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Proceedings of Electrical Performance of Electronic Packaging最新文献

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A method for on-chip interconnect characterization 片上互连表征方法
Proceedings of Electrical Performance of Electronic Packaging Pub Date : 1995-10-02 DOI: 10.1109/EPEP.1995.524866
A. Glaser, M. Steer, G. Shedd, P. Russell, P. Franzon
{"title":"A method for on-chip interconnect characterization","authors":"A. Glaser, M. Steer, G. Shedd, P. Russell, P. Franzon","doi":"10.1109/EPEP.1995.524866","DOIUrl":"https://doi.org/10.1109/EPEP.1995.524866","url":null,"abstract":"We present and novel method for the measurement of interconnect capacitance, atomic capacitance microscopy. We also present VLSI structures which allow correlation of ACM and traditional (VNA, TDR, direct capacitance) measurement techniques.","PeriodicalId":253331,"journal":{"name":"Proceedings of Electrical Performance of Electronic Packaging","volume":"8 7","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-10-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114060779","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
A procedure for accurate high-frequency characterisation of multi-pins backplane connectors 多引脚背板连接器的精确高频表征程序
Proceedings of Electrical Performance of Electronic Packaging Pub Date : 1995-10-02 DOI: 10.1109/EPEP.1995.524698
L. Martens, S. Sercu, D. Morlion
{"title":"A procedure for accurate high-frequency characterisation of multi-pins backplane connectors","authors":"L. Martens, S. Sercu, D. Morlion","doi":"10.1109/EPEP.1995.524698","DOIUrl":"https://doi.org/10.1109/EPEP.1995.524698","url":null,"abstract":"In this paper we present a procedure for the measurement of the high-frequency characteristics such as reflection, transmission and crosstalk of packages. Although the approach is valid for general packages, we apply it here to the specific case of multi-pins backplane connectors. The high accuracy of this procedure is needed to characterise the connectors over a wide bandwidth or a large range of rise times. Based on the measurements, equivalent models are derived that can be used in circuit design.","PeriodicalId":253331,"journal":{"name":"Proceedings of Electrical Performance of Electronic Packaging","volume":"93 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-10-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127820204","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A novel MCM interconnect test technique based on resonator principles and transmission line theory 基于谐振器原理和传输线理论的新型MCM互连测试技术
Proceedings of Electrical Performance of Electronic Packaging Pub Date : 1995-10-02 DOI: 10.1109/EPEP.1995.524868
B.C. Kim, M. Swaminathan, A. Chatterjee
{"title":"A novel MCM interconnect test technique based on resonator principles and transmission line theory","authors":"B.C. Kim, M. Swaminathan, A. Chatterjee","doi":"10.1109/EPEP.1995.524868","DOIUrl":"https://doi.org/10.1109/EPEP.1995.524868","url":null,"abstract":"This paper describes a new technique for detecting and diagnosing process-related interconnect faults in MCMs. The technique uses a single-ended probe with a resonator and a waveform generator: A complete fault diagnosis is possible through measurement of magnitude and phase responses.","PeriodicalId":253331,"journal":{"name":"Proceedings of Electrical Performance of Electronic Packaging","volume":"26 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-10-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125284823","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 6
Leadless 432-pin package and solderless socket for a 622 MHz system 用于622 MHz系统的无铅432针封装和无焊插座
Proceedings of Electrical Performance of Electronic Packaging Pub Date : 1995-10-02 DOI: 10.1109/EPEP.1995.524879
J. Loos
{"title":"Leadless 432-pin package and solderless socket for a 622 MHz system","authors":"J. Loos","doi":"10.1109/EPEP.1995.524879","DOIUrl":"https://doi.org/10.1109/EPEP.1995.524879","url":null,"abstract":"This paper presents the design and performance of a leadless MCM-D electronic package with the following attributes: (1) 432-pin land-grid I/O array, (2) mountable/demountable to its printed circuit board by means of a solderless socket, (3) signal speeds above 1 GHz, and (4) up to 25 W dissipated using forced-air cooling.","PeriodicalId":253331,"journal":{"name":"Proceedings of Electrical Performance of Electronic Packaging","volume":"28 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-10-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132942073","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Determination of of operating frequency and signal integrity of various implementations of a symmetric multiprocessor computer 对称多处理器计算机各种实现的工作频率和信号完整性的测定
Proceedings of Electrical Performance of Electronic Packaging Pub Date : 1995-10-02 DOI: 10.1109/EPEP.1995.524679
B. McCredie, Wendy S. Becker, B. Singh, P. Lin
{"title":"Determination of of operating frequency and signal integrity of various implementations of a symmetric multiprocessor computer","authors":"B. McCredie, Wendy S. Becker, B. Singh, P. Lin","doi":"10.1109/EPEP.1995.524679","DOIUrl":"https://doi.org/10.1109/EPEP.1995.524679","url":null,"abstract":"The primary function of the package designer is to determine the maximum frequency of operation and functionality of a given computer design point. Determination of the maximum operating frequency requires calculation of both off chip driver and receiver delays as well as package and interconnect delays. Determination of signal integrity is generally a noise analysis problem, that requires calculation of the total noise from all possible sources at the input to an off chip receiver. This paper outlines the analysis methodology and techniques used to determine the performance and functionality of various implementations of a common symmetric multiprocessor computer architecture.","PeriodicalId":253331,"journal":{"name":"Proceedings of Electrical Performance of Electronic Packaging","volume":"11 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-10-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130064491","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
Performance effects of switching noise on CMOS microprocessors 开关噪声对CMOS微处理器性能的影响
Proceedings of Electrical Performance of Electronic Packaging Pub Date : 1995-10-02 DOI: 10.1109/EPEP.1995.524684
D. Becker, B. McCredie, B. Singh, P. Lin
{"title":"Performance effects of switching noise on CMOS microprocessors","authors":"D. Becker, B. McCredie, B. Singh, P. Lin","doi":"10.1109/EPEP.1995.524684","DOIUrl":"https://doi.org/10.1109/EPEP.1995.524684","url":null,"abstract":"The simultaneous switching noise of off-chip drivers and internal circuits affect the performance of the CMOS chips. These effects are quantified using voltage waveforms obtained from simulations on a high-frequency package model.","PeriodicalId":253331,"journal":{"name":"Proceedings of Electrical Performance of Electronic Packaging","volume":"170 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-10-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123008532","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
A new technique for the frequency domain analysis of non-uniform digital interconnects 非均匀数字互连频域分析新技术
Proceedings of Electrical Performance of Electronic Packaging Pub Date : 1995-10-02 DOI: 10.1109/EPEP.1995.524894
N. Boulejfen, A. Kouki, F. Ghannouchi
{"title":"A new technique for the frequency domain analysis of non-uniform digital interconnects","authors":"N. Boulejfen, A. Kouki, F. Ghannouchi","doi":"10.1109/EPEP.1995.524894","DOIUrl":"https://doi.org/10.1109/EPEP.1995.524894","url":null,"abstract":"A new technique for the calculation of the frequency domain S-parameters of non-uniform transmission lines is presented. These S-parameters are used in a time-domain algorithm to obtain the transient response of the non-uniform interconnection circuit.","PeriodicalId":253331,"journal":{"name":"Proceedings of Electrical Performance of Electronic Packaging","volume":"208 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-10-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124668275","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Inductance calculation of multiple arbitrary shaped planes using finite element integral equation method 用有限元积分方程法计算多个任意形状平面的电感
Proceedings of Electrical Performance of Electronic Packaging Pub Date : 1995-10-02 DOI: 10.1109/EPEP.1995.524900
H. Fukumoto, A. Yokomori, T. Nagata, H. Shimizu, A. Nakamura
{"title":"Inductance calculation of multiple arbitrary shaped planes using finite element integral equation method","authors":"H. Fukumoto, A. Yokomori, T. Nagata, H. Shimizu, A. Nakamura","doi":"10.1109/EPEP.1995.524900","DOIUrl":"https://doi.org/10.1109/EPEP.1995.524900","url":null,"abstract":"An efficient technique to calculate inductance of multiple arbitrary shaped planes is developed based on voltage driven current distribution analysis by the finite element integral equation method. The comparison between calculated and experimental results proved that the present technique is fast and accurate enough for complicated multilayer packaging applications.","PeriodicalId":253331,"journal":{"name":"Proceedings of Electrical Performance of Electronic Packaging","volume":"13 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-10-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131452124","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
Crosstalk issues in flip chip multichip modules 倒装多片模块中的串扰问题
Proceedings of Electrical Performance of Electronic Packaging Pub Date : 1995-10-02 DOI: 10.1109/EPEP.1995.524867
E. Godshalk, M. Bruns, T. Ruttan
{"title":"Crosstalk issues in flip chip multichip modules","authors":"E. Godshalk, M. Bruns, T. Ruttan","doi":"10.1109/EPEP.1995.524867","DOIUrl":"https://doi.org/10.1109/EPEP.1995.524867","url":null,"abstract":"A multilayer 2.5 Gbit/sec superconducting Multichip Module (MCM) has been modeled to investigate the feasibility of meeting specified performance goals. Due to the high speeds required flip chip bonding of the Josephson Junction Integrated Circuits (IC's) is used. The MCM is comprised of both Polyimide (PI) dielectric and Mullite ceramic substrates, forming in effect an MCM-D/MCM-C hybrid structure. Niobium (Nb) low temperature superconductor (LTS) is used on the PI dielectric layers to form IC-data and IC-control nets that connect from chip to chip with transmission-line impedance of 2 and 8 ohms, respectively. In the Mullite layers, Tungsten (W) is used for clock, data in, data out, and control lines, all of 32 ohms, that connect from the IC's to the MCM I/O ports.","PeriodicalId":253331,"journal":{"name":"Proceedings of Electrical Performance of Electronic Packaging","volume":"73 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-10-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133385944","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
LC: an integrated methodology to model and visualize the complex electrodynamics of 3D structures LC:一种综合的方法来建模和可视化复杂的3D结构的电动力学
Proceedings of Electrical Performance of Electronic Packaging Pub Date : 1995-10-02 DOI: 10.1109/EPEP.1995.524699
R. Gravrok, M. Piket-May, K. Thomas
{"title":"LC: an integrated methodology to model and visualize the complex electrodynamics of 3D structures","authors":"R. Gravrok, M. Piket-May, K. Thomas","doi":"10.1109/EPEP.1995.524699","DOIUrl":"https://doi.org/10.1109/EPEP.1995.524699","url":null,"abstract":"Equivalent-circuit models are obtained from direct interpretations of electromagnetic field data. Improved intuitive understanding is achieved with direct visualization of wave propagation through 3D structures. Applications to MCMs and power-distribution networks are described.","PeriodicalId":253331,"journal":{"name":"Proceedings of Electrical Performance of Electronic Packaging","volume":"184 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-10-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132624928","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
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