Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308)最新文献_第9页

A CMOS z-axis capacitive accelerometer with comb-finger sensing 一种带梳状手指感应的CMOS z轴电容式加速度计

Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308) Pub Date : 2000-01-23 DOI: 10.1109/MEMSYS.2000.838567

Huikai Xie, G. Fedder

引用次数: 83

Electroplated rf MEMS capacitive switches 电镀rf MEMS电容开关

Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308) Pub Date : 2000-01-23 DOI: 10.1109/MEMSYS.2000.838593

J.Y. Park, G. Kim, K. Chung, J. Bu

引用次数: 64

Mass flowmeter using a multi-sensor chip 质量流量计采用多传感器芯片

Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308) Pub Date : 2000-01-23 DOI: 10.1109/MEMSYS.2000.838575

Yong Xu, C. Chiu, F. Jiang, Q. Lin, Y. Tai

引用次数: 11

Torque measurement method using air turbine for micro devices 微器件用空气涡轮扭矩测量方法

Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308) Pub Date : 2000-01-23 DOI: 10.1109/MEMSYS.2000.838520

H. Ota, L. Li, M. Takeda, H. Narumiya, T. Ohara, K. Namura

引用次数: 1

A check-valved silicone diaphragm pump 单向阀硅胶隔膜泵

Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308) Pub Date : 2000-01-23 DOI: 10.1109/MEMSYS.2000.838491

E. Meng, Xuan-Qi Wang, H. Mak, Y. Tai

引用次数: 50

Silicon carbide micro-reaction-sintering using a multilayer silicon mold 碳化硅微反应烧结多层硅模

Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308) Pub Date : 2000-01-23 DOI: 10.1109/MEMSYS.2000.838616

S. Sugimoto, S. Tanaka, Jingfeng Li, R. Watanabe, M. Esashi

{"title":"Silicon carbide micro-reaction-sintering using a multilayer silicon mold","authors":"S. Sugimoto, S. Tanaka, Jingfeng Li, R. Watanabe, M. Esashi","doi":"10.1109/MEMSYS.2000.838616","DOIUrl":"https://doi.org/10.1109/MEMSYS.2000.838616","url":null,"abstract":"This paper describes a novel process, \"Silicon Carbide Micro-reaction-sintering\", to fabricate high-aspect-ratio silicon carbide microstructures. This process consists of micromachining of silicon molds, filling of material powders ( a-silicon carbide, graphite, silicon and phenol resin) into the molds, bonding of the molds with adhesive and reaction-sintering by hot isostatic pressing (HIP). Using our process, we have successfully fabricated silicon carbide microrotors of 5 and 10 mm diameters for micromachined gas turbines. We observed the cross section of the microrotors with a scanning electron microscope (SEM). The SEM observation demonstrated that the material powder was densely reaction-sintered by HIP. We also investigated the compositions of the microrotors by X-ray diffraction (XRD) analysis. The XRD analyses proved that graphite in the material powder reacted with melted silicon derived from the mold, and consequently /spl beta/-silicon carbide was produced around the /spl alpha/-silicon carbide originally included in the material powder.","PeriodicalId":251857,"journal":{"name":"Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308)","volume":"35 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-01-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116365593","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 16

A monolithic fully-integrated vacuum-sealed CMOS pressure sensor 单片全集成真空密封CMOS压力传感器

Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308) Pub Date : 2000-01-23 DOI: 10.1109/MEMSYS.2000.838540

A. Chavan, K. Wise

引用次数: 89

Frequency response of TiNi shape memory alloy thin film micro-actuators TiNi形状记忆合金薄膜微执行器的频率响应

Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308) Pub Date : 2000-01-23 DOI: 10.1109/MEMSYS.2000.838545

C.C. Ma, R. Wang, Q. Sun, Y. Zohar, M. Wong

引用次数: 20

A micro-flight mechanism with rotational wings 带有旋转机翼的微型飞行机构

Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308) Pub Date : 2000-01-23 DOI: 10.1109/MEMSYS.2000.838508

N. Miki, I. Shimoyama

{"title":"A micro-flight mechanism with rotational wings","authors":"N. Miki, I. Shimoyama","doi":"10.1109/MEMSYS.2000.838508","DOIUrl":"https://doi.org/10.1109/MEMSYS.2000.838508","url":null,"abstract":"A flight mechanism with 2 mm long micro-rotational wings has been designed and fabricated. The rotational wings are made of cobalt-nickel alloy and rotate in an alternating magnetic field. The flight mechanism is composed of the rotational wings, non-rotational body and disk. The wings and the disk are attached to glass rod and rotate together. As the rotating frequency increases, the wings and the disk move up and the disk pushes the body upwards, and then the whole structures take off. The characteristics of the rotational wings are investigated. A scale effect is found; the characteristics of the rotational wings get better as the wing length decreases. It is considered to be caused by the wing-longitudinal flow, which is often ignored in high Reynolds number flow. The non-rotational body has soft magnetic films. Due to the magnetic anisotropic torque exerted on the films, the body can maintain its attitude stability passively. The flight mechanism that weighs 1.6 mg succeeded in taking-off at 438 Hz keeping the attitude of the body stable. The magnetic torque between the external magnetic field and the wings must be larger than the torque from the air and the friction in order to keep the wings rotating. The relationship between the required magnetic field and the rotating frequency is investigated.","PeriodicalId":251857,"journal":{"name":"Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-01-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125838906","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 12

3-D microsystem packaging for interconnecting electrical, optical and mechanical microdevices to the external world 用于将电气、光学和机械微设备与外部世界互连的3-D微系统封装

Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308) Pub Date : 2000-01-23 DOI: 10.1109/MEMSYS.2000.838603

A. Tixier, Y. Mita, S. Oshima, Jiang Guoy, H. Fujita

引用次数: 8