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Automated evaluation of design rules for MCM multilayer wiring systems MCM多层布线系统设计规则的自动评估
Proceedings of Electrical Performance of Electronic Packaging Pub Date : 1995-10-02 DOI: 10.1109/EPEP.1995.524680
R. Brodowski, I. Reichl
{"title":"Automated evaluation of design rules for MCM multilayer wiring systems","authors":"R. Brodowski, I. Reichl","doi":"10.1109/EPEP.1995.524680","DOIUrl":"https://doi.org/10.1109/EPEP.1995.524680","url":null,"abstract":"When designing wiring systems of multichip modules, simulations have to be performed to avoid laborious and cost-intensive prototyping. To obtain proper design rules for the wiring system, the designer has to find out first what amount of signal reflection, coupling, and attenuation can be tolerated to avoid the possibility of bit errors. In the second step, calculations must show which geometry values such as line width and dielectric thickness are necessary to meet these requirements. To judge the quality of chip-to-chip signal propagation, the author used SPICE simulations, using analog models which were obtained from electromagnetic field simulations using MAFIA (Maxwell Finite Integration Algorithm).","PeriodicalId":253331,"journal":{"name":"Proceedings of Electrical Performance of Electronic Packaging","volume":"394 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-10-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122096723","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Ground path inductance characterization of a 225PBGA 225PBGA的地径电感特性
Proceedings of Electrical Performance of Electronic Packaging Pub Date : 1995-10-02 DOI: 10.1109/EPEP.1995.524870
Chi-Taou Tsai
{"title":"Ground path inductance characterization of a 225PBGA","authors":"Chi-Taou Tsai","doi":"10.1109/EPEP.1995.524870","DOIUrl":"https://doi.org/10.1109/EPEP.1995.524870","url":null,"abstract":"This paper presents the measured L data of the ground (V/sub SS/) structure of a 225PBGA by using a two-port network analyzer technique. The ground structure of this package has eight source points (bond wire sites) and one sink point (solder ball site). Measurement data is presented in terms of an 8/spl times/8 matrix for the V/sub SS/ L path. Experimental procedure and its implications are discussed.","PeriodicalId":253331,"journal":{"name":"Proceedings of Electrical Performance of Electronic Packaging","volume":"255 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-10-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115776371","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Causal approximation of equivalent transmission line parameters for moment matching-based interconnect simulations 基于矩匹配的互连仿真中等效传输线参数的因果逼近
Proceedings of Electrical Performance of Electronic Packaging Pub Date : 1995-10-02 DOI: 10.1109/EPEP.1995.524893
M. Çelik, A. Cangellaris
{"title":"Causal approximation of equivalent transmission line parameters for moment matching-based interconnect simulations","authors":"M. Çelik, A. Cangellaris","doi":"10.1109/EPEP.1995.524893","DOIUrl":"https://doi.org/10.1109/EPEP.1995.524893","url":null,"abstract":"A new method is proposed for approximation of equivalent transmission line parameters that are either numerically extracted or measured. Using these approximations dispersive interconnects can be analyzed in a moment matching simulation environment.","PeriodicalId":253331,"journal":{"name":"Proceedings of Electrical Performance of Electronic Packaging","volume":"23 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-10-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125957933","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Microwave packages for 30 Gbit/s analog and digital circuits 用于30 Gbit/s模拟和数字电路的微波封装
Proceedings of Electrical Performance of Electronic Packaging Pub Date : 1995-10-02 DOI: 10.1109/EPEP.1995.524880
A. Petersen, R. Yu, K. Runge, J. Bowers, K. Wang
{"title":"Microwave packages for 30 Gbit/s analog and digital circuits","authors":"A. Petersen, R. Yu, K. Runge, J. Bowers, K. Wang","doi":"10.1109/EPEP.1995.524880","DOIUrl":"https://doi.org/10.1109/EPEP.1995.524880","url":null,"abstract":"In this paper microwave packages for very high speed analog and digital circuits are described. The microwave packages have excellent performance up to 40 GHz. Use of these packages is demonstrated with a 30 Gbit/s 4:1 multiplexer and a DC-26 GHz baseband AGC amplifier.","PeriodicalId":253331,"journal":{"name":"Proceedings of Electrical Performance of Electronic Packaging","volume":"126 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-10-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123216910","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 7
Canonical Models for Determining the Effect of Decoupling Capacitors on Computer Packages 确定去耦电容对计算机封装影响的典型模型
Proceedings of Electrical Performance of Electronic Packaging Pub Date : 1995-10-02 DOI: 10.1109/EPEP.1995.524692
B. Rubin
{"title":"Canonical Models for Determining the Effect of Decoupling Capacitors on Computer Packages","authors":"B. Rubin","doi":"10.1109/EPEP.1995.524692","DOIUrl":"https://doi.org/10.1109/EPEP.1995.524692","url":null,"abstract":"We develop simple models that can be handled by existing electromagnetic analysis tools, and use them to answer some of the basic questions on decoupling and provide parameters for more complete models of the computer package.","PeriodicalId":253331,"journal":{"name":"Proceedings of Electrical Performance of Electronic Packaging","volume":"83 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-10-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122987510","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Analysis and simulation of complex interconnect structures and power/ground distribution networks in MCM and PCB's MCM和PCB中复杂互连结构和电源/地配电网的分析与仿真
Proceedings of Electrical Performance of Electronic Packaging Pub Date : 1995-10-02 DOI: 10.1109/EPEP.1995.524857
F. Yuan
{"title":"Analysis and simulation of complex interconnect structures and power/ground distribution networks in MCM and PCB's","authors":"F. Yuan","doi":"10.1109/EPEP.1995.524857","DOIUrl":"https://doi.org/10.1109/EPEP.1995.524857","url":null,"abstract":"The analysis and modeling of complex interconnect structures and power/ground planes in multichip modules and printed circuit board systems are presented. Effects such as simultaneous switching noises and ground bounces have been increasingly limiting factors in the signal integrity and design of high speed digital systems. However, it is often difficult and time consuming to analyze and simulate those effects. In this paper, an integral equation boundary element algorithm is applied to the electromagnetic modeling of arbitrary interconnection structures. An efficient quasi-static approximation is introduced to simplify the complex frequency dependence while retaining the accurate AC characteristics. Equivalent circuits are extracted and utilized for the simulation of system transient responses. Efficient circuit simulators in both time domain and frequency domain are developed for the equivalent circuits. The equivalent circuits are then combined with signal nets or other external circuitry in system signal integrity analysis.","PeriodicalId":253331,"journal":{"name":"Proceedings of Electrical Performance of Electronic Packaging","volume":"19 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-10-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127712135","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Computation of switching noise in PCBs for digital packages 数字封装中pcb开关噪声的计算
Proceedings of Electrical Performance of Electronic Packaging Pub Date : 1995-10-02 DOI: 10.1109/EPEP.1995.524688
J. Yook, V. Chandramouli, L. Katehi, K. Sakallah
{"title":"Computation of switching noise in PCBs for digital packages","authors":"J. Yook, V. Chandramouli, L. Katehi, K. Sakallah","doi":"10.1109/EPEP.1995.524688","DOIUrl":"https://doi.org/10.1109/EPEP.1995.524688","url":null,"abstract":"Simultaneous switching noise in printed circuit boards for digital packages is computed using a hybrid technique which combines electromagnetic analysis (3D FEM) and circuit simulation (HSPICE) for fast and efficient time and frequency domain analysis.","PeriodicalId":253331,"journal":{"name":"Proceedings of Electrical Performance of Electronic Packaging","volume":"97 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-10-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132923714","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Modeling of simultaneous switching ground noise for BiCMOS drivers BiCMOS驱动器同步开关地噪声建模
Proceedings of Electrical Performance of Electronic Packaging Pub Date : 1995-10-02 DOI: 10.1109/EPEP.1995.524687
D.A. Seeker, J. Prince
{"title":"Modeling of simultaneous switching ground noise for BiCMOS drivers","authors":"D.A. Seeker, J. Prince","doi":"10.1109/EPEP.1995.524687","DOIUrl":"https://doi.org/10.1109/EPEP.1995.524687","url":null,"abstract":"A model of simultaneous switching ground noise for the BiCMOS driver is presented. Level I SPICE-type MOSFET and Gummel-Poon BJT device models are used for the analysis. Immunity of the quiet BiCMOS driver to noise present at the ground and power connections is also investigated.","PeriodicalId":253331,"journal":{"name":"Proceedings of Electrical Performance of Electronic Packaging","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-10-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128832846","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Analysis of tapered microstrips on lossy dielectric substrates 损耗介质衬底上锥形微带的分析
Proceedings of Electrical Performance of Electronic Packaging Pub Date : 1995-10-02 DOI: 10.1109/EPEP.1995.524896
J. Kuo
{"title":"Analysis of tapered microstrips on lossy dielectric substrates","authors":"J. Kuo","doi":"10.1109/EPEP.1995.524896","DOIUrl":"https://doi.org/10.1109/EPEP.1995.524896","url":null,"abstract":"A differential matrix equation method is proposed to the analysis of tapered microstrip lines on lossy substrates. It is found that the solution method is numerically efficient. Network parameters of two lossy tapered microstrips are investigated.","PeriodicalId":253331,"journal":{"name":"Proceedings of Electrical Performance of Electronic Packaging","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-10-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129516391","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Large-signal modeling and characterization of a plastic packaged HBT for use in wireless portable units 用于无线便携设备的塑料封装HBT的大信号建模和特性
Proceedings of Electrical Performance of Electronic Packaging Pub Date : 1995-10-02 DOI: 10.1109/EPEP.1995.524884
Der-woei Wu, G. Henderson
{"title":"Large-signal modeling and characterization of a plastic packaged HBT for use in wireless portable units","authors":"Der-woei Wu, G. Henderson","doi":"10.1109/EPEP.1995.524884","DOIUrl":"https://doi.org/10.1109/EPEP.1995.524884","url":null,"abstract":"A method is presented for the extraction of an accurate large-signal model for plastic-packaged GaAs HBTs. The packaged device model is extracted by a combination of DC and small-signal on-wafer characterization of the chip device and small-signal characterization of short and open package structures through on-wafer probing of ceramic launchers to the package. The technique has been applied to M/A-COM's 32-finger HBT in an SOT-89 package; the resulting model shows excellent agreement with large-signal measurements for the packaged device, predicting the power and gain within 0.5 dB for a wide range of input power drive and device biases.","PeriodicalId":253331,"journal":{"name":"Proceedings of Electrical Performance of Electronic Packaging","volume":"102 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-10-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122618087","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
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