The Impedance Transformation Technique for the Elimination of Numerical Errors in the Simulation of

Abstract

As integrated circuits operated in higher clock rates and shorter transition times, the dimension of the off-chip interconnection and the packaging size become comparable with the wave length. Such a trend makes electromagnetic field simulations increasingly necessary. For a multilayer packaging structure with signal vias, traces and power/ground planes, the electromagnetic fields between metal planes can be decomposed into several modes and each of which can be simulated very efficiently. Instead of using the inaccurate effective inductor model, we numerically solve the differential equations of the corresponding electromagnetic fields to simulate transient voltage fluctuations on power and ground planes. The metal planes are discretized by numerical meshes and electromagnetic fields are solved by the finite-difference method [ 11.