Modeling of LED solder joint cracking during temperature cycling with Finite Element

Abstract

In this study a new simulative and analytic method is developed to determine the failure of LED package solder joints at temperature cycling (TC). The solder joint reliability is calculated using a crack growth model, which is based on a combination of cohesive zone modeling and solder creep simulation in FE-model. The crack growth model is calibrated using shear test data after TC loading. The reliability model is validated by means of TC experimental results for three different TC conditions.