2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems最新文献_第7页

Adequate mechanical copper modelling for 2nd level interconnect structures 二级互连结构有足够的机械铜模型

2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Pub Date : 2015-04-19 DOI: 10.1109/EUROSIME.2015.7103142

S. Wiese, F. Kraemer

引用次数: 10

Thermal and mechanical behaviour of an RFID based smart system embedded in a transmission belt determined by FEM simulations for Industry 4.0 applications 工业4.0应用中基于RFID的智能系统嵌入传送带的热学和力学行为，由FEM模拟确定

2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Pub Date : 2015-04-19 DOI: 10.1109/EUROSIME.2015.7103152

J. Albrecht, R. Dudek, J. Auersperg, R. Pantou, S. Rzepka

引用次数: 5

Impact of solder-joint tilting on the reliability of LED-based PCB assemblies: A combined experimental and FEM analysis 焊接接头倾斜对led基PCB组件可靠性的影响:实验与有限元分析相结合

2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Pub Date : 2015-04-19 DOI: 10.1109/EUROSIME.2015.7103170

B. Vandevelde, F. Zanon, A. Griffoni, Xiaolong Li, G. Willems, M. Meneghini

引用次数: 2

Modeling of LED solder joint cracking during temperature cycling with Finite Element 温度循环过程中LED焊点裂纹的有限元建模

2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Pub Date : 2015-04-19 DOI: 10.1109/EUROSIME.2015.7103105

W. Yuan, P. Altieri-Weimar

引用次数: 1

Fast analytical design of Poly-SiGe MEMS pressure sensors polysige MEMS压力传感器的快速分析设计

2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Pub Date : 2015-04-19 DOI: 10.1109/EUROSIME.2015.7103163

V. Rochus, B. Wang, A. R. Chaudhuri, P. Hélin, S. Severi, X. Rottenberg

引用次数: 4

Numerical investigation of ceramic package/ interposer interconnects using isotropic conductive adhesive 采用各向同性导电胶的陶瓷封装/中间层互连的数值研究

2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Pub Date : 2015-04-19 DOI: 10.1109/EUROSIME.2015.7103144

R. Hamou, Per Dalsjø, C. Dørum, S. Helland, H. Kristiansen, M. Taklo, J. Gakkestad

引用次数: 0

Design of thin-film AlN actuators for 4-inch transparent plates for haptic applications 用于触觉应用的4英寸透明板的薄膜AlN驱动器的设计

2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Pub Date : 2015-04-19 DOI: 10.1109/EUROSIME.2015.7103089

F. Casset, J. Danel, C. Chappaz, F. Bernard, S. Basrour, B. Desloges, S. Fanget

{"title":"Design of thin-film AlN actuators for 4-inch transparent plates for haptic applications","authors":"F. Casset, J. Danel, C. Chappaz, F. Bernard, S. Basrour, B. Desloges, S. Fanget","doi":"10.1109/EUROSIME.2015.7103089","DOIUrl":"https://doi.org/10.1109/EUROSIME.2015.7103089","url":null,"abstract":"Numerous applications require tactile interfaces today. In particular, many customers' applications such as Smartphone, tablet PC or touch pad can be concerned by high performances, low voltage haptic interfaces which allow the user to interact with its environment by the sense of touch. This technology is already used but with limitations such as high power consumption and limited feedback effect (simple vibration). We chose to work on the squeeze-film effect. It consists in changing the friction between the finger and a plate resonator. It provides high granularity level of haptic sensation. This paper deals with the design of high performances actuators in order to promote the squeeze-film effect on a 4-inch plate (diagonal of the plate). Using predictive models, we select the best design, able to generate the highest substrate displacement amplitude as possible. We built demonstrators using a generic technology based on thin-film AlN actuators. Electromechanical characterization is ongoing before the integration of the thin-film actuator plate in a haptic demonstrator in a close future.","PeriodicalId":250897,"journal":{"name":"2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","volume":"10 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-04-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122830676","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

Investigation of sensitive parameters in the structural simulation tool chain for fiber reinforced plastics in automotive electronic control units 汽车电控单元纤维增强塑料结构仿真工具链敏感参数研究

2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Pub Date : 2015-04-19 DOI: 10.1109/EUROSIME.2015.7103086

Rongsi Wang, D. Papathanassiou, M. Werner, Jing Jin

{"title":"Investigation of sensitive parameters in the structural simulation tool chain for fiber reinforced plastics in automotive electronic control units","authors":"Rongsi Wang, D. Papathanassiou, M. Werner, Jing Jin","doi":"10.1109/EUROSIME.2015.7103086","DOIUrl":"https://doi.org/10.1109/EUROSIME.2015.7103086","url":null,"abstract":"In automotive electronic control units (ECU) the use of fiber reinforced plastics is widely spread. In contrast to the common utilization of these materials their influence on the reliability of electronic or interconnecting components on Printed Circuit Board (PCB) is not yet sufficiently accounted for in design decisions in early stages of the product development. Fiber reinforced plastic parts exhibit a strong anisotropic macroscopic material behavior. Their deformation under thermal and mechanical load cannot be correctly predicted by simulation if oversimplified material properties are applied. However, this deformation behavior can dominate the strain and stress induced in electronic or interconnecting components on PCB and hence their reliability over lifetime. By means of an integrative simulation approach the influence of the microscopic fiber orientation on the macroscopic behavior of plastic parts can be evaluated. In this paper a study of sensitive parameters of the integrative simulation and their influence on the simulation quality and accuracy is presented. For this purpose test specimen have been cut from an ECU cover which is made of reinforced polybutylene terephthalate with 30 wt% short glass fiber (PBT-GF30). Subsequently, uni-axial, quasi-static tensile tests as well as structural finite element (FE) simulations, comparable to the experiments and including the mapping of fiber orientation information from injection molding simulation were performed.","PeriodicalId":250897,"journal":{"name":"2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","volume":"28 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-04-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134052432","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Reliability study on SMD components on an organic substrate with a thick copper core for power electronics applications 电力电子应用中厚铜芯有机基板上贴片元件的可靠性研究

2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Pub Date : 2015-04-19 DOI: 10.1109/EUROSIME.2015.7103160

K. Meier, M. Roellig, K. Bock

{"title":"Reliability study on SMD components on an organic substrate with a thick copper core for power electronics applications","authors":"K. Meier, M. Roellig, K. Bock","doi":"10.1109/EUROSIME.2015.7103160","DOIUrl":"https://doi.org/10.1109/EUROSIME.2015.7103160","url":null,"abstract":"In this work we present the results on a reliability study on SMD components mounted on an organic power electronics substrate. The substrate technology has been developed to meet the needs of high ampacity and thermal conductivity with an organic substrate material. Therefore a thick structured copper core was introduced throughout the entire substrate size (see fig. 1). On top of the copper core common FR4 multilayer structures are realised to create a typical SMD PCB surface. The bottom of the copper core was covered with one prepreg with a high thermal conductivity and one copper layer to be able to connect to a heat sink. The copper core becomes structured to enable the use as the layer for conducting high currents. Therefore insulation trenches were manufactured and plugged with a polymer. Introducing a copper core as described changes the thermo-mechanical behaviour of the substrate. Hence, due to the higher stiffness of the copper core PCB, the thermo-mechanical reliability of SMD components can be affected as well. Thermal cycling and shock tests were conducted to reveal the life time of ceramic chip resistors with a size of 0603, 0805 and 1206 in the case of mounting position entirely over the copper core or FR4, over the copper core/FR4 interface or over the copper core insulation trenches (see fig. 2). A specific test board was designed and manufactured (see fig. 3). The achieved results indicate some differences in the reliability of the components depending on the mounting position. In case of component mounting over the copper much higher failure counts have been seen compared to components mounted over FR4 (see fig. 4). Mounting the components on top of the copper core/FR4 interface or insulation trenches changes the reliability in dependence of the component size.","PeriodicalId":250897,"journal":{"name":"2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","volume":"33 8 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-04-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125716436","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 4

Fracture mechanics of thin film systems on the sub-micron scale 亚微米尺度下薄膜系统的断裂力学

2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Pub Date : 2015-04-19 DOI: 10.1109/EUROSIME.2015.7103088

D. Kozic, R. Treml, R. Schongrundner, R. Brunner, D. Kiener, J. Zechner, T. Antretter, Hans-Peter Ganser

{"title":"Fracture mechanics of thin film systems on the sub-micron scale","authors":"D. Kozic, R. Treml, R. Schongrundner, R. Brunner, D. Kiener, J. Zechner, T. Antretter, Hans-Peter Ganser","doi":"10.1109/EUROSIME.2015.7103088","DOIUrl":"https://doi.org/10.1109/EUROSIME.2015.7103088","url":null,"abstract":"Novel design of microelectronic components creates new issues concerning their reliability. Internal mechanical loading, e.g. from residual stresses, or external loading when the component is assembled into a microelectronic device, can cause failure via cracking or delamination. In this work, finite element simulations of micro-beam bending experiments for testing the fracture behavior of thin film metal composites deposited on a silicon substrate are presented. Due to the lattice mismatch between the materials, residual stresses are generated. Calculating the magnitude and distribution of these stresses is very important, as they add to the stresses produced by the external loads. Consequently, a stress free setting will behave differently compared to a structure with residual stresses. Additionally, crack propagation is affected by an interface to a material with different characteristics. In what follows, the variation of typical fracture parameters will be shown, depending on the residual stresses in the composite and on the crack position relative to the interface.","PeriodicalId":250897,"journal":{"name":"2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","volume":"45 13 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-04-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131419874","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2