Proceedings of Electrical Performance of Electronic Packaging最新文献_第3页

Test of 3D stacked microwave TR modules 三维堆叠微波TR模块的测试

Proceedings of Electrical Performance of Electronic Packaging Pub Date : 1995-10-02 DOI: 10.1109/EPEP.1995.524861

M. Hauhe

引用次数: 2

Causality condition for time domain analysis of pulse distortion in lossy dispersive interconnects 有耗色散互连中脉冲失真时域分析的因果条件

Proceedings of Electrical Performance of Electronic Packaging Pub Date : 1995-10-02 DOI: 10.1109/EPEP.1995.524865

A. Rong, V. Tripathi

引用次数: 0

A statistical approach to the design and modeling of high speed transmission line networks in high performance high volume systems 高性能大容量系统中高速传输线网络设计与建模的统计方法

Proceedings of Electrical Performance of Electronic Packaging Pub Date : 1995-10-02 DOI: 10.1109/EPEP.1995.524676

M.J. Tripp, J. Alexander, S. Samaan, T. Arabi

{"title":"A statistical approach to the design and modeling of high speed transmission line networks in high performance high volume systems","authors":"M.J. Tripp, J. Alexander, S. Samaan, T. Arabi","doi":"10.1109/EPEP.1995.524676","DOIUrl":"https://doi.org/10.1109/EPEP.1995.524676","url":null,"abstract":"The system interconnect and packaging designs around high performance CPUs are becoming the major bottleneck in the overall performance of high speed, high volume systems. Given the reduced signal swings on the external buses the required modeling accuracy is now on the order of tens of picoseconds and tens of millivolts. As such many of the electromagnetic modeling techniques developed for high end supercomputer systems are quickly finding their ways into the PC industry. On the other hand, unlike high end systems, the key to the success of any high volume design is its cost effectiveness. In this paper, a Monte Carlo design and modeling approach to high volume high speed transmission line systems is presented. The sensitivity of the accuracy of any design parameters to the overall system performance is evaluated in terms of its effects on the statistical distribution of the optimized parameters or yield. It is shown that the traditional \"worst case\" design can be very misleading and under-estimates the worst case. We also show that the uncontrolled nature of the design makes it virtually impossible to find a \"representative\" signal and therefore detailed analysis of any given signal is only useful in determining the accuracy of the simulations or the phenomena that effect the results, but not the robustness of the entire system.","PeriodicalId":253331,"journal":{"name":"Proceedings of Electrical Performance of Electronic Packaging","volume":"12 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-10-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134351203","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

The impact of lossy line propagation on large die 损耗线传播对大型模具的影响

Proceedings of Electrical Performance of Electronic Packaging Pub Date : 1995-10-02 DOI: 10.1109/EPEP.1995.524682

E. Davidson, B. McCredie, W. Vilkeiis

引用次数: 0

14nalysis and Simulation of Complex Interconnect Structures andd Power/Ground Distribution Networks 复杂互连结构和配电网的分析与仿真

Proceedings of Electrical Performance of Electronic Packaging Pub Date : 1995-10-02 DOI: 10.1109/EPEP.1995.524858

F. Yuan

{"title":"14nalysis and Simulation of Complex Interconnect Structures andd Power/Ground Distribution Networks","authors":"F. Yuan","doi":"10.1109/EPEP.1995.524858","DOIUrl":"https://doi.org/10.1109/EPEP.1995.524858","url":null,"abstract":"Simultaneous switching noises, ground bounces, and crosstalk in increasingly complex interconnects and power/ground structures have been limiting factors in the signal integrity and design of high speed digital systems [ 1-31. For the sub-nanosecond rise/fall times and over 100 MHlz clock rates used in aggressive digital designs, the signal bandwidth ranges up to 3 to 5 GHz. Distributed networks, such as power and ground planes in MCWCB's, can no longer be accurately represented by simple models of a few lumped elements in the high frequency region. On the other hand, full-wave rigoirous electromagnetic field solulions [4] become impractical for complex digital circuit simulation due lo the extremely high computational requirement, and the difficulty of integration with the circuit type of simulations used in most digital designs. In this paper we present an efficient and accurate approach for analyzing and modeling of complex structures, and for predicting their signal integrity characteristics in MChWCB systems. The focus is to develop a fast, flexible and easy to use simulation tool with a clear circuit interpretation so it can be conveniently integrated with existing CAD tools and circuit simulators for IC mid system designers without getting into electromagnetic details. It can also handle the complexity of real MCM/PCB designs within practical computational constraints of an engineering workstation. Simulated results are presented for various interesting and important structures. Signal integrity characteristics siuch as switching noises, ground Ibounces, crosstalk, waveform distortions, arid delays, are analyzed for practical applications.","PeriodicalId":253331,"journal":{"name":"Proceedings of Electrical Performance of Electronic Packaging","volume":"231 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-10-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116912799","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Time and frequency domain analysis of integral decoupling capacitors 积分去耦电容器的时频域分析

Proceedings of Electrical Performance of Electronic Packaging Pub Date : 1995-10-02 DOI: 10.1109/EPEP.1995.524693

M. Goetz

引用次数: 11

Resonance analysis and simulation in packages 封装中的共振分析与仿真

Proceedings of Electrical Performance of Electronic Packaging Pub Date : 1995-10-02 DOI: 10.1109/EPEP.1995.524885

K. Bathey, M. Swaminathan

引用次数: 6

A numerical frequency domain technique for the optimization of high speed multi-conductor transmission line circuits based on the worst case design approach 基于最坏情况设计方法的高速多导体传输线电路频域数值优化技术

Proceedings of Electrical Performance of Electronic Packaging Pub Date : 1995-10-02 DOI: 10.1109/EPEP.1995.524678

T. Arabi, M. Tripp

引用次数: 4

Multi-reflection algorithm for timed statistical coupled noise checking 定时统计耦合噪声检测的多反射算法

Proceedings of Electrical Performance of Electronic Packaging Pub Date : 1995-10-02 DOI: 10.1109/EPEP.1995.524677

H.H. Smith, G. Katopis, M. Hsu

引用次数: 7

255 CBGA electrical performance comparison through package electrical characterization and system simulations 通过封装电气特性和系统仿真比较CBGA电气性能

Proceedings of Electrical Performance of Electronic Packaging Pub Date : 1995-10-02 DOI: 10.1109/EPEP.1995.524862

R. Osorio, J. Casto

引用次数: 0