电镀rf MEMS电容开关

J.Y. Park, G. Kim, K. Chung, J. Bu
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引用次数: 64

摘要

射频微动开关是采用电镀技术、低温工艺和干释放技术,将传输线、铰链、活动板等多种几何结构组合而成的新型射频微动开关。特别研究了具有高介电常数的钛酸锶氧化物(SrTiO/sub 3/)作为微机械电容开关的介电层具有较高的通断比和导通电容。所制开关的最低驱动电压为8伏。该开关在10 GHz时的插入损耗为0.08 dB,在5 GHz时的隔离度为42 dB,开/关比为600,导通电容为50 pF。由于使用电镀Au或Cux,这些开关也具有高电流承载能力。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Electroplated rf MEMS capacitive switches
RF microswitches are newly designed and fabricated with various structural geometry of transmission line, hinge, and movable plate formed by using electroplating techniques, low temperature processes, and dry releasing techniques. In particular, Strontium Titanate Oxide (SrTiO/sub 3/) with high dielectric constant is investigated for high switching on/off ratio and on capacitance as a dielectric layer of a micromechanical capacitive switch. Achieved lowest actuation voltage of the fabricated switches is 8 volts. The fabricated switch has low insertion loss of 0.08 dB at 10 GHz, isolation of 42 dB at 5 GHz, on/off ratio of 600, and on capacitance of 50 pF, respectively. These switches also have high current carry capability due to the use of electroplated Au or Cux.
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