Impact of solder-joint tilting on the reliability of LED-based PCB assemblies: A combined experimental and FEM analysis

2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Pub Date : 2015-04-19 DOI:10.1109/EUROSIME.2015.7103170

B. Vandevelde, F. Zanon, A. Griffoni, Xiaolong Li, G. Willems, M. Meneghini

引用次数: 2

Abstract

The impact of solder-joint tilting on the reliability of high-power LEDs soldered on PCBs is investigated by means of FEM simulations correlated with thermal cycling experiments. A non-uniform solder joint stand-off height is implemented into the FEM and, using crack propagation modelling approach, the number of cycles to complete fracture are predicted.

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焊接接头倾斜对led基PCB组件可靠性的影响:实验与有限元分析相结合

采用有限元模拟和热循环实验相结合的方法，研究了焊点倾斜对大功率led焊接可靠性的影响。将非均匀焊点隔离高度引入有限元分析，并利用裂纹扩展建模方法，预测完成断裂的循环次数。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems

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