2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems

2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems
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2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - 最新文献

Comparison of electrical, thermal, and optical characteristics of high-power LEDs operating in various spectral ranges: From UV to green

Pub Date : 2015-04-19 DOI: 10.1109/EUROSIME.2015.7103132 A. Chernyakov, A. L. Zakgeim, K. Bulashevich, S. Karpov

Mechanical characterization of sintered nanoparticles for advanced electrical and thermal joints: σ-ε-transformation in micro bending tests

Pub Date : 2015-04-19 DOI: 10.1109/EUROSIME.2015.7103150 U. Zschenderlein, Karthika Suresh, M. Baum, B. Wunderle

Electromigration modelling of void nucleation in open Cu-TSVs

Pub Date : 2015-04-19 DOI: 10.1109/EUROSIME.2015.7103100 M. Rovitto, W. Zisser, H. Ceric, T. Grasser
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