低收率晶圆片扫描链诊断与PFA的案例研究

2010 IEEE International Test Conference Pub Date : 2010-11-01 DOI:10.1109/TEST.2010.5699310

Yu Huang, B. Benware, Wu-Tung Cheng, Ting-Pu Tai, F. Kuo, Yuan-Shih Chen

{"title":"低收率晶圆片扫描链诊断与PFA的案例研究","authors":"Yu Huang, B. Benware, Wu-Tung Cheng, Ting-Pu Tai, F. Kuo, Yuan-Shih Chen","doi":"10.1109/TEST.2010.5699310","DOIUrl":null,"url":null,"abstract":"In this poster, we share our industrial experiences on running chain diagnosis and PFA (Physical Failure Analysis) on a wafer that suffered from low yield. In addition, case study on PFA will be illustrated.","PeriodicalId":265156,"journal":{"name":"2010 IEEE International Test Conference","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2010-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Case study of scan chain diagnosis and PFA on a low yield wafer\",\"authors\":\"Yu Huang, B. Benware, Wu-Tung Cheng, Ting-Pu Tai, F. Kuo, Yuan-Shih Chen\",\"doi\":\"10.1109/TEST.2010.5699310\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this poster, we share our industrial experiences on running chain diagnosis and PFA (Physical Failure Analysis) on a wafer that suffered from low yield. In addition, case study on PFA will be illustrated.\",\"PeriodicalId\":265156,\"journal\":{\"name\":\"2010 IEEE International Test Conference\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2010-11-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2010 IEEE International Test Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/TEST.2010.5699310\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2010 IEEE International Test Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/TEST.2010.5699310","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 0

摘要

在这张海报中，我们分享了我们在运行链诊断和PFA(物理故障分析)方面的工业经验，以解决晶圆片的低产量问题。此外，还将举例说明PFA的案例研究。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

Case study of scan chain diagnosis and PFA on a low yield wafer

In this poster, we share our industrial experiences on running chain diagnosis and PFA (Physical Failure Analysis) on a wafer that suffered from low yield. In addition, case study on PFA will be illustrated.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

2010 IEEE International Test Conference

自引率

0.00%

发文量