本文献相关产品
联系我们：info@booksci.cn Book学术提供免费学术资源搜索服务，方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号：481959085
Book学术官方微信