发布求助
文献互助 智能选刊 最新文献

Proceedings of Electrical Performance of Electronic Packaging最新文献

筛选
英文 中文
Four-layered coplanar waveguide with double side conductor backings 具有双面导体背衬的四层共面波导
Proceedings of Electrical Performance of Electronic Packaging Pub Date : 1995-10-02 DOI: 10.1109/EPEP.1995.524891
Yaozhong Liu, T. Itoh
{"title":"Four-layered coplanar waveguide with double side conductor backings","authors":"Yaozhong Liu, T. Itoh","doi":"10.1109/EPEP.1995.524891","DOIUrl":"https://doi.org/10.1109/EPEP.1995.524891","url":null,"abstract":"The wave propagation characteristics are analyzed by the modified spectral domain approach (SDA). The new proposed multilayered waveguide has certain advantages over traditional two-layered waveguide and is suitable for the application of multilayered packaging structure.","PeriodicalId":253331,"journal":{"name":"Proceedings of Electrical Performance of Electronic Packaging","volume":"159 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-10-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114731607","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Measurement based characterization of RF-IC packages 基于测量的RF-IC封装特性
Proceedings of Electrical Performance of Electronic Packaging Pub Date : 1995-10-02 DOI: 10.1109/EPEP.1995.524883
R. Kollipara, A. Tripathi, J. Williams, V. Tripathi
{"title":"Measurement based characterization of RF-IC packages","authors":"R. Kollipara, A. Tripathi, J. Williams, V. Tripathi","doi":"10.1109/EPEP.1995.524883","DOIUrl":"https://doi.org/10.1109/EPEP.1995.524883","url":null,"abstract":"Low cost and small lead frame packages are characterized for RF wireless applications in terms of self and mutual inductances and capacitances associated with the package pins. A multiport measurement scheme to extract these self and mutual element values is presented together with examples of typical low cost RF-IC packages.","PeriodicalId":253331,"journal":{"name":"Proceedings of Electrical Performance of Electronic Packaging","volume":"132 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-10-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123216125","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Conductor, dielectric and radiation losses in multilayer microstrip interconnection with dielectric cover for high performance packaging 高性能封装用介电罩多层微带互连中的导体、介电和辐射损耗
Proceedings of Electrical Performance of Electronic Packaging Pub Date : 1995-10-02 DOI: 10.1109/EPEP.1995.524697
K. Joshi, R. Pollard, V. Postoyalko
{"title":"Conductor, dielectric and radiation losses in multilayer microstrip interconnection with dielectric cover for high performance packaging","authors":"K. Joshi, R. Pollard, V. Postoyalko","doi":"10.1109/EPEP.1995.524697","DOIUrl":"https://doi.org/10.1109/EPEP.1995.524697","url":null,"abstract":"Frequency dependent conductor, dielectric and radiation losses from multilayer microstrip with dielectric overlay have been calculated using Green's function in Fourier transform domain and compared with the measured data as well as other commercial software.","PeriodicalId":253331,"journal":{"name":"Proceedings of Electrical Performance of Electronic Packaging","volume":"10 1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-10-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125815512","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Two optimizations to accelerated method-of-moments algorithms for signal integrity analysis of complicated 3-D packages 两种用于复杂三维封装信号完整性分析的加速矩量法算法优化
Proceedings of Electrical Performance of Electronic Packaging Pub Date : 1995-10-02 DOI: 10.1109/EPEP.1995.524897
M. Kamon, B. Krauter, J. Phillips, L. Pileggi, J. White
{"title":"Two optimizations to accelerated method-of-moments algorithms for signal integrity analysis of complicated 3-D packages","authors":"M. Kamon, B. Krauter, J. Phillips, L. Pileggi, J. White","doi":"10.1109/EPEP.1995.524897","DOIUrl":"https://doi.org/10.1109/EPEP.1995.524897","url":null,"abstract":"In this paper we present two optimizations to accelerated Method-of-Moments algorithms. The first is an improved preconditioner for multipole-accelerated inductance extraction and the second is a set of several optimizations of the FFT-based convolution used in precorrected-FFT methods.","PeriodicalId":253331,"journal":{"name":"Proceedings of Electrical Performance of Electronic Packaging","volume":"7 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-10-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124824388","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
Effects of on-package decoupling capacitors on the simultaneous switching noise 封装上去耦电容器对同时开关噪声的影响
Proceedings of Electrical Performance of Electronic Packaging Pub Date : 1995-10-02 DOI: 10.1109/EPEP.1995.524694
T. Chou
{"title":"Effects of on-package decoupling capacitors on the simultaneous switching noise","authors":"T. Chou","doi":"10.1109/EPEP.1995.524694","DOIUrl":"https://doi.org/10.1109/EPEP.1995.524694","url":null,"abstract":"Effects of on-package decoupling capacitors on the simultaneous switching noise (SSN) of output drivers are presented. The effectiveness of the capacitor is a function of inductance from switching drivers to capacitors, and the signal/VSS/VDD stack-up of the package. For a /spl mu/-strip structure, the decoupling capacitor provides an AC shunt path between VSS and VDD that minimizes the impedance for signal transmission that leads to the reduction of SSN. The reduction of SSN is dependent on the inductance from chip pad to decoupling capacitor. Increasing this inductance will render the capacitor ineffective. For a tri-layer stripline structure, the decoupling capacitor has little effect on SSN reduction. SSN simulation results are compared and are consistent with the measurement data of an SSN dynamic electric test chip.","PeriodicalId":253331,"journal":{"name":"Proceedings of Electrical Performance of Electronic Packaging","volume":"17 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-10-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127496747","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 14
Efficient 3-D series impedance extraction using effective internal impedance 利用有效内阻抗高效提取三维串联阻抗
Proceedings of Electrical Performance of Electronic Packaging Pub Date : 1995-10-02 DOI: 10.1109/EPEP.1995.524899
Beom-taek Lee, E. Tuncer, D. Neikirk
{"title":"Efficient 3-D series impedance extraction using effective internal impedance","authors":"Beom-taek Lee, E. Tuncer, D. Neikirk","doi":"10.1109/EPEP.1995.524899","DOIUrl":"https://doi.org/10.1109/EPEP.1995.524899","url":null,"abstract":"The effective internal impedance approach, combined with the current-filament technique, has been shown to be a very efficient way to extract frequency dependent resistance and inductance of uniform interconnects. In this study, we show that this approach can be extended to find the series impedance of three dimensional structures. A microstrip bend is studied as a simple example.","PeriodicalId":253331,"journal":{"name":"Proceedings of Electrical Performance of Electronic Packaging","volume":"2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-10-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130094147","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 11
Measurement study on simultaneous switching noise 同时开关噪声的测量研究
Proceedings of Electrical Performance of Electronic Packaging Pub Date : 1995-10-02 DOI: 10.1109/EPEP.1995.524689
L. Chen, B. Sen
{"title":"Measurement study on simultaneous switching noise","authors":"L. Chen, B. Sen","doi":"10.1109/EPEP.1995.524689","DOIUrl":"https://doi.org/10.1109/EPEP.1995.524689","url":null,"abstract":"High-performance chip designs with large numbers of output drivers can be crippled by the simultaneous switching noise. A high-frequency test system for measuring ground bounce is described, along with measurements that were taken on test chips with different packaging design options such as multiple layers and chip capacitors. This paper discusses chip and package design guidelines for noise reduction.","PeriodicalId":253331,"journal":{"name":"Proceedings of Electrical Performance of Electronic Packaging","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-10-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131047222","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
CMOS off-chip driver design with simultaneous switching noise and switching time considerations 同时考虑开关噪声和开关时间的CMOS片外驱动器设计
Proceedings of Electrical Performance of Electronic Packaging Pub Date : 1995-10-02 DOI: 10.1109/EPEP.1995.524686
Yaochao Yang, J. Brews
{"title":"CMOS off-chip driver design with simultaneous switching noise and switching time considerations","authors":"Yaochao Yang, J. Brews","doi":"10.1109/EPEP.1995.524686","DOIUrl":"https://doi.org/10.1109/EPEP.1995.524686","url":null,"abstract":"A design constraint for CMOS off-chip drivers that will meet a pre-specified normalized maximum simultaneous switching ground noise and a prespecified normalized time when the switched NMOST leaves the saturation region is provided in this paper.","PeriodicalId":253331,"journal":{"name":"Proceedings of Electrical Performance of Electronic Packaging","volume":"8 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-10-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130637986","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Experimental circuit modeling of coupled interconnection structures based on causality 基于因果关系的耦合互连结构实验电路建模
Proceedings of Electrical Performance of Electronic Packaging Pub Date : 1995-10-02 DOI: 10.1109/EPEP.1995.524869
S. Sercu, L. Martens
{"title":"Experimental circuit modeling of coupled interconnection structures based on causality","authors":"S. Sercu, L. Martens","doi":"10.1109/EPEP.1995.524869","DOIUrl":"https://doi.org/10.1109/EPEP.1995.524869","url":null,"abstract":"In this paper a time-frequency domain technique for the experimental circuit modeling of coupled two-port interconnection structures and discontinuities is presented. The technique models and de-embeds each appearing discontinuity and coupled substructure of the DUT one by one, and is based on the principle of causality. To validate the accuracy of the circuit models, measured reflection, transmission, near-end and far-end crosstalk are compared with simulated results.","PeriodicalId":253331,"journal":{"name":"Proceedings of Electrical Performance of Electronic Packaging","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-10-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130821198","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Coplanar bond wire interconnections for millimeter-wave applications 毫米波应用的共面键合线互连
Proceedings of Electrical Performance of Electronic Packaging Pub Date : 1995-10-02 DOI: 10.1109/EPEP.1995.524887
T. Krems, W. Haydl, L. Verweyen, M. Schlechtweg, H. Massler, J. Rudiger
{"title":"Coplanar bond wire interconnections for millimeter-wave applications","authors":"T. Krems, W. Haydl, L. Verweyen, M. Schlechtweg, H. Massler, J. Rudiger","doi":"10.1109/EPEP.1995.524887","DOIUrl":"https://doi.org/10.1109/EPEP.1995.524887","url":null,"abstract":"An investigation of bond wire interconnections for coplanar integrated millimeter-wave circuits is presented. Assuming a transmission line behaviour of the bond wire its characteristic impedance and propagation constant are calculated using two dimensional finite element simulations. The model is validated by comparison with experimental data and then used to estimate the maximum length for bond wires in millimeter-wave applications. Bond wire matching networks are introduced giving a broadband improvement in the behaviour of interconnections with long wires.","PeriodicalId":253331,"journal":{"name":"Proceedings of Electrical Performance of Electronic Packaging","volume":"40 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-10-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128774729","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 16
首页 上一页 下一页 尾页
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整，为了账户安全，请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
请完成安全验证×
相关产品
×
本文献相关产品
联系我们：info@booksci.cn Book学术提供免费学术资源搜索服务，方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号：604180095
Book学术官方微信
小红书