2009 11th Electronics Packaging Technology Conference最新文献

{"title":"Study of electromagnetic interference analysis and solution for PoP packaging","authors":"Chin-Ting Kuo, S. Wu","doi":"10.1109/EPTC.2009.5416489","DOIUrl":"https://doi.org/10.1109/EPTC.2009.5416489","url":null,"abstract":"High density package have developed rapidly in a few years, and let electronic device get into Microminiaturization Age. PoP packaging is just an example. It achieves high density by stacking packages but also brings some electrical problems. In this study, electromagnetic interference (EMI) effect of PoP packaging is presented. Three topics are proposed for PoP packaging application. First, two stacked substrates are performed with FR4 dielectric in 8×4mm size. By using different type of transmission line, the effects of EMI are discussed. Second, focusing on incomplete shape ground planes cause return path discontinuous and bring EMI problems. Last, plating through hold (PTH) is applied to reduce EMI effect. We hope to find out some solutions improving EMI for PoP packaging application.","PeriodicalId":256843,"journal":{"name":"2009 11th Electronics Packaging Technology Conference","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130700057","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"A novel approach to die attach: Magnetic rollers with substrate thickness detection capability","authors":"R. Vittal, R. Vemal","doi":"10.1109/EPTC.2009.5416450","DOIUrl":"https://doi.org/10.1109/EPTC.2009.5416450","url":null,"abstract":"IC Manufacturing has become a critical operation with increasing requests for zero defective ppm, and the core front end processes such as wire bonding and die attach remain the main focus when a new material is introduced. Die attach in particular holds importance as it is the very basis of creating support for the die and subsequent connections which need to be made. However, in high volume manufacturing, there are many packages which need to be processed on a single die attach module, and conversions are necessary. These conversions are necessary for different substrate sizes and package types. Due to the design of the current die attach substrate rollers, there is much manual handling in tightening and positioning the rollers on the substrate. Some of the problems that have cropped up in the past include die attach epoxy on wire bond lead (due to poor roller tightening), substrate mask crack (excessive force from the rollers) and gradual wear and tear of the roller screws. This paper introduces a novel concept which does not require conversions between package types, and eliminates the opportunity for error. This concept will take into consideration the thickness of the substrate using magnetic substrate rollers which have sensors in them for thickness detection which will help improve the die placement accuracy. Two MAPBGA packages will be used to explain this concept and how it works thereof.","PeriodicalId":256843,"journal":{"name":"2009 11th Electronics Packaging Technology Conference","volume":"22 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131040231","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Stacked wire interconnect technology — Cu wire on Au bump bonding methodology","authors":"L. San, V. Krishna, C. C. Fei","doi":"10.1109/EPTC.2009.5416453","DOIUrl":"https://doi.org/10.1109/EPTC.2009.5416453","url":null,"abstract":"Historically in the semiconductor industry, majority of interconnect materials used for wire bonding are Au and Al wires which are matured technologies. In regards of today's range of advance packages, thin metallization (<0.8µm) remains a challenges for Back End assembly, especially on power semiconductor with thicker wire interconnects. In quest of this requirement, a new interconnect method have been developed by placing Au bump first on thin Al bond pad metallization follow by conventional Cu wire bonding, which effectively enables 50µm Cu wire bonding on thin metallization without changes on existing Front End technologies. It also prevents changing on current chips design and helps on overall product cost saving. Furthermore, this new convention of bonding also helps with packages with large down-sets between leads and die-pads. While Au-Al interface IMC behavior has been well established over the years, substantial investigations have been done into the Cu-Al interface IMC in the recent years. However, with this new interconnect method, a new Cu-Au-Al interface was introduced, hence this Cu-Au-Al interface integrity is yet to be assessed and study. In this paper the characteristic and the behavior of Cu-Au-Al interface have been study where the samples have subjected to High Temperature Storage Life @150oC up to 2000hrs. Assessment results reveal a good integrity of Cu-Au interface, with no obvious formations of kirkendall voids or cracks. The IMC layer was found to have slow growth rates compared to the Au-Al system. High Temperature storage and humidity stress tests have shown good bond integrity and reliability, with minimal drop in the pull & shear results.","PeriodicalId":256843,"journal":{"name":"2009 11th Electronics Packaging Technology Conference","volume":"60 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134468645","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Whole-field board strain and displacement characterization during drop impact using a single camera DIC technique","authors":"Fabian Zhi De Lim, L.B. Tan, C. Quan, T. Y. Tee","doi":"10.1109/EPTC.2009.5416468","DOIUrl":"https://doi.org/10.1109/EPTC.2009.5416468","url":null,"abstract":"A single-camera technique has been developed to evaluate inplane strains and out-of-plane displacement experienced by a printed circuit board assembly under drop impact. The technique essentially employs a high-speed camera to capture images of the deflecting board surface that had been spray painted to produce fine speckles. A code developed by the Experimental Mechanics Laboratory, NUS, was then used to process the series of images during the period of board flexure by speckle correlation to obtain board strains and deflection data. The results show very good correlation with those obtained from strain gauge technique. Furthermore, as the investigation focuses on dynamic impact, the capturing of localized strain fields close to features such as edges of microelectronic packages and screw/constraint locations, as well as, the overall view of the general board warpage/flexure during different loading conditions makes it a superior method compared to the strain gauge technique that provides only localized data. The single-camera DIC technique takes away the hassle of the traditional two-camera setup and reduces cost of inventory especially for very expensive instruments such as high-speed cameras and lenses. The single-camera DIC technique is a non-contact measurement technique that is easy to setup and implement compared to the strain gauge technique that is a contact method. Mounting of multiple gauges on a flexible specimen such as a PCB may also artificially stiffen the specimen which results in inaccurate data. Furthermore, the DIC method which relies on sprayed particles has spatial resolution that is determined by the smallest speckle that can be observed by the camera, whereas for hard-to-reach places or locations with limited flat surfaces, the use of strain gauges may not be feasible. The singlecamera DIC technique not only provides applications to qualitative investigation of board or package deformation but also in material characterization (where specimens can be tested in tension or shear and the material properties and responses evaluated together with full-field profiles of their cross-sections); and crack studies (to evaluate full-field strain/stress concentration regions close to notches or other geometrical discontinuities).","PeriodicalId":256843,"journal":{"name":"2009 11th Electronics Packaging Technology Conference","volume":"19 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131263567","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Reliability study of low cost alternative Ag bonding wire with various bond pad materials","authors":"K. Yoo, Chul Uhm, Taeri Kwon, J. Cho, J. Moon","doi":"10.1109/EPTC.2009.5416424","DOIUrl":"https://doi.org/10.1109/EPTC.2009.5416424","url":null,"abstract":"There have been many studies on replacing Au bonding wire with other bonding wire materials, because the cost of Au has dramatically increased by approximately 2~3 times in recent years. When replacing part of the bond pad with a noble metal, Ag bonding wire is of particular interest due to its superior electrical properties, lower cost and similar mechanical properties as compared with Au. Ag bonding wire is thermosonically bonded to 3 kinds of bond pad (Al, Au and Pd) and aged at high temperature (175°C). Then, the bondability and interface reactions are characterized at each bond pad. In the case of Ag-Al bonding, 2 kinds of intermediate phases were observed and the composition ratios of Ag and Al in these phases were 4:1 and 2:1, respectively. After 300 hrs of aging, cracks were formed in these intermediate phases and ball-lift failure occurred. However, in the case of the noble metal bond pad, a solid solution was formed between the Ag wire and bond pad and no voids or cracks were formed. This shows the robust bonding characteristics. The diffusion layer was observed and the diffraction pattern was analyzed by TEM (Transmission Electron microscopy). The Au-Al bond reliability was also characterized by a comparative study. In this study, Ag bonding wire is proposed as an alternative to Au bonding wire for noble metal pads. Also, the thermal reliability is reviewed and the failure mechanisms are verified with various bond pads.","PeriodicalId":256843,"journal":{"name":"2009 11th Electronics Packaging Technology Conference","volume":"40 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134075141","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"The equivalent diameter of copper wire and gold wire based on the sweep stiffness evaluation in semiconductor packaging","authors":"H. Kung, Hung-Shyong Chen","doi":"10.1109/EPTC.2009.5416578","DOIUrl":"https://doi.org/10.1109/EPTC.2009.5416578","url":null,"abstract":"As gold content accounts for the majority of bonding wire expense, wire diameter reduction is an effective way to reduce cost. However, it had been proved by authors' previous studies that the smaller the wire diameter is used, the smaller the sweep stiffness of wire bond will is. The lower sweep stiffness of the wire bond will always cause higher risk of wire sweep. To reduce cost, copper wire is an alterative way to replace gold wire. The advantages of using Cu instead of Au wire are the lower price, the higher electrical conductivity and the high resistance to wire sweep during plastic encapsulation, although, the oxidation problem of copper wire during bonding process needs to be overcome in the future. From the material property point of view, Cu is harder than Au, which represents the possible smaller diameter of wire can be used. Moreover, the introduction of Cu wire will lead to the further development of smaller pitch devices. In this paper, the corresponding diameters of gold wire and copper wire will be presented by the evaluation of sweep stiffness of wire bonds. Based on the results of sweep stiffness, the listed tables for the appropriate choice of gold wire diameter versus copper wire diameter can be proposed to reduce cost and, furthermore, provide smaller allowance standard of fine pitch in a chip.","PeriodicalId":256843,"journal":{"name":"2009 11th Electronics Packaging Technology Conference","volume":"48 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134109202","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Preparation and properties of epoxy resin/silicone hybrids for electronic applications","authors":"Seon-Suk Lee, G. Song, D. W. Lee, H. Kim, K. H. Kang, D. Lee","doi":"10.1109/EPTC.2009.5416525","DOIUrl":"https://doi.org/10.1109/EPTC.2009.5416525","url":null,"abstract":"Epoxy resin/silicone hybrids were synthesized through the cationic polymerization of a cycloaliphatic epoxy resin and a hydroxy-terminated poly(dimethyl siloxane) (PDMS) in different molar ratios. Molar ratios of the epoxy resin and silicone for the hybrids were 1/1, 1/0.75, 1/0.5, 1/0.25. 3-Glycidoxypropyl-trimethoxysilane (GPTMS) was also added to the epoxy resin/silicone mixtures to improve the transparency by the reaction between GPTMS and the resin mixtures. The hybrids of epoxy resin/silicone became transparent with increasing the content of PDMS. The addition of GPTMS resulted in the large increase of transparency of the hybrids even at lower concentration of PDMS. Some opaque hybrid samples showed two glass transition temperatures in the thermograms obtained with differential scanning calorimetery (DSC). In case of the hybrids containing GPTMS, nanoparticles of silica were observed in transmission electron microscopy (TEM) images even though they appeared highly transparent after cure.","PeriodicalId":256843,"journal":{"name":"2009 11th Electronics Packaging Technology Conference","volume":"48 5 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130018488","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Stretchable electronic systems: Realization and applications","authors":"T. Loher, M. Seckel, R. Vieroth, C. Dils, C. Kallmayer, A. Ostmann, R. Aschenbrenner, H. Reichl","doi":"10.1109/EPTC.2009.5416416","DOIUrl":"https://doi.org/10.1109/EPTC.2009.5416416","url":null,"abstract":"Commonplace electronic appliances for consumer or industrial use are still mostly rigid or at maximum flexible entities. The flexibility of foldable units like laptops or cell phones is usually realized through flexible circuit board (FCB) interconnectors. Although flexibility allows for considerably enhanced degrees of freedom in design, it is not compatible with more complex three dimensional curvatures and dynamics thereof. In the past years a number or approaches to realize stretchable electronic circuits in order to reach beyond unidirectional bending or folding of electronics have been reported. In the frame of the European Project STELLA a particular fabrication technology for stretchable electronic systems has been developed at Technische Universitaet Berlin. This technology, termed ?stretchable circuit board? (SCB) technology, is derived from conventional printed circuit board manufacturing. Stretchability of the boards is enabled by (i) using polyurethane instead of FR4 or polyimide as a carrier material of the copper structures and (ii) a meandering design of the Cu interconnects between commercial (rigid) electronic components. Such boards can be (once) extended by up to 300% before fracture of the Cu interconnections. For repeated elongation/relaxation cycles elongations with a few percent are allowable in order reach high cycle numbers. Electronic components are assembled after local application of a solder mask and surface finish for solderability. The electronic interconnection is established using a low temperature solder alloy (SnBi, Tm=142?C). For protection and enhanced system robustness all components are subsequently encapsulated within a polyurethane capping. Systems thus realized can be readily attached to different kinds of surfaces. Most interesting for various application cases is the easy attachment to textile substrates by a simple lamination process. The field use case studies of stretchable systems in the frame of the STELLA are mostly sensor applications in the field of medical electronics like a breathing frequency monitor for babies, a shoe insole pressure sensor for diabetes patients, or a band aid inlay to measure pressure and humidity of an acute wound when pressure therapy is applied. The latter application will be described in more detail since different aspects of bio-medical applications can be explained with this example. Another emerging field of applications is textile electronics, where it has been proven, that stretchable electronics can serve a versatile building blocks for complex electronic systems integrated in textiles.","PeriodicalId":256843,"journal":{"name":"2009 11th Electronics Packaging Technology Conference","volume":"36 4","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"113992976","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Integrated modelling for simulation in the electronics manufacturing domain","authors":"L. Quintero, A. West, D. Velandia, P. Conway, D. Whalley","doi":"10.1109/EPTC.2009.5416541","DOIUrl":"https://doi.org/10.1109/EPTC.2009.5416541","url":null,"abstract":"Electronics manufacturing is a commercially challenging sector that requires continuous improvement for organisations to remain competitive. Modelling and simulation are key tools to support this goal. Many techniques have been developed to model the individual elements of a manufacturing system. However, integrated approaches that cover all the customer requirements and can be easily translated into executable models are still needed. An integrated approach to cover this need is presented in this paper. The approach is based on a set of models selected and integrated in a single consistent structure. The development of integrated models is achieved through a simulation tool that supports agility. The support provided by the tool in terms of manufacturing systems redesign is demonstrated through a case study in the printed circuit assembly manufacturing domain. Finally, the potential of the tool to offer design for manufacturing (DfM) support is explored at the end of the paper. The demonstration of this capability is part of ongoing research.","PeriodicalId":256843,"journal":{"name":"2009 11th Electronics Packaging Technology Conference","volume":"26 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131788960","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Optimizing manufacturing process of printed electronics","authors":"B. Salam, H. Gan, B. Lok, L. Albert","doi":"10.1109/EPTC.2009.5416556","DOIUrl":"https://doi.org/10.1109/EPTC.2009.5416556","url":null,"abstract":"Printed electronics generally refers to the creation of electronic functionality, e.g. conducting circuitry, electrical components, by means of conventional printing techniques on common media such as plastics and paper. The main benefit of printed electronics is the simplified fabrication process, because of the elimination of the complex photolithography process. This means lower cost and shorter cycle time. However, several challenges must still be addressed, such as reliability, electrical performance and peripheral interfacing. Hereby peripheral interfacing was addressed, in particular the manufacturing process of the printed interconnects was studied. The study was conducted following the 2(7–4) fractional factorial design of experiment (DOE) method. Experimental parameters were curing temperature, curing time, pad thickness, pad sizes, solder alloys, cleaning time and number of reflows. Results of the study include effects of the parameters on shear strength of the printed interconnects and the recommendation of values to best employ.","PeriodicalId":256843,"journal":{"name":"2009 11th Electronics Packaging Technology Conference","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129355939","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}