Manufacturing LEDs for Lighting and Display最新文献

Comparison of different LED Packages 不同LED封装的比较

Manufacturing LEDs for Lighting and Display Pub Date : 2007-09-26 DOI: 10.1117/12.758944

H. Dieker, C. Miesner, D. Püttjer, B. Bachl

{"title":"Comparison of different LED Packages","authors":"H. Dieker, C. Miesner, D. Püttjer, B. Bachl","doi":"10.1117/12.758944","DOIUrl":"https://doi.org/10.1117/12.758944","url":null,"abstract":"In this paper different technologies for LED packaging are compared, focusing on Chip on Board (COB) and SMD technology. The package technology which is used depends on the LED application. A critical fact in LED technology is the thermal management, especially for high brightness LED applications because the thermal management is important for reliability, lifetime and electrooptical performance of the LED module. To design certain and long life LED applications knowledge of the heat flow from LEDs to the complete application is required. High sophisticated FEM simulations are indispensable for modern development of high power LED applications. We compare simulations of various substrate materials and packaging technologies simulated using FLOTHERM software. Thereby different substrates such as standard FR4, ceramic and metal core printed circuit boards are considered. For the verification of the simulated results and the testing of manufactured modules, advanced measurement tools are required. We show different ways to experimentally characterize the thermal behavior of LED modules. The thermal path is determined by the transient thermal analysis using the MicReD T3Ster analyzer. Afterwards it will be compared to the conventional method using thermocouples. The heat distribution over the module is investigated by an IR-Camera. We demonstrate and compare simulation and measurement results of Chip-on-Board (COB) and Sub-Mounted Devices (SMD) technology. The results reveal that for different applications certain packages are ideal.","PeriodicalId":245823,"journal":{"name":"Manufacturing LEDs for Lighting and Display","volume":"345 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-09-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134234487","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 21

Enhanced efficiency of near-UV emitting LEDs for solid state lighting applications 提高近紫外发光led在固态照明应用中的效率

Manufacturing LEDs for Lighting and Display Pub Date : 2007-09-26 DOI: 10.1117/12.758799

Dandan Zhu, B. Corbett, B. Roycroft, P. Maaskant, C. McAleese, M. Akhter, M. Kappers, C. Humphreys

引用次数: 0

A silicon wafer packaging solution for HB-LEDs 一种用于hb - led的硅晶圆封装解决方案

Manufacturing LEDs for Lighting and Display Pub Date : 2007-09-26 DOI: 10.1117/12.753085

Tom Murphy, S. Weichel, S. Isaacs, J. Kuhmann

引用次数: 3

Semiconductor nanowires for solid state lighting: simulation, epitaxy, integration, optical and electrical characterization 用于固态照明的半导体纳米线:模拟、外延、集成、光学和电学特性

Manufacturing LEDs for Lighting and Display Pub Date : 2007-09-25 DOI: 10.1117/12.768615

F. Levy, Y. Désières, P. Ferret, S. Fichet, S. Gidon, P. Gilet, P. Noel, I. Robin, E. Romain-Latu, M. Rosina, R. Songmuang, G. Feuillet, B. Daudin, A. Chelnokov

引用次数: 1

LED-driven backlights for automotive displays 用于汽车显示器的led驱动背光

Manufacturing LEDs for Lighting and Display Pub Date : 2007-09-25 DOI: 10.1117/12.776891

F. Strauch

{"title":"LED-driven backlights for automotive displays","authors":"F. Strauch","doi":"10.1117/12.776891","DOIUrl":"https://doi.org/10.1117/12.776891","url":null,"abstract":"As a light source the LED has some advantage over the traditionally used fluorescence tube such as longer life or lower space consumption. Consequently customers are asking for the LED lighting design in their products. We introduced in a company owned backlight the white LED technology. This step opens the possibility to have access to the components in the display market. Instead of having a finalized display product which needs to be integrated in the head unit of a car we assemble the backlight, the glass, own electronics and the housing. A major advantage of this concept is the better control of the heat flow generated by the LEDs to the outer side because only a common housing is used for all the components. Also the requirement for slim products can be fulfilled. As always a new technology doesn't come with advantages only. An LED represents a point source compared to the well-known tube thus requiring a mixing zone for the multiple point sources when they enter a light guide. This zone can't be used in displays because of the lack of homogeneity. It's a design goal to minimize this zone which can be helped by the right choice of the LED in terms of slimness. A step ahead is the implementation of RGB LEDs because of their higher color rendering abilities. This allows for the control of the chromaticity point under temperature change but as a drawback needs a larger mixing zone.","PeriodicalId":245823,"journal":{"name":"Manufacturing LEDs for Lighting and Display","volume":"13 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-09-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128665016","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Thermal analysis of wafer-level LED packages with multichips 多芯片晶圆级LED封装的热分析

Manufacturing LEDs for Lighting and Display Pub Date : 2007-09-25 DOI: 10.1117/12.758825

Jae-Wan Choi, Jeung-Mo Kang, Jae-Wook Kim, Jeong-Hyeon Choi, Du-Hyun Kim, Geun-ho Kim, Yong-Seon Song, Y. Won, Jeong‐Soo Lee

引用次数: 0

Issues and solutions: opportunities for European LED manufacturers 问题与解决方案:欧洲LED制造商的机遇

Manufacturing LEDs for Lighting and Display Pub Date : 2007-09-25 DOI: 10.1117/12.764903

T. Pearsall

引用次数: 1

Markets and technology needs for UHB-LEDs uhb - led的市场和技术需求

Manufacturing LEDs for Lighting and Display Pub Date : 2007-09-25 DOI: 10.1117/12.760009

P. Roussel

引用次数: 2

Optical and structural characteristics of high-performance InGaN/GaN multiple quantum well light-emitting diodes: effects of nano-structural features 高性能InGaN/GaN多量子阱发光二极管的光学和结构特性:纳米结构特征的影响

Manufacturing LEDs for Lighting and Display Pub Date : 2007-09-25 DOI: 10.1117/12.758980

Z. S. Lee, Z. C. Feng, H. Tsai, J. Yang, A. G. Li, L. C. Chen, K. H. Chen, Y. F. Chen, Ian T. Ferguson, W. Lu

{"title":"Optical and structural characteristics of high-performance InGaN/GaN multiple quantum well light-emitting diodes: effects of nano-structural features","authors":"Z. S. Lee, Z. C. Feng, H. Tsai, J. Yang, A. G. Li, L. C. Chen, K. H. Chen, Y. F. Chen, Ian T. Ferguson, W. Lu","doi":"10.1117/12.758980","DOIUrl":"https://doi.org/10.1117/12.758980","url":null,"abstract":"Optical and structural properties of InGaN/GaN multi-quantum well (MQW) structures with different well width, influenced by the nano-structural features in the MQWs, were investigated by optical measurements of photoluminescence (PL), photoluminescence excitation (PLE) and time-resolved photoluminescence (TRPL), as well as structural analysis methods, such as high-resolution X-ray diffraction (HRXRD) and high-resolution transmission electron microscopy (HRTEM) measurements. Due to the quantum confined Stark effect (QCSE), larger Stokes shift is induced with larger well width. Thermally activated carrier screening model is established to well describe the so-called S-shaped spectral shift with temperature. Inhomogeneous line-width broadening induced by piezoelectric field is found to be dominant at low temperature, while homogeneous line-width broadening due to phonon scattering takes over at higher temperature. Additionally, two activation energies are extracted from the Arrhenius plot of PL intensity. One is assigned to be the exciton binding energy and the other one the confinement energy of electrons in the quantum well. TRPL study further indicated that the radiative lifetime was decreased with the decreased well width. All these are associated with the In-composition fluctuation and nano-structures in the MQWs.","PeriodicalId":245823,"journal":{"name":"Manufacturing LEDs for Lighting and Display","volume":"39 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-09-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128058909","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

GaInN LEDs: straight way for solid state lighting GaInN led:固态照明的直接方式

Manufacturing LEDs for Lighting and Display Pub Date : 2007-09-25 DOI: 10.1117/12.759472

U. Zehnder, B. Hahn, J. Baur, M. Peter, S. Bader, H. Lugauer, A. Weimar

引用次数: 7