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Proceedings of Electrical Performance of Electronic Packaging最新文献

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Reduction of circuit complexity by elimination of internal nodes in the circuit modeling of planar interconnection structures 通过消除平面互连结构电路建模中的内部节点来降低电路复杂度
Proceedings of Electrical Performance of Electronic Packaging Pub Date : 1995-10-02 DOI: 10.1109/EPEP.1995.524901
G. Coen, D. De Zutter
{"title":"Reduction of circuit complexity by elimination of internal nodes in the circuit modeling of planar interconnection structures","authors":"G. Coen, D. De Zutter","doi":"10.1109/EPEP.1995.524901","DOIUrl":"https://doi.org/10.1109/EPEP.1995.524901","url":null,"abstract":"The authors have developed a novel technique for the automatic derivation of equivalent RLC-networks for general microstrip interconnection discontinuities. An essential step in the technique is the reduction of the complexity of the complex lumped circuit model obtained by applying the method of moments to the considered microstrip discontinuity. In this paper, we present the concepts, algorithms and mathematical manipulations of this reduction scheme. The mathematics are based on the tensor analysis of networks and on network diakoptics, both developed by Kron.","PeriodicalId":253331,"journal":{"name":"Proceedings of Electrical Performance of Electronic Packaging","volume":"44 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-10-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115880485","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Millimeter-wave characterization of several substrate materials for automotive applications 几种汽车基板材料的毫米波特性
Proceedings of Electrical Performance of Electronic Packaging Pub Date : 1995-10-02 DOI: 10.1109/EPEP.1995.524876
R. Sturdivant
{"title":"Millimeter-wave characterization of several substrate materials for automotive applications","authors":"R. Sturdivant","doi":"10.1109/EPEP.1995.524876","DOIUrl":"https://doi.org/10.1109/EPEP.1995.524876","url":null,"abstract":"Automotive radar systems such as collision warning, which are under development are driving the advancement of low cost millimeter-wave materials, and processes. This is especially true of material properties data. These automotive systems operate in the 30-100 GHz range. However, most vendor specifications for substrates give dielectric constant and loss tangent at a frequency of 10 GHz or lower. Several test methods have been developed over the years to obtain this type of data. These methods are compared, and one is used to evaluate LTCC from Ferro Corporation, commercial grade TMM from Rogers Corporation, and reinforced Teflon from Allied Signal at 95 GHz. The test method is described and test data is presented.","PeriodicalId":253331,"journal":{"name":"Proceedings of Electrical Performance of Electronic Packaging","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-10-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115358751","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Via coupling within rectangular power-ground planes 通过在矩形电源-地平面内的耦合
Proceedings of Electrical Performance of Electronic Packaging Pub Date : 1995-10-02 DOI: 10.1109/EPEP.1995.524695
J. Parker
{"title":"Via coupling within rectangular power-ground planes","authors":"J. Parker","doi":"10.1109/EPEP.1995.524695","DOIUrl":"https://doi.org/10.1109/EPEP.1995.524695","url":null,"abstract":"Convenient formulas are presented for both frequency-domain mutual impedance, and time-domain voltage waveforms. These expressions are valid for arbitrary via locations, and take into account all edge reflections. Skin effect is included within the frequency domain formulas.","PeriodicalId":253331,"journal":{"name":"Proceedings of Electrical Performance of Electronic Packaging","volume":"53 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-10-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126880087","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 6
A new approach to signal integrity analysis of high-speed packaging 高速封装信号完整性分析的新方法
Proceedings of Electrical Performance of Electronic Packaging Pub Date : 1995-10-02 DOI: 10.1109/EPEP.1995.524903
Yuzhe Chen, Zhaoqing Chen, Zhonghua Wu, Danwei Xue, J. Fang
{"title":"A new approach to signal integrity analysis of high-speed packaging","authors":"Yuzhe Chen, Zhaoqing Chen, Zhonghua Wu, Danwei Xue, J. Fang","doi":"10.1109/EPEP.1995.524903","DOIUrl":"https://doi.org/10.1109/EPEP.1995.524903","url":null,"abstract":"A signal integrity analysis program that simultaneously performs the electromagnetic field simulation and the circuit simulation is introduced in this paper. The electromagnetic field simulation algorithms are based on special geometric features of packaging structures and can run two to four orders of magnitude faster than general-purpose electromagnetic tools. The use of the distributed circuit simulation technique drastically reduces the simulation time for lumped circuit components. This program can promptly simulate practical packages of tens of power/ground planes and thousands of vias and signal traces, while considering signal integrity problems such as signal delay, distortion, reflection, coupling, and power/ground noise. The accuracy of the simulated results is verified by measurements.","PeriodicalId":253331,"journal":{"name":"Proceedings of Electrical Performance of Electronic Packaging","volume":"120 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-10-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128070801","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 33
Recent progress in the simulation of high speed VLSI interconnects 高速VLSI互连仿真的最新进展
Proceedings of Electrical Performance of Electronic Packaging Pub Date : 1995-10-02 DOI: 10.1109/EPEP.1995.524892
M. Nakhla, E. Chiprout, R. Achar, R. Khazaka
{"title":"Recent progress in the simulation of high speed VLSI interconnects","authors":"M. Nakhla, E. Chiprout, R. Achar, R. Khazaka","doi":"10.1109/EPEP.1995.524892","DOIUrl":"https://doi.org/10.1109/EPEP.1995.524892","url":null,"abstract":"This paper presents an overview of recent progress in the simulation and modeling of VLSI interconnects using moment matching techniques which provide a speed-up of 1-3 orders of magnitude over conventional methods. Interconnects are modeled as lossy coupled transmission lines with frequency dependent parameters.","PeriodicalId":253331,"journal":{"name":"Proceedings of Electrical Performance of Electronic Packaging","volume":"187 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-10-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114357864","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
The importance of retardation in PEEC models for electrical interconnect and package (EIP) applications 延迟在电气互连和封装(EIP)应用的PEEC模型中的重要性
Proceedings of Electrical Performance of Electronic Packaging Pub Date : 1995-10-02 DOI: 10.1109/EPEP.1995.524902
A. Ruehli, E. Chiprout
{"title":"The importance of retardation in PEEC models for electrical interconnect and package (EIP) applications","authors":"A. Ruehli, E. Chiprout","doi":"10.1109/EPEP.1995.524902","DOIUrl":"https://doi.org/10.1109/EPEP.1995.524902","url":null,"abstract":"Partial Element Equivalent Circuit (PEEC) models have been employed in both the EMI (Electro-Magnetic Interference) as well as the EIP (Electrical Interconnect and Package) areas. It is generally assumed that the retardation between the circuit elements can be ignored for EIP problems since the radiated fields are not of interest for this application. In this paper, we give some insight into the importance of retardation for EIP problems.","PeriodicalId":253331,"journal":{"name":"Proceedings of Electrical Performance of Electronic Packaging","volume":"182 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-10-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116342513","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
Effect of package shape on spurious coupling among microstrip discontinuities 封装形状对微带不连续间杂散耦合的影响
Proceedings of Electrical Performance of Electronic Packaging Pub Date : 1995-10-02 DOI: 10.1109/EPEP.1995.524890
K. Gupta, H. Cebi, C. Thng
{"title":"Effect of package shape on spurious coupling among microstrip discontinuities","authors":"K. Gupta, H. Cebi, C. Thng","doi":"10.1109/EPEP.1995.524890","DOIUrl":"https://doi.org/10.1109/EPEP.1995.524890","url":null,"abstract":"Effects of a metallic package on the performance of a microstrip circuit are attributed mainly to the modifications of spurious couplings among various discontinuities. This paper describes a method for computing the effect of the package shape on the interactions among discontinuities.","PeriodicalId":253331,"journal":{"name":"Proceedings of Electrical Performance of Electronic Packaging","volume":"3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-10-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133589313","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
The Impedance Transformation Technique for the Elimination of Numerical Errors in the Simulation of 阻抗变换技术消除仿真中的数值误差
Proceedings of Electrical Performance of Electronic Packaging Pub Date : 1995-10-02 DOI: 10.1109/EPEP.1995.524860
Zhonghua Wu, J. Fang
{"title":"The Impedance Transformation Technique for the Elimination of Numerical Errors in the Simulation of","authors":"Zhonghua Wu, J. Fang","doi":"10.1109/EPEP.1995.524860","DOIUrl":"https://doi.org/10.1109/EPEP.1995.524860","url":null,"abstract":"As integrated circuits operated in higher clock rates and shorter transition times, the dimension of the off-chip interconnection and the packaging size become comparable with the wave length. Such a trend makes electromagnetic field simulations increasingly necessary. For a multilayer packaging structure with signal vias, traces and power/ground planes, the electromagnetic fields between metal planes can be decomposed into several modes and each of which can be simulated very efficiently. Instead of using the inaccurate effective inductor model, we numerically solve the differential equations of the corresponding electromagnetic fields to simulate transient voltage fluctuations on power and ground planes. The metal planes are discretized by numerical meshes and electromagnetic fields are solved by the finite-difference method [ 11.","PeriodicalId":253331,"journal":{"name":"Proceedings of Electrical Performance of Electronic Packaging","volume":"208 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-10-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123378079","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Design method of a metallic enclosure considering EMI using a 3D-FEM 考虑电磁干扰的金属外壳三维有限元设计方法
Proceedings of Electrical Performance of Electronic Packaging Pub Date : 1995-10-02 DOI: 10.1109/EPEP.1995.524696
S. Tanabe, N. Nagano, T. Itoh, Y. Murato, S. Mizukawa, K. Sato
{"title":"Design method of a metallic enclosure considering EMI using a 3D-FEM","authors":"S. Tanabe, N. Nagano, T. Itoh, Y. Murato, S. Mizukawa, K. Sato","doi":"10.1109/EPEP.1995.524696","DOIUrl":"https://doi.org/10.1109/EPEP.1995.524696","url":null,"abstract":"The leakage of electromagnetic radiation from a metallic enclosure with apertures is numerically analyzed by solving Maxwell's equations directly using a three dimensional finite element method (3D-FEM). This method applied for designing a metallic enclosure for an asynchronous transfer mode digital service unit (ATM-DSU) to decrease EMI in the range of 30 MHz to 1 GHz.","PeriodicalId":253331,"journal":{"name":"Proceedings of Electrical Performance of Electronic Packaging","volume":"33 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-10-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115814026","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
High frequency characteristics of modular metric high-density connector systems 模块化公制高密度连接器系统的高频特性
Proceedings of Electrical Performance of Electronic Packaging Pub Date : 1995-10-02 DOI: 10.1109/EPEP.1995.524856
U. Wallenhorst, A. Brenner
{"title":"High frequency characteristics of modular metric high-density connector systems","authors":"U. Wallenhorst, A. Brenner","doi":"10.1109/EPEP.1995.524856","DOIUrl":"https://doi.org/10.1109/EPEP.1995.524856","url":null,"abstract":"A signal integrity analysis of modular metric high-density connector systems for use in telecommunication, computer- and other high-speed applications is presented. Carefully designed appropriate high performance test-setups-with different contact-pitch-consisting of backplane and daughtercard are the basis for all time- and frequency-domain measurements like TDR/TDT, crosstalk, insertion loss, VSWR, and prop. delay. Based on 2-D FEM-calculations high-accuracy simulation-models are produced which include multiline-crosstalk. The calculated curves are in excellent agreement with the measured data. The behaviour in \"bus-like\" applications (connectors as a part of a stub) is discussed.","PeriodicalId":253331,"journal":{"name":"Proceedings of Electrical Performance of Electronic Packaging","volume":"3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-10-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127348062","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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