{"title":"非侵入性医疗用途感应结构的建模和仿真","authors":"B. Mihailescu, I. Plotog, P. Svasta, C. Marghescu","doi":"10.1109/SIITME.2013.6743666","DOIUrl":null,"url":null,"abstract":"This paper presents results obtained by simulating the electromagnetic field generated by an inductive planar structure with different parameters using FR4 substrate. The characterization/simulations of these passive devices were conducted using finite element software named Ansys HFSS. The key modeling considerations taken into account are: ground return path, skin depth, and dielectric stack-up simplification and via field simplification. The results were used to assess the possible usefulness of such structure for medical applications that use pulsed electromagnetic field therapy.","PeriodicalId":267846,"journal":{"name":"2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2013-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Modeling and simulation of inductive structures for non-invasive medical uses\",\"authors\":\"B. Mihailescu, I. Plotog, P. Svasta, C. Marghescu\",\"doi\":\"10.1109/SIITME.2013.6743666\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents results obtained by simulating the electromagnetic field generated by an inductive planar structure with different parameters using FR4 substrate. The characterization/simulations of these passive devices were conducted using finite element software named Ansys HFSS. The key modeling considerations taken into account are: ground return path, skin depth, and dielectric stack-up simplification and via field simplification. The results were used to assess the possible usefulness of such structure for medical applications that use pulsed electromagnetic field therapy.\",\"PeriodicalId\":267846,\"journal\":{\"name\":\"2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME)\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2013-10-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/SIITME.2013.6743666\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SIITME.2013.6743666","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Modeling and simulation of inductive structures for non-invasive medical uses
This paper presents results obtained by simulating the electromagnetic field generated by an inductive planar structure with different parameters using FR4 substrate. The characterization/simulations of these passive devices were conducted using finite element software named Ansys HFSS. The key modeling considerations taken into account are: ground return path, skin depth, and dielectric stack-up simplification and via field simplification. The results were used to assess the possible usefulness of such structure for medical applications that use pulsed electromagnetic field therapy.