IC封装的热建模

2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2013-10-01 DOI:10.1109/SIITME.2013.6743662

A. Fodor, R. Jano

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引用次数: 0

摘要

本文分析了集成电路封装对散热的影响。对三种类型的集成电路封装进行了热模拟。DIP-28、TQFP-32和MLF-32封装模型已在SolidWorks 2012中实现，并对其散热效率进行了评估和比较。在开放环境中研究自然冷却，在封闭空间中研究强制冷却。研究的重点是集成元件电子封装的精确建模。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Thermal modelling of IC packages

The presented work analyses the effect of the IC package on heat dissipation. Thermal simulations of three types of IC packaging have been carried out. DIP-28, TQFP-32 and MLF-32 packaging models have been implemented in SolidWorks 2012 and their efficiency in evacuating heat has been evaluated and compared. Natural cooling was investigated in an open environment and investigations in closed spaces and with forced cooling applied were made. The research focuses on accurately modelling electronic packaging of integrated components.

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2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME)

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