B. Vandevelde, F. Zanon, A. Griffoni, Xiaolong Li, G. Willems, M. Meneghini
{"title":"焊接接头倾斜对led基PCB组件可靠性的影响:实验与有限元分析相结合","authors":"B. Vandevelde, F. Zanon, A. Griffoni, Xiaolong Li, G. Willems, M. Meneghini","doi":"10.1109/EUROSIME.2015.7103170","DOIUrl":null,"url":null,"abstract":"The impact of solder-joint tilting on the reliability of high-power LEDs soldered on PCBs is investigated by means of FEM simulations correlated with thermal cycling experiments. A non-uniform solder joint stand-off height is implemented into the FEM and, using crack propagation modelling approach, the number of cycles to complete fracture are predicted.","PeriodicalId":250897,"journal":{"name":"2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","volume":"31 3 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2015-04-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Impact of solder-joint tilting on the reliability of LED-based PCB assemblies: A combined experimental and FEM analysis\",\"authors\":\"B. Vandevelde, F. Zanon, A. Griffoni, Xiaolong Li, G. Willems, M. Meneghini\",\"doi\":\"10.1109/EUROSIME.2015.7103170\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The impact of solder-joint tilting on the reliability of high-power LEDs soldered on PCBs is investigated by means of FEM simulations correlated with thermal cycling experiments. A non-uniform solder joint stand-off height is implemented into the FEM and, using crack propagation modelling approach, the number of cycles to complete fracture are predicted.\",\"PeriodicalId\":250897,\"journal\":{\"name\":\"2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems\",\"volume\":\"31 3 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2015-04-19\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EUROSIME.2015.7103170\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EUROSIME.2015.7103170","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Impact of solder-joint tilting on the reliability of LED-based PCB assemblies: A combined experimental and FEM analysis
The impact of solder-joint tilting on the reliability of high-power LEDs soldered on PCBs is investigated by means of FEM simulations correlated with thermal cycling experiments. A non-uniform solder joint stand-off height is implemented into the FEM and, using crack propagation modelling approach, the number of cycles to complete fracture are predicted.
求助内容：
应助结果提醒方式：
京公网安备 11010802042870号
