填料浓度对导电胶接头阻抗频率依赖性的影响

2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2013-10-01 DOI:10.1109/SIITME.2013.6743648

P. Mach, M. Placek

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引用次数: 0

摘要

在20 hz ~ 1 MHz频率范围内，研究了8种环氧型导电胶粘剂与银填料形成的粘接接头的阻抗。实验采用各向同性电导率的胶粘剂，填料浓度在60- 75% (b.w.)之间。研究了接头阻抗随频率的变化与胶粘剂中填料浓度的关系。结果表明，填料浓度对接头阻抗频率依赖性的影响很小。

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Influence of filler concentration on frequency dependence of electrically conductive adhesive joints impedance

Impedance of adhesive joints formed of eight types of electrically conductive adhesives of epoxy type with silver filler was examined in the frequency range of 20 Hz-1 MHz. Adhesives with isotropic electrical conductivity and filler concentration in the range of 60-75 % (b.w.) were used for experiments. Relationship between the dependence of the joints impedance on the frequency and the filler concentration in adhesive was examined. It was found that the influence of the filler concentration on the frequency dependence of the joint impedance is very low.

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2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME)

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