Qais Al-Gayem, Hongyuan Liu, A. Richardson, N. Burd, M. Kumar
{"title":"An on-line monitoring technique for electrode degradation in bio-fluidic microsystems","authors":"Qais Al-Gayem, Hongyuan Liu, A. Richardson, N. Burd, M. Kumar","doi":"10.1109/TEST.2010.5699269","DOIUrl":"https://doi.org/10.1109/TEST.2010.5699269","url":null,"abstract":"This paper presents a solution for detecting degradation in electrodes that interface to fluidic or biological systems that forms the basis of numerous actuation and sensing mechanisms in the bio-fluidics field. In this solution, a mid-frequency oscillation test strategy is proposed and evaluated experimentally on an array of electrodes. This technique is based on the sensitivity of the bio-fluidic interface capacitance to degradation, contamination and fouling.","PeriodicalId":265156,"journal":{"name":"2010 IEEE International Test Conference","volume":"51 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121652584","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
M. Kassab, Grzegorz Mrugalski, N. Mukherjee, J. Rajski, Jakub Janicki, J. Tyszer
{"title":"Dynamic channel allocation for higher EDT compression in SoC designs","authors":"M. Kassab, Grzegorz Mrugalski, N. Mukherjee, J. Rajski, Jakub Janicki, J. Tyszer","doi":"10.1109/TEST.2010.5699227","DOIUrl":"https://doi.org/10.1109/TEST.2010.5699227","url":null,"abstract":"The paper presents a preemptive test application scheme for system-on-chip (SoC) designs with EDT-based compression. It seamlessly combines a new test data reduction technique with a test scheduling algorithm and a novel test access mechanism. It is particularly well suited for SoC devices comprising non-isolated cores, i.e., blocks that occasionally need to be tested simultaneously.","PeriodicalId":265156,"journal":{"name":"2010 IEEE International Test Conference","volume":"21 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121941487","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Yu Huang, B. Benware, Wu-Tung Cheng, Ting-Pu Tai, F. Kuo, Yuan-Shih Chen
{"title":"Case study of scan chain diagnosis and PFA on a low yield wafer","authors":"Yu Huang, B. Benware, Wu-Tung Cheng, Ting-Pu Tai, F. Kuo, Yuan-Shih Chen","doi":"10.1109/TEST.2010.5699310","DOIUrl":"https://doi.org/10.1109/TEST.2010.5699310","url":null,"abstract":"In this poster, we share our industrial experiences on running chain diagnosis and PFA (Physical Failure Analysis) on a wafer that suffered from low yield. In addition, case study on PFA will be illustrated.","PeriodicalId":265156,"journal":{"name":"2010 IEEE International Test Conference","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130739310","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"AXIe® 2.0 and MVP-C: Open ATE software standards","authors":"Kenneth Spargo","doi":"10.1109/TEST.2010.5699294","DOIUrl":"https://doi.org/10.1109/TEST.2010.5699294","url":null,"abstract":"Open software standards AXIe®2.0 and MVP-C are introduced. The AXIe®2.0 software standard provides an interface mechanism to hardware by supplying inventory, parallel addressing (multi-site) and tester configuration services. The AXIe®2.0 is the software companion to the AXIe®1.1 hardware standard. The MVP-C standard (Multisite Virtual Pin - C language) is a set of a comprehensive, multiple level instrument API standards, which provide enhancement of existing instrumentation software standards for high performance, ATE test systems. Together, the AXIe®2.0 and MVP-C standards, supply a consistent methodology for ATE vendors to use as a partial or complete solution. For ATE customers, the option of truly mixing vendors' solutions becomes a software reality, and with it, the potential for substantial cost savings.","PeriodicalId":265156,"journal":{"name":"2010 IEEE International Test Conference","volume":"94-C 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127057609","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
T. Luo, Eric Leong, M. Chao, P. Fisher, Wen-Hsiang Chang
{"title":"Mask versus Schematic - an enhanced design-verification flow for first silicon success","authors":"T. Luo, Eric Leong, M. Chao, P. Fisher, Wen-Hsiang Chang","doi":"10.1109/TEST.2010.5699238","DOIUrl":"https://doi.org/10.1109/TEST.2010.5699238","url":null,"abstract":"Layout versus Schematic (LVS) is a commonly used technique employed at the design stage to insure the correctness of physical layout. However, as process technologies continually advance, increasingly complex boolean operations are required to produce the desired on-mask patterns, which are frequently optimized to enhance transistor performance and process margin. Design layout which has been verified by LVS may undergo substantial layout changes when subjected to the mask generation booleans, with potential implications for performance and margin estimation, particularly given the aggressive use of stressors in modern CMOS technologies. Errors in mask generation booleans, which are very difficult to detect by present primitive inspection methods, can easily result in functional failure although the initial LVS predicted success. Therefore, LVS performed at the design stage is no longer an iron-clad guarantee of chip functionality in advanced process technologies. In this paper, we introduce Mask-versus-Schematic (MVS) verification, a novel design verification flow which directly compares the schematic netlist with a netlist extracted after application of all mask generation booleans, in order to insure the correctness of the final mask data just before tapeout. Furthermore, the introduced methodology can be performed using currently available physical verification EDA tools. The experimental results presented here, using examples from some of the industry's most advanced process technology nodes, demonstrate the effectiveness and efficiency of this methodology in detecting errors resulting from mask generation boolean operations.","PeriodicalId":265156,"journal":{"name":"2010 IEEE International Test Conference","volume":"38 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116326982","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Vance Threatt, Atchyuth Gorti, J. Rearick, Shaishav Parikh, Anirudh Kadiyala, Aditya Jagirdar, Andy Halliday
{"title":"Vendor-agnostic native compression engine","authors":"Vance Threatt, Atchyuth Gorti, J. Rearick, Shaishav Parikh, Anirudh Kadiyala, Aditya Jagirdar, Andy Halliday","doi":"10.1109/TEST.2010.5699311","DOIUrl":"https://doi.org/10.1109/TEST.2010.5699311","url":null,"abstract":"Have you ever had the problem of trying to determine what compression technique to use from which tool vendor and what to do if any of that changes during the design flow?","PeriodicalId":265156,"journal":{"name":"2010 IEEE International Test Conference","volume":"109 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123677373","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Mehrdad Majzoobi, Eva L. Dyer, Ahmed Elnably, F. Koushanfar
{"title":"Rapid FPGA delay characterization using clock synthesis and sparse sampling","authors":"Mehrdad Majzoobi, Eva L. Dyer, Ahmed Elnably, F. Koushanfar","doi":"10.1109/TEST.2010.5699248","DOIUrl":"https://doi.org/10.1109/TEST.2010.5699248","url":null,"abstract":"This paper introduces a set of novel techniques for rapid post-silicon characterization of FPGA timing variability. The existing built-in self-test (BIST) methods work by incrementing the clock frequency until timing failures occur within the combinational circuit-under-test (CUT). A standing challenge for industrial adoption of post-silicon device profiling by this method is the time required for the characterization process. To perform rapid and accurate delay characterization, we introduce a number of techniques to rapidly scan the CUTs while changing the clock frequency using off-chip and on-chip clock synthesis modules. We next find a compact parametric representation of the CUT timing failure probability. Using this representation, the minimum number of frequency samples is determined to accurately estimate the delay for each CUT within the 2D FPGA array. After that, we exploit the spatial correlation of the delays across the FPGA die to measure a small subset of CUT delays from an array of CUTs and recover the remaining entries with high accuracy. Our implementation and evaluations on Xilinx Virtex 5 FPGA demonstrate that the combination of the new techniques reduces the characterization timing overhead by at least three orders of magnitude while simultaneously reducing the required storage requirements.","PeriodicalId":265156,"journal":{"name":"2010 IEEE International Test Conference","volume":"39 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124674765","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"A new method for estimating spectral performance of ADC from INL","authors":"Jingbo Duan, Le Jin, Degang Chen","doi":"10.1109/TEST.2010.5699273","DOIUrl":"https://doi.org/10.1109/TEST.2010.5699273","url":null,"abstract":"Linearity test and spectral test are two main contributors of ADC test cost which includes data acquisition time and accurate instrumentation. This paper presents a new method for estimating an ADC's spectral performance from its tested INL data. The method does not require additional dedicated test circuitry or data acquisition. The results from INL test are used to compute harmonic distortions and other spectral specifications of the ADC. Memory and computation requirements are very small comparing to those in traditional spectral testing. When combined with a BIST approach for INL testing, the proposed method offers a very low cost BIST solution to ADC spectral testing. Both simulation and experimental results show that the proposed method can estimate THD and SFDR values accurately.","PeriodicalId":265156,"journal":{"name":"2010 IEEE International Test Conference","volume":"157 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122954275","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
David Iverson, Dan Dickinson, John Masson, Christina Newman-LaBounty, Daniel Simmons, William Tanona
{"title":"Redundant core testing on the cell BE microprocessor","authors":"David Iverson, Dan Dickinson, John Masson, Christina Newman-LaBounty, Daniel Simmons, William Tanona","doi":"10.1109/TEST.2010.5699206","DOIUrl":"https://doi.org/10.1109/TEST.2010.5699206","url":null,"abstract":"The Cell Broadband Engine chip, used in Sony's PS/3 console, contains 8 identical processing cores. As only 7 of these are used in the PS/3™ application, this provides an opportunity for yield enhancement through use of this “spare” core. We are able to enjoy an 11% to 17% yield increase with this scheme, but its implementation drives about 20% of our test time and significant design and test complexity.","PeriodicalId":265156,"journal":{"name":"2010 IEEE International Test Conference","volume":"100 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134008826","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Abhay Singh, M. Shetty, S. Ravi, Ravindra Nibandhe
{"title":"Methodology for early and accurate test power estimation at RTL","authors":"Abhay Singh, M. Shetty, S. Ravi, Ravindra Nibandhe","doi":"10.1109/TEST.2010.5699305","DOIUrl":"https://doi.org/10.1109/TEST.2010.5699305","url":null,"abstract":"Test power consumption impacts various aspects of an SOC design cycle ranging from packaging and power grid design to tester power supply requirements. Obtaining early and accurate test power estimates has so far been a bottleneck since design-for-test (DFT) modifications such as scan manifest only in the gate-level circuit representation. In this work, we describe a methodology that enables us to perform early and efficient power estimation for scan-based circuits at RTL. We explain the method, its realization using features of a commercial power estimation engine and its evaluation on various production 65nm and 45nm industrial designs.","PeriodicalId":265156,"journal":{"name":"2010 IEEE International Test Conference","volume":"36 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132133736","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}